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Liquid-cooled baffle series/parallel heat sink 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0815545 (1997-03-12)
발명자 / 주소
  • Visser Roy Alan
출원인 / 주소
  • Delco Electronics Corporation
대리인 / 주소
    Funke
인용정보 피인용 횟수 : 62  인용 특허 : 0

초록 ▼

A liquid-cooled heat-sink including a cooling housing defining a cooling chamber where the chamber is positioned adjacent to a semi-conductor device or devices to be cooled. An inlet port introduces a liquid coolant into the chamber and an exit port removes the liquid coolant from the chamber. A sin

대표청구항 ▼

[ The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:] [1.] A liquid-cooled heat sink comprising:a cooling housing including at least one chamber, said at least one chamber including at least one wall that is to be cooled;a fluid inlet port

이 특허를 인용한 특허 (62)

  1. Spokoiny, Michael; Kerner, James M.; Qiu, Xinliang; Lux, Craig J.; Maurus, James W., Airflow heat dissipation device.
    상세보기
  2. Cannon, Lonnie J.; Corbin, Jr., John Saunders; Gardell, David Lewis; Garza, Jose Arturo; Kutner, Jeffrey Frank; Larsen, Kenneth Carl; Mahaney, Jr., Howard Victor; Salazar, John Joseph, Apparatus for functional and stress testing of exposed chip land grid array devices.
    상세보기
  3. Jeter, Michael A; Mock, Roger A; Gerbsch, Erich W; Ronning, Jeffrey J.; Taylor, Ralph S.; Hayes, Andrew R., Automotive electronics heat exchanger.
    상세보기
  4. Zheng, Wanlie; Hayward, Larry Russell, Cold cranking simulator having hybrid heat transfer system.
    상세보기
  5. Rai, Rutunj; Brar, Parminder; Duco, Michael Scott; Pieknik, Jared, Cold plate having separable flow directing baffle.
    상세보기
  6. Radosevich, Lawrence D.; Meyer, Andreas A.; Beihoff, Bruce C.; Kannenberg, Daniel G., Compact fluid cooled power converter supporting multiple circuit boards.
    상세보기
  7. Meyer,Andreas A.; Radosevich,Lawrence D.; Beihoff,Bruce C.; Kehl,Dennis L.; Kannenberg,Daniel G., Compact vehicle drive module having improved thermal control.
    상세보기
  8. Beihoff, Bruce C.; Radosevich, Lawrence D.; Phillips, Mark G.; Kehl, Dennis L.; Kaishian, Steven C.; Kannenberg, Daniel G., Cooled electrical terminal assembly and device incorporating same.
    상세보기
  9. Beihoff,Bruce C.; Radosevich,Lawrence D.; Phillips,Mark G.; Kehl,Dennis L.; Kaishian,Steven C.; Kannenberg,Daniel G., Cooled electrical terminal assembly and device incorporating same.
    상세보기
  10. Ruthy,Michael C.; Seitz,Douglas W., Cooler plate and gearbox assembly.
    상세보기
  11. O'Neal Sean P. ; Liao Reynold L. ; Gilchrist Phillip C., Cooling apparatus for an electronic package.
    상세보기
  12. Olesen, Klaus Kristen; Paulsen, Lars; Klinghagen, Jens, Cooling device for a plurality of power modules.
    상세보기
  13. Nakahama, Takafumi, Cooling device for heat source.
    상세보기
  14. Tian, Yu; Jiang, Wenyan, Cooling mechanism used inside gimbal.
    상세보기
  15. Olesen,Klaus Kristen; Eisele,Ronald; Lauridsen,Steen, Cooling unit and flow distributing element for use in such unit.
