초록 ▼

A method of manufacturing a panel having a foam interlayer. A flexible cover is placed adjacent a first mold in an open tool. A rigid substrate is placed adjacent a second mold, or alternately, is place atop the flexible cover in the first mold, of the opened tool. The first and/or second molds are

A method of manufacturing a panel having a foam interlayer. A flexible cover is placed adjacent a first mold in an open tool. A rigid substrate is placed adjacent a second mold, or alternately, is place atop the flexible cover in the first mold, of the opened tool. The first and/or second molds are electrically isolated from one another and from the associated manufacturing equipment. A vacuum draws the cover against the first mold and retains the cover in position during the manufacturing operation. The tool is moved to a closed position and the cover is positioned juxtaposed the substrate. The cover and substrate are positioned a distance apart thus creating a space therebetween. A vacuum is created in the space and a radio frequency (RF) electric field is applied between the first and second molds. The RF electric field causes a plasma to be created within the space. The plasma activates both the cover and the substrate. While the space is still under vacuum, a foaming material is injected into the space. The foaming material is drawn into the space by the vacuum and adheres to the activated cover and substrate. The RF electric field is subsequently coupled in the space to dielectrically cure the foam material.

대표청구항 ▼

[ We claim:] [1.] A method of manufacturing a panel having a foam interlayer comprising the steps of:placing a flexible cover adjacent a first mold of an open tool;placing a rigid substrate adjacent a second mold or atop the cover adjacent the first mold of said open tool;electrically isolating said

[ We claim:] [1.] A method of manufacturing a panel having a foam interlayer comprising the steps of:placing a flexible cover adjacent a first mold of an open tool;placing a rigid substrate adjacent a second mold or atop the cover adjacent the first mold of said open tool;electrically isolating said first mold from said second mold;applying a vacuum to draw said cover against said first mold;closing said tool and causing said cover to be positioned juxtaposed said substrate and creating a space therebetween;drawing a vacuum in said space;applying an RF electric field between said first and second molds and causing a plasma to be created within said space, said plasma activating said cover and substrate; andwhile said space is still under vacuum, injecting a foaming material into said space, said foaming material is drawn into said space by said vacuum and adheres to said activated cover and substrate.