$\require{mediawiki-texvc}$
  • 검색어에 아래의 연산자를 사용하시면 더 정확한 검색결과를 얻을 수 있습니다.
  • 검색연산자
검색연산자 기능 검색시 예
() 우선순위가 가장 높은 연산자 예1) (나노 (기계 | machine))
공백 두 개의 검색어(식)을 모두 포함하고 있는 문서 검색 예1) (나노 기계)
예2) 나노 장영실
| 두 개의 검색어(식) 중 하나 이상 포함하고 있는 문서 검색 예1) (줄기세포 | 면역)
예2) 줄기세포 | 장영실
! NOT 이후에 있는 검색어가 포함된 문서는 제외 예1) (황금 !백금)
예2) !image
* 검색어의 *란에 0개 이상의 임의의 문자가 포함된 문서 검색 예) semi*
"" 따옴표 내의 구문과 완전히 일치하는 문서만 검색 예) "Transform and Quantization"

특허 상세정보

Self-regulating fluid dispensing cap with safety pressure relief valve for dental/medical unit fluid bottles

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B65D-083/14   
미국특허분류(USC) 222/396 ; 222/400.7 ; 137/212
출원번호 US-0795218 (1997-02-05)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Dulin
인용정보 피인용 횟수 : 102  인용 특허 : 2
초록

Unitary, self-regulating fluid dispensing cap for a dental unit water line treatment system having both a regulator valve and a relief valve located therein, and threads to receive a fluid bottle. The cap receives unregulated high pressure air of 50-80 psi and controls and reduces the pressure to about 30-35 psi with the adjustable regulator valve. The relief valve prevents the fluid bottle from bursting if over pressure of above about 35 psi, or other selected value, builds up in the bottle.

대표
청구항

[ I claim:] [1.] A cap for a water line treatment system comprising in operative combination:(a) a generally cylindrical cap body having a recess in one end and threads in said recess for receiving engaging a fluid bottle for supply of fluid to said water line;(b) said cap including a regulator valve and a relief valve disposed in bores therein;(c) said cap including a high pressure air inlet bore to said regulator valve and a low pressure bore leading from said regulator valve into communication with a headspace volume in said bottle; and(d) said relief...

