[특허]Apparatus for placing and aligning solder balls onto solder pads on a substrate for manufacturing IC devices

Apparatus for placing and aligning solder balls onto solder pads on a substrate for manufacturing IC devices 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B23K-003/06 H01L-021/60
출원번호	US-0816504 (1997-03-13)
발명자 / 주소	Teng Kun-Tang,TWX
출원인 / 주소	Industrial Technology Research Institute, TWX
대리인 / 주소	Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
인용정보	피인용 횟수 : 36 인용 특허 : 0

초록 ▼

A solder ball placement and alignment apparatus for placing and aligning a plurality of solder balls onto solder pads on a multi-chip substrate includes a placement tray and a base seat. The placement tray includes a solder ball gate, means for controlling movement of the gate, a plurality of placement through holes that correspond to the solder pads on the substrate, and a plurality of alignment cavities disposed on the underside of the placement tray. The solder ball gate is slidably mounted to the placement tray and, when the gate is at a first position, an opening in the placement tray is uncovered thereby permitting solder balls to be removed when the placement and alignment apparatus is tilted toward the direction of the opening. When the gate is at a second position, the opening of the placement tray is covered. The movement of the gate is controlled by an electromagnet and associated control circuit means or a mechanical device.

대표청구항 ▼

[ What is claimed is:] [1.] A solder ball placement and alignment apparatus for placing and aligning a plurality of solder balls onto a plurality of solder pads on a multi-chip substrate, comprising:a placement tray having a plurality of alignment cavities disposed on an underside thereof, having a plurality of placement through holes, each corresponding to one of said plurality of solder pads and each being larger than the diameter of said solder balls, and having a solder ball gate, said solder ball gate covering an opening in said placement tray in a second position and uncovering said opening in a first position;means associated with said placement tray for controlling movement of said solder ball gate; anda base seat for positioning beneath the multi-chip substrate with the substrate positioned between said base seat and said placement tray, said base seat having a plurality of alignment pins corresponding to said alignment cavities.

이 특허를 인용한 특허 (36)