    상세보기
  16. Beihoff,Bruce C.; Radosevich,Lawrence D.; Meyer,Andreas A.; Gollhardt,Neil; Kannenberg,Daniel G., Electrical power converter method and system employing multiple output converters.
    상세보기
  17. Beihoff,Bruce C.; Radosevich,Lawrence D.; Meyer,Andreas A.; Gollhardt,Neil; Kannenberg,Daniel G., Electrical power converter method and system employing multiple-output converters.
    상세보기
  18. Visser, Roy A., Electronic module having thermal cooling insert.
    상세보기
  19. Olesen, Klaus Kristen, Flow distributing unit and cooling unit.
    상세보기
  20. Olesen,Klaus Kristen, Flow distributing unit and cooling unit having bypass flow.
    상세보기
  21. Peugh, Darrel E.; Myers, Bruce A.; Oberlin, Gary E., Fluid cooled electronic assembly.
    상세보기
  22. Beihoff, Bruce C.; Radosevich, Lawrence D.; Meyer, Andreas A.; Gollhardt, Neil; Kannenberg, Daniel G., Fluid cooled vehicle drive module.
    상세보기
  23. Thomas F. Craft, Jr. ; Charles E. Johnson ; Steven J. Smith ; Dinh G. Lai ; Dianne S. Wolpensinger, Fluid flow management system.
    상세보기
  24. Wilson,Michael J.; Wert,Kevin L.; Wattelet,Jonathan; DeKeuster,Richard; Lightner,Donald, Forced fluid heat sink.
    상세보기
  25. Valenzuela, Javier A., Heat exchanger having winding micro-channels.
    상세보기
  26. Ritter, Allen M.; Black, Hugh David, Heat sink assembly.
    상세보기
  27. Ghosh,Debashis; Bhatti,Mohinder Singh; Reyzin,Ilya; Parisi,Mark Joseph, Heat sink for an electronic device.
    상세보기
  28. Schneider,Philip K., Heat sink for silicon thermopile.
    상세보기
  29. Gilliland,Don A., Heat sinks for dissipating a thermal load.
    상세보기
  30. Gilliland,Don A., Heat sinks for dissipating a thermal load.
    상세보기
  31. Wegener, Fritz; Eckert, Daniel; Buckl, Stephan; Janker, Andreas; Rechberger, Hans; Cap, Christoph; Göttl, Karl, Heater.
    상세보기
  32. Schreir-Alt, Thomas; Heumann, Katja; Kobilke, Siegmund; Kazempoor, Michel; Thimm, Alfred, Homogeneous liquid cooling of LED array.
    상세보기
  33. Bhatti,Mohinder Singh; Ghosh,Debashis; Joshi,Shrikant Mukund, Impingement cooled heat sink with uniformly spaced curved channels.
    상세보기
  34. James M. Nagashima ; Terence G. Ward ; Scott D. Downer, Integrated power electronics cooling housing.
    상세보기
  35. Joshi, Shailesh N.; Dede, Ercan Mehmet; Gaikwad, Mayur Prakash, Jet impingement coolers and power electronics modules comprising the same.
    상세보기
  36. Calaman, Douglas P.; Connors, Mathew J., Liquid cooled heat exchanger with enhanced flow.
    상세보기
  37. Calaman, Douglas P.; Connors, Matthew J., Liquid cooled heat exchanger with enhanced flow.
    상세보기
  38. Douglas P. Calaman ; Mathew J. Connors, Liquid-cooled heat sink with thermal jacket.
    상세보기
  39. Douglas P. Calaman ; Mathew J. Connors, Liquid-cooled heat sink with thermal jacket.
    상세보기
  40. Lindholm, Brian Eric; Pate, Paul Stephen; Ritter, Allen Michael, Method and apparatus for cooling electrical fuses.
    상세보기
  41. Gabriel, David Crist; Gokhale, Renuka Vikram, Method and arrangement for a controlling strategy for electronic components in a hybrid electric vehicle.