이 특허를 인용한 특허 피인용횟수: 102

  1. Ootsuka, Fumio. 3D stacked multilayer semiconductor memory using doped select transistor channel. USP20181010090316.
  2. Marquardt, David; Shugrue, John. Apparatus and method for calculating a wafer position in a processing chamber under process conditions. USP2015089117866.
  3. Thomas Gagliano. Apparatus and method for controlling fluid delivery temperature in a dispensing apparatus. USP2002036360556.
  4. Oosterlaken, Theodorus; de Ridder, Chris; Jdira, Lucian. Apparatus and method for manufacturing a semiconductor device. USP20181010103040.
  5. Kamiya, Tatsuo. Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum. USP2017019543180.
  6. den Hartog Besselink, Edwin; Garssen, Adriaan; Dirkmaat, Marco. Cassette holder assembly for a substrate cassette and holding member for use in such assembly. USP20190410249524.
  7. Halpin, Michael; Shero, Eric; White, Carl; Alokozai, Fred; Winkler, Jerry; Dunn, Todd. Chamber sealing member. USP2016059340874.
  8. Halpin, Michael; Shero, Eric; White, Carl; Alokozai, Fred; Winkler, Jerry; Dunn, Todd. Chamber sealing member. USP2015049005539.
  9. Bunce, Philip. Chest drainage systems. USP2005046881204.
  10. Pinedjian, Raffi S.; Gagliano, Thomas; Carlson, Kevin J.. Comestible fluid dispensing apparatus and method. USP2004026695168.
  11. Zaitsu, Masaru; Fukazawa, Atsuki; Fukuda, Hideaki. Continuous process incorporating atomic layer etching. USP2017049627221.
  12. Chang, Hung-Shen; Jiang, Yueh-Jen Chen. Control valve device of a pressure tank. USP2003066575193.
  13. Varnes, DeWayne L.. Dental handpiece fluid supply technology. USP2012028123522.
  14. Hanson Richard W.. Dental rinse bottle with quick connect. USP2001086279782.
  15. Raisanen, Petri; Shero, Eric; Haukka, Suvi; Milligan, Robert Brennan; Givens, Michael Eugene. Deposition of metal borides. USP20181010087522.
  16. Zhu, Chiyu; Shrestha, Kiran; Haukka, Suvi. Deposition of metal borides. USP20190110190213.
  17. Yednak, III, Andrew M.; Dunn, Todd; White, Carl; Manasco, Michael. Deposition valve assembly and method of heating the same. USP2015089096931.
  18. Koch Guido,DEX. Device for supplying medical instruments with a fluid in particular with a rinsing fluid. USP2001036202898.
  19. Yuen Kaye Kit-Han ; Murphy ; III Oliver. Dispensing system bung cup. USP200005D424167.
  20. Milligan, Robert Brennan. Formation of boron-doped titanium metal films with high work function. USP20180910083836.
  21. Hawkins, Mark; Halleck, Bradley Leonard; Kirschenheiter, Tom; Hossa, Benjamin; Pottebaum, Clay; Miskys, Claudio. Gas distribution system, reactor including the system, and methods of using the same. USP20190110167557.
  22. Thomas Gagliano. Hand-held rapid dispensing apparatus and method. USP2002036354342.
  23. Yednak, III, Andrew M.; Pettinger, Jr., Frederick L.. Heater jacket for a fluid line. USP2016059341296.
  24. Dalton, Jeffrey Travis; Reeves, Kim; McCarthy, Joseph K.; Costle, Carey. Keg coupler with secondary pressure regulator and systems using same. USP2017119828227.
  25. Shugrue, John; Moen, Ron. Lockout tagout for semiconductor vacuum valve. USP2016089404587.
  26. Hubert, Mosslang; Gebhard, Wiest; Georg, Wenger; Jorg, Eberle. Medical or dental-medical apparatus having a delivery line for a liquid. USP2003096626668.
  27. Jung, Sung-Hoon. Metal oxide protective layer for a semiconductor device. USP2016079384987.
  28. Jung, Sung-Hoon. Metal oxide protective layer for a semiconductor device. USP2015028946830.
  29. Pore, Viljami. Method and apparatus for filling a gap. USP20190110177025.
  30. Pore, Viljami; Knaepen, Werner; Jongbloed, Bert; Pierreux, Dieter; Van Aerde, Steven R. A.; Haukka, Suvi; Fukuzawa, Atsuki; Fukuda, Hideaki. Method and apparatus for filling a gap. USP2017119812320.
  31. Pore, Viljami; Knaepen, Werner; Jongbloed, Bert; Pierreux, Dieter; Van Der Star, Gido; Suzuki, Toshiya. Method and apparatus for filling a gap. USP2018029887082.
  32. Tolle, John; Hill, Eric; Winkler, Jereld Lee. Method and system for in situ formation of gas-phase compounds. USP2018029890456.
  33. Jung, Sung-Hoon; Raisanen, Petri; Liu, Eric Jen Cheng; Schmotzer, Mike. Method and system to reduce outgassing in a reaction chamber. USP2017109790595.
  34. Jung, Sung-Hoon; Raisanen, Petri; Liu, Eric Jen Cheng; Schmotzer, Mike. Method and system to reduce outgassing in a reaction chamber. USP2015038993054.
  35. Winkler, Jereld Lee. Method and systems for in-situ formation of intermediate reactive species. USP2017039589770.
  36. Suemori, Hidemi. Method for depositing dielectric film in trenches by PEALD. USP2018039909214.
