초록 ▼

A free standing self contained device for bonding ultra thin metallic films, such as 0.001 inch beryllium foils. The device will regulate to a predetermined load for solid state bonding when heated to a bonding temperature. The device includes a load regulating feature, whereby the expansion stresse

A free standing self contained device for bonding ultra thin metallic films, such as 0.001 inch beryllium foils. The device will regulate to a predetermined load for solid state bonding when heated to a bonding temperature. The device includes a load regulating feature, whereby the expansion stresses generated for bonding are regulated and self adjusting. The load regulator comprises a pair of friction isolators with a plurality of annealed copper members located therebetween. The device, with the load regulator, will adjust to and maintain a stress level needed to successfully and economically complete a leak tight bond without damaging thin foils or other delicate components.

대표청구항 ▼

[ The invention claimed is:] [1.] A free standing, differential expansion fixture for solid state bonding, comprising:a table;a lower anvil assembly mounted on said table;an upper anvil; andmeans for removably retaining said upper anvil in alignment with said lower anvil assembly;said lower anvil as

[ The invention claimed is:] [1.] A free standing, differential expansion fixture for solid state bonding, comprising:a table;a lower anvil assembly mounted on said table;an upper anvil; andmeans for removably retaining said upper anvil in alignment with said lower anvil assembly;said lower anvil assembly being provided with plurality of a load regulators.