초록 ▼

An integrated circuit heat transfer element (6,30) is made by selecting thermally conductive fibers having aspect ratios of length to diameter of more than 1, selecting a resin and combining the fibers and the resin to create a formable resin/fiber compound. The resin/fiber compound is formed into a

An integrated circuit heat transfer element (6,30) is made by selecting thermally conductive fibers having aspect ratios of length to diameter of more than 1, selecting a resin and combining the fibers and the resin to create a formable resin/fiber compound. The resin/fiber compound is formed into a composite material in part by applying pressure to the formable resin/fiber compound, which aligns the fibers, and when cured creates a thermally anisotropic composite material to maximize heat conduction along the aligned fibers. The thermally anisotropic composite material has a coefficient of thermal expansion (CTE) of less than about 10.times.10.sup.-6 cm/cm/.degree. C. The composite material has a thermal conductivity in the direction of the carbon fibers of at least 50 W/m.degree. K. The IC device is preferably secured to the heat transfer element using a thermally conductive adhesive.

대표청구항 ▼

[ What is claimed is:] [1.] A method of making a heat transfer element for an integrated circuit device comprising the following steps:selecting thermally conductive fibers of which at least 30% have aspect ratios of length to diameter of more than 1;selecting a resin;combining said fibers with said

[ What is claimed is:] [1.] A method of making a heat transfer element for an integrated circuit device comprising the following steps:selecting thermally conductive fibers of which at least 30% have aspect ratios of length to diameter of more than 1;selecting a resin;combining said fibers with said resin to create a formable resin/fiber compound; andforming said resin/fiber compound into a composite material, the forming step including the step of:generally aligning said fiber in a chosen direction by applying pressure to said resin/fiber compound to create a thermally anisotropic composite material so to maximize heat conduction along said chosen direction.