  37. Kang, DongSeok. Method for depositing thin film. USP2018029891521.
  38. Takamure, Noboru; Okabe, Tatsuhiro. Method for forming Ti-containing film by PEALD using TDMAT or TDEAT. USP2017019556516.
  39. Shiba, Eiichiro. Method for forming aluminum nitride-based film by PEALD. USP2017079711345.
  40. Winkler, Jereld Lee. Method for forming conformal carbon films, structures conformal carbon film, and system of forming same. USP2017039605343.
  41. Fukazawa, Atsuki. Method for forming conformal nitrided, oxidized, or carbonized dielectric film by atomic layer deposition. USP20190110179947.
  42. Fukazawa, Atsuki; Fukuda, Hideaki; Takamure, Noboru; Zaitsu, Masaru. Method for forming dielectric film in trenches by PEALD using H-containing gas. USP2016099455138.
  43. Kimura, Yosuke; de Roest, David. Method for forming film having low resistance and shallow junction depth. USP2016109478415.
  44. Ishikawa, Dai; Fukazawa, Atsuki. Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches. USP2017099754779.
  45. Namba, Kunitoshi. Method for forming silicon oxide cap layer for solid state diffusion process. USP2017039607837.
  46. Shiba, Eiichiro. Method for performing uniform processing in gas system-sharing multiple reaction chambers. USP2016099447498.
  47. Yamagishi, Takayuki; Suwada, Masaei; Tanaka, Hiroyuki. Method for positioning wafers in multiple wafer transport. USP2017109793148.
  48. Kato, Richika; Nakano, Ryu. Method for protecting layer by forming hydrocarbon-based extremely thin film. USP20180810043661.
  49. Kato, Richika; Okuro, Seiji; Namba, Kunitoshi; Nonaka, Yuya; Nakano, Akinori. Method for protecting layer by forming hydrocarbon-based extremely thin film. USP2018029899291.
  50. Haukka, Suvi; Shero, Eric James; Alokozai, Fred; Li, Dong; Winkler, Jereld Lee; Chen, Xichong. Method for treatment of deposition reactor. USP2016019228259.
  51. Zaitsu, Masaru. Method of atomic layer etching using functional group-containing fluorocarbon. USP2017089735024.
  52. Zaitsu, Masaru; Kobayashi, Nobuyoshi; Kobayashi, Akiko; Hori, Masaru; Kondo, Hiroki; Tsutsumi, Takayoshi. Method of cyclic dry etching using etchant film. USP2017109793135.
  53. Knaepen, Werner; Maes, Jan Willem; Jongbloed, Bert; Kachel, Krzysztof Kamil; Pierreux, Dieter; De Roest, David Kurt. Method of forming a structure on a substrate. USP2018039916980.
  54. Lee, Choong Man; Yoo, Yong Min; Kim, Young Jae; Chun, Seung Ju; Kim, Sun Ja. Method of forming metal interconnection and method of fabricating semiconductor apparatus using the method. USP20190410249577.
  55. Chun, Seung Ju; Yoo, Yong Min; Choi, Jong Wan; Kim, Young Jae; Kim, Sun Ja; Lim, Wan Gyu; Min, Yoon Ki; Lee, Hae Jin; Yoo, Tae Hee. Method of processing a substrate and a device manufactured by using the method. USP20181110134757.
  56. Kohen, David; Profijt, Harald Benjamin. Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures. USP20190310236177.
  57. Raisanen, Petri; Givens, Michael Eugene. Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures. USP20190310229833.
  58. Tolle, John. Methods of forming films including germanium tin and structures and devices including the films. USP2016079396934.
  59. Margetis, Joe; Tolle, John. Methods of forming highly p-type doped germanium tin films and structures and devices including the films. USP2017059647114.
  60. Margetis, Joe; Tolle, John. Methods of forming silicon germanium tin films and structures and devices including the films. USP2018029905420.
  61. Winkler, Jereld Lee; Shero, Eric James; Alokozai, Fred. Multi-step method and apparatus for etching compounds containing a metal. USP2014118894870.
  62. Zhu, Chiyu; Asikainen, Timo; Milligan, Robert Brennan. NbMC layers. USP20190210211308.
  63. Milligan, Robert Brennan; Alokozai, Fred. Phase-stabilized thin films, structures and devices including the thin films, and methods of forming same. USP2015059029253.
  64. Fondurulia, Kyle; Shero, Eric; Verghese, Mohith E.; White, Carl L.. Precursor delivery system. USP2017039593416.
  65. Fondurulia, Kyle; Shero, Eric; Verghese, Mohith E.; White, Carl L.. Precursor delivery system. USP2015038986456.
  66. Fondurulia, Kyle; Shero, Eric; Verghese, Mohith E; White, Carl L. Precursor delivery system. USP2012038137462.
  67. Pettinger, Fred; White, Carl; Marquardt, Dave; Ibrani, Sokol; Shero, Eric; Dunn, Todd; Fondurulia, Kyle; Halpin, Mike. Process feed management for semiconductor substrate processing. USP2015049017481.
  68. Pettinger, Fred; White, Carl; Marquardt, Dave; Ibrani, Sokol; Shero, Eric; Dunn, Todd; Fondurulia, Kyle; Halpin, Mike. Process feed management for semiconductor substrate processing. USP2018029892908.