Sakaguchi, Hideaki; Iida, Kiyoaki, Apparatus and method of mounting conductive ball.
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Cheng, Chi Wah; Chong, Ping Chun; Chan, Chi Fung; Chan, Chin Pang, Apparatus and method of placing solder balls onto a substrate.
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Teruaki Kasai JP; Shinji Sasaguri JP; Kenichi Takakura JP; Tadahiko Sakai JP; Kazuo Arikado JP, Apparatus and method of transferring conductive balls and apparatus and method of supplying conductive balls.
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Nakajima Kiyonori,JPX ; Fujimori Yoshiharu,JPX, Apparatus and process for mounting conductor balls on terminal pads of semiconductor devices.
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Song,Kong Lam; Choe,Peng Cheong; Medina,Tic, Automated ball mounting process and system with solder ball testing.
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Song,Kong Lam; Choe,Peng Cheong; Medina,Tic, Automated ball mounting process with solder ball testing.
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Downes ; Jr. Francis J. ; Japp Robert M. ; Pierson Mark V., Chip C4 assembly improvement using magnetic force and adhesive.
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Vongfuangfoo Sutee ; Vuong Minh ; Bacher Brent R., Integrated circuit packaging apparatus and method.
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Fan Kuang-Shu,TWX, Integrated circuit solder ball implant machine.
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Alan G. Wood ; Salman Akram ; Mike Hess ; David R. Hembree, Method and apparatus for aligning and attaching balls to a substrate.
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Cheng Chi Wah,HKX ; Yue Alfred Ka On,HKX ; Wong Chiu Fai,HKX, Method and apparatus for ball placement.
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Takumi Yamamoto JP; Kazuhiko Futakami JP; Akira Hatase JP; Nobuaki Takahashi JP; Naoji Senba JP; Yuzo Shimada JP, Method and apparatus for lining up micro-balls.
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Bishop, Jeffrey C., Method and apparatus for masking a portion of a component.
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Hertz Eric, Method and apparatus for placing conductive preforms.
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Freeman, Gary; Nowak, Jr., Thomas; Purcell, Thomas; Mirabito, A. Jason; Sullivan, Thomas M.; Foulke, Richard F.; Foulke, Jr., Richard F.; Ohlenbusch, Cord W., Method and apparatus for placing solder balls on a substrate.
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Nikmanesh Khalil N., Method and apparatus for precisely registering solder paste in a printed circuit board repair operation.
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Hertz Eric L., Method and apparatus using colored foils for placing conductive preforms.
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Ball Michael, Method and system for forming contacts on a semiconductor component by aligning and attaching ferromagnetic balls.
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Inoue Kosuke,JPX ; Nishimura Asao,JPX ; Suzuki Takamichi,JPX ; Fujii Teru,JPX ; Morishima Masayuki,JPX ; Nakajima Yasuyuki,JPX ; Oroku Noriyuki,JPX, Method of forming bumps.
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Inoue, Kosuke; Nishimura, Asao; Suzuki, Takamichi; Fujii, Teru; Morishima, Masayuki; Nakajima, Yasuyuki; Oroku, Noriyuki, Method of forming bumps.
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Kosuke Inoue JP; Asao Nishimura JP; Takamichi Suzuki JP; Teru Fujii JP; Masayuki Morishima JP; Yasuyuki Nakajima JP; Noriyuki Oroku JP, Method of forming bumps.
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Rice,Michael R.; Bjorkman,Claes H.; Zhao,Jun; Collins,Kenneth S.; Miu,Thomas, Methods and apparatus for transferring conductive pieces during semiconductor device fabrication.
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Farnworth,Warren M.; Wood,Alan G., Methods of bonding solder balls to bond pads on a substrate.
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Farnworth, Warren M.; Wood, Alan G., Methods of bonding solder balls to bond pads on a substrate, and bonding frames.
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Farnworth, Warren M.; Wood, Alan G., Methods of bonding solder balls to bond pads on a substrate, and bonding frames.
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Farnworth, Warren M.; Wood, Alan G., Methods of bonding solder balls to bond pads on a substrate, and bonding frames.
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Farnworth, Warren M.; Wood, Alan G., Methods of bonding solder balls to bond pads on a substrate, and bonding frames.
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Jomaa,Houssam; Nalla,Ravi K.; Chase,H. Ryan, Microball placement solutions.
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Nobuaki Takahashi JP; Naoji Senba JP; Yuzo Shimada JP, Solder ball arrangement device.
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Takahashi Nobuaki,JPX ; Senba Naoji,JPX ; Shimada Yuzo,JPX, Solder ball arrangement device.
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Eli Razon ; Vaughn Svendsen ; Robert Kowtko ; Kyle Dury ; Krishnan Suresh, Solder ball delivery and reflow apparatus and method.
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Razon Eli ; Svendsen Vaughn ; Suresh Krishnan ; Kowtko Robert ; Dury Kyle, Solder ball delivery and reflow apparatus and method of using the same.
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Razon, Eli; Svendsen, Vaughn; Kowtko, Robert; Dury, Kyle; Suresh, Krishnan, Solder ball delivery and reflow method.
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Link, Joseph, Spacer plate solder ball placement fixture and methods therefor.
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Ball Michael, System for forming contacts on a semiconductor component by aligning and attaching ferromagnetic balls.
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Patel Dilip ; Miks Jeffrey A. ; Daniels Dwight L., Universal transport apparatus.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Apparatus for placing and aligning solder balls onto solder pads on a substrate for manufacturing IC devices 원문보기

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Apparatus for placing and aligning solder balls onto solder pads on a substrate for manufacturing IC devices 원문보기

초록 ▼

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연구과제 타임라인

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이 특허를 인용한 특허 (36)

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