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Method of making and using thermally conductive joining film

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-031/00
출원번호 US-0871910 (1997-06-12)
발명자 / 주소
  • Browne James M.
대리인 / 주소
    Limbach & Limbach L.L.P.
인용정보 피인용 횟수 : 32  인용 특허 : 43

초록

A thermally conductive film that includes a film of polymeric matrix material having a thickness t defined between a top surface and a bottom surface. A plurality of fibers, having a greater thermal conductivity than the polymeric matrix material, is disposed in the film and extends between the top

대표청구항

[ What is claimed is:] [1.] A method of making a thermally conductive film from a sheet of composite prepreg material formed of a polymeric matrix material with thermally conductive fibers disposed therein extending lengthwise in the plane of the sheet, the fibers having a greater thermal conductivi

이 특허에 인용된 특허 (43)

  1. Blackmon James B. (Irvine CA) Drubka Robert E. (Huntington Beach CA) Kirby John S. (Long Beach CA) Johnson Dave (Riverside CA) Gerrick R. Andrew (Santa Ana CA) Ingersoll Thomas (Laguna Niguel CA) Jon, Advanced survivable radiator.
  2. Odashima Satoshi (Saitama JPX), Anisotropically electroconductive adhesive composition.
  3. Sado Ryoichi (Saitama JPX), Anisotropically pressure-sensitive electroconductive composite sheets and method for the preparation thereof.
  4. Sado Ryoichi (Saitama JPX), Anisotropically pressure-sensitive electroconductive composite sheets and method for the preparation thereof.
  5. Mittal Faquir C. (Audubon PA), Apparatus for cooling integrated circuit chips.
  6. Ioki Kimihiro (Tokyo JPX) Okuyama Kohei (Kagawa JPX) Niwa Kazuo (Kagawa JPX) Seki Hitoshi (Kagawa JPX) Takahashi Takanori (Kagawa JPX), Carbon fiber-reinforced carbon composite materials processes for their production, and first walls of nuclear fusion rea.
  7. Grapes Thomas F. (Columbia MD) Fertig Timothy M. (Pasadena MD) Schroeder Mark S. (Severna Park MD), Composite heat transfer means.
  8. Grapes Thomas F. (Columbia MD) Fertig Timothy M. (Pasadena MD) Schroeder Mark S. (Severna Park MD), Composite heat transfer means.
  9. Iwaskow Richard S. (Passaic NJ) Crum Stephen M. (Wharton NJ), Compositions convertible to reinforced conductive components and articles incorporating same.
  10. Iwaskow Richard S. (Pompton Lakes NJ) Crum Stephen M. (Wharton NJ), Compositions convertible to reinforced conductive components and articles incorporating same.
  11. Iwaskow Richard S. (Pompton Lakes NJ) Crum Stephen M. (Wharton NJ), Compositions convertible to reinforced conductive components and articles incorporating same.
  12. Hajovsky Robert J. (Scotland TX), Conductive adhesive.
  13. Lampert Bruce G. (Easton MA) Klein William (Stoughton MA), Conductive releasable adhesive and method of making same.
  14. Takashi Nogami (Tokyo JPX) Haruhiko Masuda (Hasuda JPX), Electric connector of press-contact holding type.
  15. Lee James (Los Altos Hills CA) Beck Richard (Cupertino CA) Lee Chune (San Francisco CA) Hu Edward (Sunnyvale CA), Electrical connector for surface mounting.
  16. Lee James C. K. (Los Altos Hills CA) Beck Richard (Cupertino CA) Lee Chune (San Francisco CA) Hu Edward (Sunnyvale CA), Electrical connector for surface mounting and method of making thereof.
  17. Patz Gary L. (Walnut Creek CA) Davenport Donald E. (Palo Alto CA), Electrically conductive prepreg materials.
  18. Takashi Nogami (Tokyo JPX) Masayuki Mitsuhashi (Saitama JPX), Electroconductive rubbery member and elastic connector therewith.
  19. Sado Ryoichi (Saitama JPX), Electronic circuit parts.
  20. Olsen Randall B. (Olivenhain CA), Graphite fiber thermal radiator.
  21. Shelley Stanley John (Dewsbury EN), Heat resistant panels.
  22. Voorhes David W. (Winchester MA) Goldman Richard D. (Stoughton MA) Lopez Robert R. (Boxford MA), Heat sink.
  23. Banks Bruce A. (Olmsted Township ; Cuyahoga County OH) Gaier James R. (Strongsville OH), Heat transfer device.
  24. Montesano Mark J. (Fairfax VA), Heat transfer device and method.
  25. Heinze Reinhard (Stuttgart DEX) Mrgenthaler Klaus (Stuttgart DEX) Maiwald Ines (Schwaikheim DEX) Kroenert Wolfgang (Aachen DEX), Heat-insulating lining for a gas turbine.
  26. Zweben Carl H. (Devon PA) Mogle Rodman A. (Clinton NY) Rodini ; Jr. Benjamin T. (Wayne PA) Thaw Charles L. (Phoenixville PA), Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite.
  27. Sado Ryoichi (Saitama JPX) Tahara Kazutoki (Saitama JPX), Method for manufacturing an elastic composite body with metal wires embedded therein.
  28. Grapes Thomas F. (Columbia MD) Fertig Timothy M. (Pasadena MD) Schroeder Mark S. (Severna Park MD), Method for the fabrication of a heat transfer member for electronic systems.
  29. Nakamura Akio (Saitama JPX) Hayashi Osami (Saitama JPX) Tabei Hideki (Saitama JPX), Method for the preparation of a hot-melt adhesive interconnector.
  30. Lee James (Los Altos Hills CA) Beck Richard (Cupertino CA) Lee Chune (San Francisco CA) Hu Edward (Sunnyvale CA), Method of fabricating electrical connector for surface mounting.
  31. Buchoff Leonard S. (Bloomfield NJ) Kosiarski Joseph P. (Englishtown NJ) Dalamangas Chris A. (Union NJ), Method of making electrically conductive connector.
  32. Sado Ryoichi (Saitama JPX) Nakamura Akio (Toda JPX), Pressure sensitive resistor elements.
  33. Kneringer Gunther (Reutte ATX) Reheis Nikolaus (Jerzens ATX) Thalman Walter (Breitenwang ATX), Process for the manufacture of a soldered joint.
  34. Kitagawa Hiroji (Nagoya JPX), Sealant compound with carbon fiber mixed therein.
  35. Banks Bruce A. (Olmsted Township ; Cuyahoga County OH) Gaier James R. (Strongsville OH), Semiconductor cooling apparatus.
  36. McAllister Patrick Von (Salt Lake City UT), Solar energy absorber.
  37. Peterson Albert Henry (Sandy UT), Solar energy absorber.
  38. Martorana Richard T. (Andover MA) Heimann Thomas D. (Methuen MA) Bimshas John (Winchester MA), Solid state directional thermal cable.
  39. Przilas Mark B. (Greenville TX), Tapered thermal substrate for heat transfer applications and method for making same.
  40. Deakyne, Clifford K.; Lavin, John G., Thermal conductive material.
  41. Adams Jerome T. (Hockessin DE) Yost Bruce A. (Newark DE), Thermally conductive adhesive.
  42. Eddy Clifford O. (Webster NY) Seanor Donald A. (Pittsford NY), Thermally conductive fusing device.
  43. Takahashi Masakatsu (4-6 ; Narihira-cho Ashiya-shi ; Hyogo 659 JPX), Wig-like cool cap and method for manufacturing.