  69. Margetis, Joe; Tolle, John; Bartlett, Gregory; Bhargava, Nupur. Process for forming a film on a substrate using multi-port injection assemblies. USP20190410262859.
  70. Alokozai, Fred; Milligan, Robert Brennan. Process gas management for an inductively-coupled plasma deposition reactor. USP2017039605342.
  71. Alokozai, Fred; Milligan, Robert Brennan. Process gas management for an inductively-coupled plasma deposition reactor. USP20180710023960.
  72. Alokozai, Fred; Milligan, Robert Brennan. Process gas management for an inductively-coupled plasma deposition reactor. USP2015059021985.
  73. Winkler, Jereld Lee. Pulsed remote plasma method and system. USP2016119484191.
  74. Shero, Eric; Halpin, Michael; Winkler, Jerry. Radiation shielding for a substrate holder. USP2015109167625.
  75. Michael Saveliev ; Thomas Gagliano. Rapid comestible fluid dispensing apparatus and method. USP2002036354341.
  76. Raffi S. Pinedjian ; Thomas Gagliano ; Kevin J. Carlson. Rapid comestible fluid dispensing apparatus and method employing a diffuser. USP2002096443335.
  77. Thomas Gagliano. Refrigeration apparatus and method for a fluid dispensing device. USP2002096449970.
  78. Zhu, Chiyu. Selective film deposition method to form air gaps. USP2018019859151.
  79. Kim, Young Jae; Choi, Seung Woo; Yoo, Yong Min. Semiconductor device and manufacturing method thereof. USP2018029899405.
  80. Raisanen, Petri; Givens, Michael; Verghese, Mohith. Semiconductor device dielectric interface layer. USP2015119177784.
  81. Raisanen, Petri; Givens, Michael; Verghese, Mohith. Semiconductor device dielectric interface layer. USP2014058728832.
  82. Shero, Eric; Verghese, Mohith E.; White, Carl L.; Terhorst, Herbert; Maurice, Dan. Semiconductor processing reactor and components thereof. USP2016079394608.
  83. Milligan, Robert Brennan; Alokozai, Fred. Semiconductor reaction chamber with plasma capabilities. USP2016089412564.
  84. Milligan, Robert Brennan; Alokozai, Fred. Semiconductor reaction chamber with plasma capabilities. USP2015049018111.
  85. Xie, Qi; Machkaoutsan, Vladimir; Maes, Jan Willem. Semiconductor structure and device and methods of forming same using selective epitaxial process. USP2016019240412.
  86. Arai, Izumi. Single-and dual-chamber module-attachable wafer-handling chamber. USP2017059640416.
  87. Xie, Qi; de Roest, David; Woodruff, Jacob; Givens, Michael Eugene; Maes, Jan Willem; Blanquart, Timothee. Source/drain performance through conformal solid state doping. USP20180710032628.
  88. Weeks, Keith Doran. Structures and devices including a tensile-stressed silicon arsenic layer and methods of forming same. USP2016049324811.
  89. Tolle, John. Structures and devices including germanium-tin films and methods of forming same. USP2017109793115.
  90. Jeong, Sang Jin; Han, Jeung Hoon; Choi, Young Seok; Park, Ju Hyuk. Susceptor for semiconductor substrate processing apparatus. USP201810D830981.
  91. Dunn, Todd; Alokozai, Fred; Winkler, Jerry; Halpin, Michael. Susceptor heater and method of heating a substrate. USP2015018933375.
  92. Dunn, Todd; Alokozai, Fred; Winkler, Jerry; Halpin, Michael. Susceptor heater and method of heating a substrate. USP2016039299595.
  93. Dunn, Todd; White, Carl; Halpin, Michael; Shero, Eric; Winkler, Jerry. Susceptor heater shim. USP2015129202727.
  94. Tang, Fu; Givens, Michael Eugene; Xie, Qi; Raisanen, Petri. System and method for gas-phase sulfur passivation of a semiconductor surface. USP2017019558931.
  95. Lawson, Keith R.; Givens, Michael E.. Systems and methods for dynamic semiconductor process scheduling. USP2017059659799.
  96. Sarin, Michael Christopher; Mendez, Rafael; Bartlett, Gregory M.; Hill, Eric; Lawson, Keith R.; Rosser, Andy. Systems and methods for mass flow controller verification. USP2015109169975.
  97. Raisanen, Petri; Sung-hoon, Jung; Mohith, Verghese. Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species. USP2014088802201.
  98. Shero, Eric J.; Raisanen, Petri I.; Jung, Sung-Hoon; Wang, Chang-Gong. Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species. USP2014118877655.
  99. Shero, Eric; Raisanen, Petri I.; Jung, Sung Hoon; Wang, Chang-Gong. Systems and methods for thin-film deposition of metal oxides using excited nitrogen—oxygen species. USP2014118883270.
  100. Coomer, Stephen Dale. Variable adjustment for precise matching of multiple chamber cavity housings. USP2018059960072.
  101. Shugrue, John Kevin. Variable conductance gas distribution apparatus and method. USP2017059657845.
  102. Schmotzer, Michael; Whaley, Shawn. Variable gap hard stop design. USP20181010087525.