이 특허를 인용한 특허 (86)

1. Dibene, II, Joseph T.; Hartke, David H.; Derian, Edward J.; Hoge, Carl E.; Broder, James M.; San Andres, Jose B.; Riel, Joseph S., Apparatus for delivering power to high performance electronic assemblies.

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2. Fischer,Larry G.; Wayman,Michael J., Apparatus for enclosing electronic components.

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3. Fischer, Larry G.; Moreau, Eric S.; Martell, Gregory, Apparatus for enclosing electronic components used in telecommunication systems.

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4. Joseph Ted Dibene, II ; David H. Hartke ; James Hjerpe Kaskade ; Carl E. Hoge, Apparatus for providing power to a microprocessor with integrated thermal and EMI management.

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5. Hirafuji,Kazuo; Sonobe,Hideki; Nakagawa,Yoshihisa, Cabinet having heat radiation function and heat radiation member.

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6. Smith, Kevan; Marosfalvy, Hans; Hutchison, Randall D.; Schiffbauer, Robert; Taubert, Tomasz, Cable interface for electronic equipment enclosure.

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7. Wayman,Michael J., Chassis mounted heat sink system.

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8. Gustine, Gary; Ham, Charles; Kusz, Matthew; Sawyer, Michael, Clamping case.

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9. Gustine,Gary; Ham,Charles; Kusz,Matthew J.; Sawyer,Michael, Clamping case.

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10. Gustine, Gary; Ham, Charles; Kusz, Matthew; Sawyer, Michael, Clamping receptacle.

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11. Gustine,Gary; Ham,Charles; Kusz,Matthew; Sawyer,Michael, Clamping receptacle.

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12. Randall D. Hutchison ; Robert Shiffbauer ; Kevan Smith, Concentrical slot telecommunications equipment enclosure.

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13. Asfia,Julie F.; Chen,Chung Lung; Cai,Qingjun, Cooling apparatus, system, and associated method.

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14. Fukuda, Hiroshi; Fujita, Kenji, Cooling structure for disk storage device.

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15. Suzuki, Masahiro, Cooling system for electronic packages.

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16. Wu,Chih Wei, Desktop personal computer and thermal module thereof.

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17. Gates William George,GBX, Electronic apparatus having an environmentally sealed external enclosure.

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18. Cheng, Ying-Yen; Hsiao, Ya-Lin, Electronic assembly and electronic device.

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19. Severson Mark H., Electronic assembly with fault tolerant cooling.

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20. Hutchison, Randall D.; Schiffbauer, Robert, Electronic equipment enclosure.

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21. Hutchison Randy ; Shiffbauer Robert, Enclosure for telecommunications equipment.

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22. Coleman, David; Slack, Geoffrey; Cheshire, Anthony, Fire resistant electronic engine controller.

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23. Ferris, Matthew D.; Petersen, Cyle D., Heat dissipation for electronic enclosures.

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24. Govindasamy, Gururaj; Nguyen, Thomas; Lew, Hogan; Fraticelli, David, Heat dissipation unit for a wireless network device.

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25. Lin,Pei Shi, Heat duct-equipped heat-radiating device for power supply.

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26. Liu, Tay-Jian; Fan, Chih-Feng; Lee, Chih-Peng; Tung, Chao-Nien, Heat exchange module.

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27. Leon,Eduardo; Harwood,Walter; Bond,William; Hernandez,Frank; Vaidya,Avinash K., Heat pipe cooled electronics enclosure.

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28. Ueda, Akira; Suzuki, Masumi, Heat pipe type cooler.

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29. Ueda,Akira; Suzuki,Masumi, Heat pipe type cooler.

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30. Katsui, Tadashi, Heat sink and information processor using heat sink.

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31. Tadashi Katsui JP, Heat sink and information processor using heat sink.

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32. Tadashi Katsui JP, Heat sink and information processor using heat sink.

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33. Hahn, Amand J.; Boer, Rod P.; Schneider, Eric A., Housing for an automation system controller.

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34. Hahn,Amand J.; Boer,Rod P.; Schneider,Eric A., Housing for an electronic circuit module.

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35. Hahn,Amand J.; Boer,Rod P.; Schneider,Eric A., Housing for an electronic circuit module.

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36. Sawyer, Michael; Kusz, Matthew J.; Gustine, Gary; Ham, Charles G.; Daniels, Fredrick A., Housings for circuit cards.

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37. Hartke, David J; Dibene, II, Joseph T.; Derian, Edward J.; Broder, James M., Integrated power delivery and cooling system for high power microprocessors.

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38. Hartke, David H.; DiBene, II, Joseph Ted, Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems.

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39. Dibene ; II Joseph Ted ; Hartke David, Inter-circuit encapsulated packaging.

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40. Joseph Ted DiBene, II ; David Hartke, Inter-circuit encapsulated packaging for power delivery.

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41. Bishop Michael,CAX ; Zapach Trevor,CAX ; Moss John,CAX, Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments.

