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Method and apparatus for jetting, manufacturing and attaching uniform solder balls

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B05B-001/24
  • B05B-001/08
출원번호 US-0746602 (1996-11-13)
발명자 / 주소
  • Yost Frederick G.
  • Frear Darrel R.
  • Schmale David T.
출원인 / 주소
  • Sandia Corporation
대리인 / 주소
    Dodson
인용정보 피인용 횟수 : 30  인용 특허 : 12

초록

An apparatus and process for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. Whe

대표청구항

[ What is claimed is:] [1.] An apparatus for simultaneously generating a plurality of solder balls, comprising:a) a reservoir comprising a means for heating to an operating temperature sufficient to melt solder and containing a working volume of melted solder;b) at least one aperture plate in fluid

이 특허에 인용된 특허 (12)

  1. Mock Randolf (Munich DEX) Kappel Andreas (Munich DEX) Meixner Hans (Haar DEX), Apparatus for apportioning and atomizing fluids.
  2. Emoto Takao (Kitakami JPX) Nagata Yoshitaka (Kawasaki JPX), Apparatus for quantitatively supplying liquid.
  3. Kawashima Yasuji (Ibaraki JPX) Nishibori Kazuo (Toyonaka JPX) Morita Yasuhiro (Nagaokakyo JPX) Hayama Sachiho (Osaka JPX), Automatic jet soldering apparatus.
  4. Smith Ted M. (Austin TX) Winstead Russell E. (Raleigh NC), Electrodynamic pump for dispensing molten solder.
  5. Hertz Allen D. (Boca Raton FL) Liebman Henry F. (Tamarac FL) Immacolato Frank C. (Boca Raton FL), Flexible high speed liquid dispenser.
  6. Hohm Dietmar (Neufahrn) Kleinschmidt Peter (Munich) Meixner Hans (Haar) Stein Dieter (Holzkirchen DEX), Fuel injection nozzle with controllable fuel jet characteristic.
  7. Guiles Joseph W. (Prospect CT), Ink jet apparatus with improved reservoir system for handling hot melt ink.
  8. Dressler John L. (1216 Waterwyck Trail Spring Valley OH 45370), Liquid droplet generator.
  9. Hayes Donald J. (Plano TX) Boldman Michael T. (Garland TX) Wallace David B. (Dallas TX), Method and apparatus for dispensing spherical-shaped quantities of liquid solder.
  10. La, Duong; Ciardella, Robert L.; Babiarz, Alec J.; Bouras, Carlos E., Method for rapid dispensing of minute quantities of viscous material.
  11. Igashira Toshihiko (Toyokawa JPX) Sakakibara Yasuyuki (Nishio JPX) Abe Seiko (Okazaki JPX) Takigawa Masahiro (Nukata JPX) Izawa Akihiro (Nishio JPX), Piezoelectric low-pressure fuel injector.
  12. Kock Ronald W. (Cincinnati OH) Merz Theodore P. (Cincinnati OH) Platt Paul K. (Cincinnati OH), Spray dispensing.

이 특허를 인용한 특허 (30)

  1. Lee, Choong-Won, Apparatus and method for manufacturing solder balls.
  2. Katkar, Rajesh; Uzoh, Cyprian Emeka, Conductive connections, structures with such connections, and methods of manufacture.
  3. Katkar, Rajesh; Uzoh, Cyprian Emeka, Conductive connections, structures with such connections, and methods of manufacture.
  4. Uzoh, Cyprian Emeka; Katkar, Rajesh, Conductive connections, structures with such connections, and methods of manufacture.
  5. Uzoh, Cyprian Emeka; Katkar, Rajesh, Conductive connections, structures with such connections, and methods of manufacture.
  6. Farnworth Warren M., Continuous mode solder jet apparatus.
  7. Farnworth Warren M., Continuous mode solder jet apparatus.
  8. Farnworth Warren M., Continuous mode solder jet apparatus.
  9. Farnworth, Warren M., Continuous mode solder jet apparatus.
  10. Farnworth,Warren M., Continuous mode solder jet apparatus.
  11. Warren M. Farnworth, Continuous mode solder jet apparatus.
  12. Farnworth, Warren M., Continuous mode solder jet method.
  13. Holm, William; Kronstedt, Johan; Sandell, Hakan, Dispensing assembly.
  14. John L. Galvagni ; Andrew P. Ritter ; Thomas Brown, Interdigitated capacitor with ball grid array (BGA) terminations.
  15. Masuo Koshi JP; Tadahiko Sugimoto JP; Takeshi Onobayashi JP; Kenichirou Todoroki JP, Jet solder feeding device and soldering method.
  16. Prentice, Thomas C.; Crouch, Kenneth C., Method and apparatus for dispensing a viscous material on a substrate.
  17. Ogawa Hirotaka,JPX, Method and apparatus for forming solder bumps.
  18. Maruyama,Teruo; Sonoda,Takashi, Method and apparatus of applying fluid.
  19. Farnworth, Warren M., Method for continuous mode solder jet apparatus.
  20. Warren M. Farnworth, Method for generating continuous stream of liquid metal droplets.
  21. David R. Hembree, Method of forming a solder ball.
  22. Hembree David R., Method of forming a solder ball.
  23. Huening, Kenneth J., Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages.
  24. Huening, Kenneth J., Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages.
  25. Holm,William; Kamfors,Mikael; Fridsell,Magnus, Method of jetting viscous medium.
  26. Holm,William; Kamfors,Mikael; Fridsell,Magnus, Method of jetting viscous medium.
  27. Sakai Tadahiko,JPX ; Sakemi Shoji,JPX, Method of securely mounting conductive balls.
  28. Baba, Shunji; Yamakami, Takatoyo; Kainuma, Norio; Kobae, Kenji; Kira, Hidehiko; Kobayashi, Hiroshi, Resin coating method.
  29. Fjelstad Joseph, Solder ball placement fixtures and methods.
  30. Bush Stephan Gary ; Stahley Robert Edward, Ultrasonic spray coating application system.
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