이 특허를 인용한 특허 (32)

  1. Stowe, Timothy D.; Liu, Chu-heng; Lu, Jeng Ping; Chow, Eugene; Anderson, Gregory B.; Völkel, Armin; Peeters, Eric, Anisotropically conductive backside addressable imaging belt for use with contact electrography.
  2. Smith, Gordon James; Van Leeuwen, George Willard, Apparatus and method for cooling a wearable electronic device.
  3. Houle, Sabina J.; Koning, Paul A.; Chrysler, Greg M., Carbon-carbon and/or metal-carbon fiber composite heat spreader.
  4. Houle, Sabina J.; Koning, Paul A.; Chrysler, Greg M., Carbon-carbon and/or metal-carbon fiber composite heat spreaders.
  5. Houle,Sabina J.; Koning,Paul A.; Chrysler,Greg M., Carbon-carbon and/or metal-carbon fiber composite heat spreaders.
  6. Jackson Timothy L., Deflectable interconnect.
  7. Jackson, Timothy L., Deflectable interconnect.
  8. Jackson, Timothy L., Deflectable interconnect.
  9. Timothy L. Jackson, Deflectable interconnect.
  10. Knowles,Timothy R.; Seaman,Christopher L., Dendritic fiber material.
  11. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Diamondoid-containing capacitors.
  12. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Diamondoid-containing field emission devices.
  13. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Diamondoid-containing low dielectric constant materials.
  14. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Diamondoid-containing materials for passivating layers in integrated circuit devices.
  15. Dahl, Jeremy E.; Carlson, Robert M.; Liu, Shenggao, Diamondoid-containing materials in microelectronics.
  16. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Diamondoid-containing thermally conductive materials.
  17. Ali M. Akbar ; Peterson Carl W. ; McNab Kevin M., Electronic structure having an embedded pyrolytic graphite heat sink material.
  18. Knowles,Timothy R.; Seaman,Christopher L., Fiber adhesive material.
  19. Noguchi, Toru; Magario, Akira, Fiber composite material and method of producing the same.
  20. Hoover Ronald E. ; Hutchins Robert S. ; Marble Stuart J. ; Saito Clark A. ; Valle Manuel B., Flexible graphite fiber thermal shunt.
  21. Liu, Shenggao; Carlson, Robert M.; Dahl, Jeremy E.; Qureshi, Waqar R., Functionalized higher diamondoids.
  22. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Heterodiamondoid-containing field emission devices.
  23. Aisenbrey,Thomas, Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials.
  24. Ploessl, Andreas; Kaiser, Stephan; Härle, Volker; Hahn, Berthold, Method for producing semiconductor chips using thin film technology.
  25. Ploessl, Andreas; Kaiser, Stephan; Härle, Volker; Hahn, Berthold, Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology.
  26. Jackson, Timothy L., Method of making ball grid array package with deflectable interconnect.
  27. Bootle John D. ; Burzesi Frank, Method of making thermal core material and material so made.
  28. Ali, Mir Akbar; Peterson, Carl W., Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly.
  29. Dahl,Jeremy E.; Carlson,Robert M.; Liu,Shenggao, Nucleation of diamond films using higher diamondoids.
  30. Hada, Sayuri; Sueoka, Kuniaki; Taira, Yoichi, Sheet having high thermal conductivity and flexibility.
  31. Grip, Robert E.; Rawdon, Blaine K.; Jalewalia, Gurpreet S., Structurally isolated thermal interface.
  32. Jiang, Tongbi, Thermally conductive adhesive tape for semiconductor devices and method for using the same.
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