초록 ▼

A structure and a process for forming an improved bonding pad which allows better bonding between a bond wire and a metal bonding pad. Stripes are formed on a substrate. A conformal dielectric layer, a conformal barrier layer and a metal layer are formed over the stripes. A passivation layer with a

A structure and a process for forming an improved bonding pad which allows better bonding between a bond wire and a metal bonding pad. Stripes are formed on a substrate. A conformal dielectric layer, a conformal barrier layer and a metal layer are formed over the stripes. A passivation layer with a window is formed defining a bonding pad area. The stripes promote an irregular surface in the barrier and metal layers which reduce stress between the dielectric layer, the barrier layer and the metal layer. Also, the irregular surfaces increase the barrier metal adhesion to the dielectric layer, reduce bond pad peel off, and increase bonding yields.

대표청구항 ▼

[ What is claimed is:] [1.] A method of forming an improved bonding pad in a bonding pad area on a substrate, the steps comprising:forming broken stripes on a substrate in a pattern in at least said bonding pad area forming an irregular top surface configuration,forming a conformal dielectric layer

[ What is claimed is:] [1.] A method of forming an improved bonding pad in a bonding pad area on a substrate, the steps comprising:forming broken stripes on a substrate in a pattern in at least said bonding pad area forming an irregular top surface configuration,forming a conformal dielectric layer over said broken stripes in at least said bonding pad area thereby propagating said irregular top surface configuration and said pattern in said conformal dielectric layer,forming a conformal barrier layer over said dielectric layer whereby said underlying irregular top surface configuration and pattern are propagated in said barrier layer surface,depositing a metal layer over said barrier layer,forming a passivation layer over said metal layer, andforming a window in said passivation layer over said bonding pad area.