[특허]Use of fiducial marks for improved blank wafer defect review

Use of fiducial marks for improved blank wafer defect review 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01N-021/00
출원번호	US-0890891 (1997-07-10)
발명자 / 주소	Tracy Bryan Mitchell Wollesen Donald L.
출원인 / 주소	Advanced Micro Devices, Inc.
대리인 / 주소	Nelson
인용정보	피인용 횟수 : 29 인용 특허 : 0

초록 ▼

A method for navigating directly to defects on a blank wafer caused by particles dropped from process tools. A blank wafer is marked with fiducial marks, the number of initial defects on the blank wafer is determined and the position coordinates of the initial defects and the fiducial marks are recorded. The blank wafer is placed into a selected process tool and the additional defects that are caused by particles dropped from the process tool are detected in an inspection tool and their position coordinates are determined and recorded as well as the position coordinates of the fiducial marks. The blank wafer is then placed in an analysis tool that is able to navigate directly to each of the additional defects at a high magnification using the position coordinates of the fiducial marks.

대표청구항 ▼

[ What we claim is:] [1.] A method for analyzing defects on a wafer after manufacturing steps in at least two processing tools, the method comprising:placing at least two fiducial marks on a wafer;recording position coordinates of the at least two fiducial marks;detecting initial defects on the wafer and recording position coordinates of the initial defects in relation to the position of the at least two fiducial marks;placing the wafer in a first process tool;detecting a first set of additional defects on the wafer caused by the first process tool and recording position coordinates of the first set of additional defects in relation to the at least two fiducial marks;placing the wafer in an analysis tool;performing de-skew calculations using the position coordinates of the at least two fiducial marks; andnavigating directly to the recorded position of each of the first set of additional defects on the wafer at high magnification.

이 특허를 인용한 특허 (29)

Jain, Arpit; Yati, Arpit; Jayaraman, Thirupurasundari; Konuru, Raghavan; Kuppa, Raj; Prasad, Hema; Momula, Saiyashwanth; Lobo, Arun, Automatic deskew using design files or inspection images.
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Wells, Andrew B., Beam positioning for beam processing.
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Xu,James J.; Lee,Ken K., Defect review system with 2D scanning and a ring detector.
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Matsushita Hiroshi,JPX ; Tsuchiya Norihiko,JPX ; Toyomaru Youko,JPX, Defect-position identifying method for semiconductor substrate.
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Smit, Casper Maria; van den Oetelaar, Johannes Antonius Maria, Drift control in a charged particle beam system.
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Agorio, Enrique; Hudson, James Edgar; Daniel, Gerhard; Tanguay, Michael; Arjavac, Jason, Method and apparatus for sample extraction and handling.
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Agorio, Enrique; Hudson, James Edgar; Daniel, Gerhard; Tanguay, Michael; Arjavac, Jason, Method and apparatus for sample extraction and handling.
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Agorio, Enrique; Hudson, James Edgar; Tanguay, Michael; Arjavac, Jason; Daniel, Gerhard, Method and apparatus for sample extraction and handling.
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Arjavac, Jason; Zou, Pei; Tasker, David James; Otten, Maximus Theodorus; Daniel, Gerhard, Method for S/TEM sample analysis.
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Arjavac, Jason; Zou, Pei; Tasker, David James; Otten, Maximus Theodorus; Daniel, Gerhard, Method for S/TEM sample analysis.
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Arjavac, Jason; Zou, Pei; Tasker, David James; Otten, Maximus Theodorus; Daniel, Gerhard, Method for S/TEM sample analysis.
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Arjavac, Jason; Zou, Pei; Tasker, David James; Otten, Maximus Theodorus; Daniel, Gerhard, Method for S/TEM sample analysis.
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Blackwood, Jeff; Stone, Stacey, Method for creating S/TEM sample and sample structure.
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Blackwood, Jeff; Stone, Stacey; Arjavac, Jason, Method for creating S/TEM sample and sample structure.
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Blackwood, Jeffrey; Stone, Stacey, Method for creating S/TEM sample and sample structure.
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Blackwood, Jeffrey; Stone, Stacey, Method for creating S/TEM sample and sample structure.
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Blackwood, Jeff; Stone, Stacey, Method for creating S/tem sample and sample structure.
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Lin,Long Hui; Chen,Chia Yun, Method of defect inspection.
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Phan,Khoi; Singh,Bhanwar; Rangarajan,Bharath, Real time analytical monitor for soft defects on reticle during reticle inspection.
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Somekh, Sasson; Maimon, Amotz, Real time defect source identification.
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Tanaka, Atsushi; Tsuji, Takashi, Semiconductor device manufacturing method and manufacturing device for marking a crystal defect.
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Christopher Lee Pike, Semiconductor wafer alignment method using an identification scribe.
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Edward E. Ehrichs ; Chris Wooten, Semiconductor wafer review system and method.
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Xu,James J.; Lee,Ken K., Surface inspection system.
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Padgett, William Brandon; Kesler, Ralph Steven; Cameron, Michael E.; Horton, Roger D., System and a method for detecting fiber damage in a dialyzer.
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Phan, Khoi A.; Rangarajan, Bharath; Singh, Bhanwar, System and method for facilitating detection of defects on a wafer.
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Ukraintsev, Vladimir A.; Stallcup, Richard; Pryadkin, Sergiy; Berkmyre, Mike; Sanders, John, System and method for non-contact microscopy for three-dimensional pre-characterization of a sample for fast and non-destructive on sample navigation during nanoprobing.
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Ukraintsev, Vladimir A.; Stallcup, Richard; Pryadkin, Sergiy; Berkmyre, Mike; Sanders, John, System and method for non-contact microscopy for three-dimensional pre-characterization of a sample for fast and non-destructive on sample navigation during nanoprobing.
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Lin,Long Hui; Chan,Li Yu, Wafer defect detection methods and systems.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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연합인증

Use of fiducial marks for improved blank wafer defect review 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

이 특허를 인용한 특허 (29)

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연합인증

Use of fiducial marks for improved blank wafer defect review 원문보기

초록 ▼

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연구과제 타임라인

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이 특허를 인용한 특허 (29)

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