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Electroless plating of metallic features on nonmetallic or semiconductor layer without extraneous plating 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B05D-005/12
출원번호 US-0815337 (1997-03-11)
발명자 / 주소
  • Semkow Krystyna W.
  • O'Sullivan Eugene J.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Dressler, Rockey, Milnamow & Katz
인용정보 피인용 횟수 : 158  인용 특허 : 0

초록 ▼

In the manufacture of a microelectronic component having metallic features on a polyimide layer, the metallic features being spaced from one another by gaps, at least some of which gaps have widths in a range from about one micron to about 500 microns, corrosion protection is provided by plating tho

대표청구항 ▼

[ We claim:] [1.] In the manufacture of a microelectronic component having metallic features on a nonmetallic or semiconductor layer, the metallic features being spaced from one another by gaps, at least some of which gaps have widths in a range from about one micron to about 500 microns, a method o

이 특허를 인용한 특허 (158)

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