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Method for electroforming an optical disk stamper 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-001/10
출원번호 US-0974849 (1997-11-20)
발명자 / 주소
  • Greenspan Alex
출원인 / 주소
  • Digital Matrix
대리인 / 주소
    Snell & Wilmer L.L.P.
인용정보 피인용 횟수 : 60  인용 특허 : 0

초록

The present invention includes an apparatus and method for continuously adjusting the anode/cathode distance for controlling uniformity of deposition. The entire cathode head is mounted on a lead screw which, when manually turned, moves the cathode head in or out in relation to the anode basket. Alt

대표청구항

[ I claim:] [1.] A method for electroforming an optical disk stamper by controlling the uniformity of deposition onto a mandrel, said method comprising the steps of:providing an anode;providing a cathode assembly facing said anode and at a distance from said anode, said cathode assembly comprising a

이 특허를 인용한 특허 (60)

  1. Woodruff, Daniel J.; Hanson, Kyle M.; Eudy, Steve L.; Weber, Curtis A.; Harris, Randy, Adaptable electrochemical processing chamber.
  2. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.
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  4. Hanson,Kyle M., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  5. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  6. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.
  7. Robert W. Batz, Jr. ; Scot Conrady ; Thomas L. Ritzdorf, Apparatus for high deposition rate solder electroplating on a microelectronic workpiece.
  8. Woodruff, Daniel J.; Hanson, Kyle M.; Oberlitner, Thomas H.; Chen, LinLin; Pedersen, John M.; Zila, Vladimir, Apparatus for processing the surface of a microelectronic workpiece.
  9. Pedersen, John M.; Erickson, James J., Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing.
  10. Pedersen,John M.; Erickson,James J., Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing.
  11. Hanson, Kyle M.; Klocke, John L., Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  12. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
  13. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.
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  15. Batz, Jr., Robert W.; Pedersen, John M.; Klocke, John L.; Chen, LinLin, Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces.
  16. Batz, Jr., Robert W.; Pedersen, John M.; Klocke, John L.; Chen, LinLin, Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces.
  17. Batz, Jr.,Robert W.; Pedersen,John M.; Klocke,John L.; Chen,LinLin, Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces.
  18. Billman .ANG.ke,SEX, Device for transmitting electric current to disc elements in surface-coating thereof.
  19. Pedersen, John M.; Willey, Jeremy; Woodruff, Daniel J., Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces.
  20. Evan E. Patton ; Wayne Fetters, Dual channel rotary union.
  21. Contolini Robert J. ; Reid Jonathan ; Patton Evan ; Feng Jingbin ; Taatjes Steve ; Dukovic John Owen, Electric potential shaping apparatus for holding a semiconductor wafer during electroplating.
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  23. Reid Jonathan David ; Contolini Robert J. ; Dukovic John Owen, Electroplating anode including membrane partition system and method of preventing passivation of same.
  24. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  25. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.
  26. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating reactor.
  27. Broadbent Eliot K., Electroplating system with shields for varying thickness profile of deposited layer.
  28. Sasaki, Masato; Morioka, Yuzuru; Sugita, Sachiko; Ishikawa, Masazumi, Method and apparatus for an anodic treatment.
  29. Sasaki,Masato; Morioka,Yuzuru; Sugita,Sachiko; Ishikawa,Masazumi, Method and apparatus for an anodic treatment.
  30. Reid Jonathan David ; Taatjes Steve, Method and apparatus for treating surface including virtual anode.
  31. Mayer, Steven T.; Drewery, John S., Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation.
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  33. Reid, Jonathan David, Method for electrochemical planarization of metal surfaces.
  34. Batz, Jr., Robert W.; Conrady, Scot; Ritzdorf, Thomas L., Method for high deposition rate solder electroplating on a microelectronic workpiece.
  35. Mayer,Steven T.; Reid,Jonathan D.; Rea,Mark L.; Emesh,Ismail T.; Meinhold,Henner W.; Drewery,John S., Method for planar electroplating.
  36. Pedersen,John M.; Erickson,James J., Method for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing.
  37. Patton Evan E. ; Fetters Wayne, Method of depositing metal layer.
  38. Reid, Jonathan; Varadarajan, Sesha; Emekli, Ugur, Methods and apparatus for depositing copper on tungsten.
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  53. Yoshioka,Junichiro; Mukaiyama,Yoshitaka, Semiconductor wafer holder and electroplating system for plating a semiconductor wafer.
  54. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.
  55. Mayer, Steven T.; Rea, Mark L.; Hill, Richard S.; Kepten, Avishai; Stowell, R. Marshall; Webb, Eric G., Topography reduction and control by selective accelerator removal.
  56. Mayer, Steven T.; Rea, Mark L.; Hill, Richard S.; Kepten, Avishai; Stowell, R. Marshall; Webb, Eric G., Topography reduction and control by selective accelerator removal.
  57. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  58. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.
  59. Klein,Martin P.; Keigler,Arthur; Felsenthal,David, Ultra-thin wafer handling system.
  60. Wilson,Gregory J.; McHugh,Paul R.; Hanson,Kyle M., Workpiece processor having processing chamber with improved processing fluid flow.
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