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42. Laetsch, Erich K., Local loop telecommunication repeater housing having mounting slots enabling replaceable repeater and voltage protector assemblies.

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43. Laetsch, Erich K., Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction.

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44. Langley Philip David ; Boone Douglas, Low EMI emissions heat sink device.

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45. Langley Philip David ; Boone Douglas, Low EMI emissions heat sink device.

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46. Langley Philip David ; Boone Douglas, Low EMI emissions heat sink device.

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47. Gustine, Gary; Ham, Charles G.; Sawyer, Michael; Daniels, Fredrick A.; Bishop, Michelle; King, Lane; Kusz, Matthew J., Mechanical housing.

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48. Gustine, Gary; Ham, Charles G.; Sawyer, Michael; Daniels, Fredrick; Bishop, Michelle; King, Lane; Kusz, Matthew, Mechanical housing.

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49. Gustine,Gary; Ham,Charles G.; Sawyer,Michael; Daniels,Frederick; Bishop,Michelle; King,Lane; Kusz,Matthew, Mechanical housing.

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50. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.

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51. DiBene, II,Joseph T.; Hartke,David H.; Kaskade,James J. Hjerpe; Hoge,Carl E., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.

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52. Tracewell,Matthew S.; Chen,Gary G., Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology.

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53. Wegdal Carl Goran,SEX, Method for reducing moisture content within a housing by reducing thermal inertia on a side of the housing.

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54. Barth, Michael K.; Ham, Charles G.; Tennis, Gene; Kusz, Matthew; Sjodin, Chad J.; Ferris, Matthew; Petersen, Cyle D., Methods and systems of heat transfer for electronic enclosures.

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55. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.

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56. Smith, Kevan; Marosfalvy, Hans; Hutchison, Randall D.; Schiffbauer, Robert, Modular electronic equipment enclosure comprising sealed cable interface module.

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57. Hahn,Amand J.; Boer,Rod P.; Schneider,Eric A., Modular electronic housing.

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58. Hahn,Amand J.; Boer,Rod P.; Schneider,Eric A., Modular electronic housing and assemblies.

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59. Hahn,Amand J.; Boer,Rod P.; Schneider,Eric A., Modular electronic housing and assemblies.

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60. Hahn,Amand J.; Boer,Rod P.; Schneider,Eric A., Modular electronic housing and assemblies.

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61. Hahn,Amand J.; Boer,Rod P.; Schneider,Eric A., Modular electronic housing and assemblies.

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62. Stavi, Irad, Passively cooled serviceable device.

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63. Morita, Tomohiro; Tokunaga, Yoshimi; Kaneko, Yoshinori; Kuriyama, Shuichi, Power line communication apparatus.

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64. Morita, Tomohiro; Tokunaga, Yoshimi; Kaneko, Yoshinori; Kuriyama, Shuichi, Power line communication apparatus.

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65. Morita, Tomohiro; Tokunaga, Yoshimi; Kaneko, Yoshinori; Kuriyama, Shuichi, Power line communication apparatus.

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66. Lin, Saul, Power regulator.

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67. Lee,Kenny, Power supply without cooling fan.

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68. Ichikizaki, Yasunori; Hirakawa, Masato; Yamashita, Takashi, Protecting cover and electronic device assembly.

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69. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.

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70. Derian, Edward J.; DiBene, II, Joseph Ted; Hartke, David H., Separable power delivery connector.

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71. Kim, Jung-hoon, Solid state drive apparatus.

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72. O'Baid, Amr Hassan; Kunimoto, Wallace Y., Stirling cycle cryocooler with improved magnet ring assembly and gas bearings.

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73. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.

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74. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.

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75. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.

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76. Smith, David Lane, System and method for fluid cooling of electronic devices installed in a sealed enclosure.

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77. Rush, Brian Magann; Kim, Joo Han, System and method for passively cooling an enclosure.

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78. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.

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79. Hutchison, Randall D.; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.

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80. Lin, Wanlai; Hutchison, Randall D.; Smith, Kevan; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.

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81. Randall D. Hutchinson ; Tomasz Taubert, Telecommunications enclosure with individual, separated card holders.

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82. Cosley,Michael; Garcia,Marvin; Teter,John, Thermal energy storage transfer system.

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83. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.

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84. Owens, Mark J.; Seiler, Chia; Brown, Brian Robert; Bonwick, Mark Henry; Scott, Quentin; Goh, Robert; Halgren, Ross, WDM add/drop multiplexer module.

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85. Owens, Mark J.; Seiler, Chia; Brown, Brian Robert; Bonwick, Mark Henry; Scott, Quentin; Goh, Robert; Halgren, Ross, WDM add/drop multiplexer module.

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86. Owens, Mark J.; Seiler, Chia; Brown, Brian Robert; Bonwick, Mark Henry; Scott, Quentin; Goh, Robert; Halgren, Ross, WDM add/drop multiplexer module.

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