    상세보기
  42. Wang, Zhenshan; Pan, Kejia; Feng, Bin, Modular electronic device.
    상세보기
  43. Beihoff, Bruce C.; Radosevich, Lawrence D.; Meyer, Andreas A.; Gollhardt, Neil; Kannenberg, Daniel G., Modular power converter having fluid cooled support.
    상세보기
  44. Beihoff, Bruce C.; Radosevich, Lawrence D.; Meyer, Andreas A.; Gollhardt, Neil; Kannenberg, Daniel G., Modular power converter having fluid cooled support.
    상세보기
  45. Dias Clive,CAX ; Pozzuoli Marzio,CAX, Modular protective relay with submodules.
    상세보기
  46. Beihoff,Bruce C.; Kehl,Dennis L.; Gettelfinger,Lee A.; Kaishian,Steven C.; Phillips,Mark G.; Radosevich,Lawrence D., Power converter connection configuration.
    상세보기
  47. Beihoff,Bruce C.; Kehl,Dennis L.; Gettelfinger,Lee A.; Kaishian,Steven C.; Phillips,Mark G.; Radosevich,Lawrence D., Power converter having improved EMI shielding.
    상세보기
  48. Meyer,Andreas A.; Radosevich,Lawrence D.; Beihoff,Bruce C.; Kehl,Dennis L.; Kannenberg,Daniel G., Power converter having improved fluid cooling.
    상세보기
  49. Radosevich,Lawrence D.; Kannenberg,Daniel G.; Phillips,Mark G.; Kaishian,Steven C., Power converter having improved terminal structure.
    상세보기
  50. Nagashima James M. ; Ward Terence G. ; Downer Scott D., Power electronics system with fully-integrated cooling.
    상세보기
  51. Hara, Yasuhiro; Nakahori, Wataru; Miyazaki, Hiroshi; Sanae, Haruhiko, Power supply device.
    상세보기
  52. Lei, Guangyin; Degner, Michael W.; Chen, Chingchi; Jih, Edward Chan-Jiun, Power-module assembly.
    상세보기
  53. Suga Kazunari,JPX ; Fujimoto Akihiro,JPX, Printed circuit board with electronic devices mounted thereon.
    상세보기
  54. Mamitsu, Kuniaki; Teshima, Takanori, Semiconductor device.
    상세보기
  55. Mamitsu, Kuniaki; Teshima, Takanori, Semiconductor device.
    상세보기
  56. Murata, Wataru; Hongo, Manabu; Kobayashi, Hidekatsu; Matsuda, Hiroaki; Suzuki, Takashi; Sudo, Satoshi; Araki, Tatsuhito, Terminal and mobile terminal apparatus.
    상세보기
  57. Radosevich, Lawrence D.; Kannenberg, Daniel G.; Kaishian, Steven C.; Beihoff, Bruce C., Thermally matched fluid cooled power converter.
    상세보기
  58. Beihoff,Bruce C.; Kehl,Dennis L.; Gettelfinger,Lee A.; Kaishian,Steven C.; Phillips,Mark G.; Radosevich,Lawrence D., Vehicle drive module having improved EMI shielding.
    상세보기
  59. Radosevich,Lawrence D.; Meyer,Andreas A.; Kannenberg,Daniel G.; Kaishian,Steven C.; Beihoff,Bruce C., Vehicle drive module having improved cooling configuration.
    상세보기
  60. Beihoff,Bruce C.; Radosevich,Lawrence D.; Phillips,Mark G.; Kehl,Dennis L.; Kaishian,Steven C.; Kannenberg,Daniel G., Vehicle drive module having improved terminal design.
    상세보기
  61. Lei, Guangyin; Degner, Michael W.; Jih, Edward Chan-Jiun; Chen, Chingchi, Vehicle power module assemblies and manifolds.
    상세보기
  62. Hwang, Jer-Sheng; Chang, Teng-Kai, Vortex generating finned liquid-cooling heat exchanger module with transverse plate or pathways.
    상세보기

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