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Micro-electronic assembly including a flip-chip mounted micro-device and method

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-001/18   
미국특허분류(USC) 361/761 ; 361/764
출원번호 US-0688634 (1996-07-29)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Beyer & Weaver LLP
인용정보 피인용 횟수 : 27  인용 특허 : 7
초록
▼

A micro-electronic assembly, a substrate for use in the assembly and an associated method are disclosed herein. The substrate includes an outer surface configuration defining an aperture within a first surface and electrically conductive leads on the first surface. In the overall micro-electronic assembly, a micro-device includes an active surface supporting at least one component which projects outwardly from the surface. The micro-device further includes electrically conductive bumps on the active surface. The micro-device is positioned on the first su...

대표
청구항
▼

[ What is claimed is:] [1.] A micro-electronic assembly, comprising:a) a substrate including an outer surface configuration defining an aperture within a first surface thereof and electrically conductive means on said first surface; andb) a micro-device including a die and a transducer, the die including an active surface supporting a component which forms part of the overall transducer and projects outwardly from said active surface, said micro-device further including electrical connecting means positioned on said active surface, said micro-device bein...

이 특허에 인용된 특허 (7)

  1. Bozso Ferenc Miklos ; Emma Philip George. Clock skew minimization system and method for integrated circuits. USP1998065760478.
  2. Wilson William J. (Nashua NH). Electrical circuit interconnect system. USP1990034906957.
  3. Patterson Timothy P. (Santa Ana CA) Hoge Carl E. (Encinitas CA). Integrated circuit chip mounting and packaging assembly. USP1989064843188.
  4. Campbell William (Oldham GB2). Integrated circuit package. USP1981084285002.
  5. Dinger Rudolf (St-Aubin CHX) Simon Jean-Luc (Marin CHX). Microelectronic device positioning means. USP1995045406454.
  6. Cigna Jean-Charles (Villard de Lans FRX) Petitprez Claudine (Lancey FRX) Marion Franois (Saint Egreve FRX) Ravetto Michel (Meylan FRX). Radiation detection device having abutting detection elements and process for the production of said device. USP1997015591959.
  7. Thiele Alan G. (San Diego CA) Williams Ronald L. (San Marcos CA). Secure circuit structure. USP1991125072331.

이 특허를 인용한 특허 피인용횟수: 27

  1. Russell Abbott. Alignment mechanism for a high density electrical connector. USP2002046368146.
  2. Mott, Lawrence; Bettger, Kenneth; Brown, Elliot. Asymmetrical flexible edge seal for vacuum insulating glass. USP2012108283023.
  3. Hietanen Jarmo,FIX ; Rusanen Outi,FIX. Attachment of a micromechanical microphone. USP2001016178249.
  4. Hsu, Wei-Chan; Wu, Li-Te. Chip-scaled MEMS microphone package. USP2010107812418.
  5. Bettger, Kenneth J.; Stark, David H.. Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units. USP2013088512830.
  6. Bettger, Kenneth J.; Stark, David H.. Flexible edge seal for vacuum insulating glazing units. USP2012128329267.
  7. Sjursen,Walter P.; Leedom,Marvin A.; Mahoney,Derek D.; Margicin,John M.; Fritz,Frederick J.; Aceti,John G.; Preves,David A.; Palanisamy,Ponnusamy. Hearing aid with large diaphragm microphone element including a printed circuit board. USP2007057221768.
  8. Stark, David H.. Hermetically sealed micro-device package using cold-gas dynamic spray material deposition. USP2005086924974.
  9. Stark,David H.. Hermetically sealed micro-device package with window. USP2007077238546.
  10. Stark, David H. Insulated glazing units. USP2010117832177.
  11. Stark, David H.. Insulating glass unit having multi-height internal standoffs and visible decoration. USP2011087989040.
  12. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael. Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit. USP2016059328512.
  13. Zuniga-Ortiz, Edgar Rolando; Krenik, William R.. Micro-electro-mechanical system having movable element integrated into leadframe-based package. USP2014088796792.
  14. Zuniga-Ortiz, Edgar Rolando; Krenik, William R.. Micro-electro-mechanical system having movable element integrated into leadframe-based package. USP2012128338208.
  15. Zuniga-Ortiz, Edgar R.; Krenik, William R.. Microelectromechanical system having movable element integrated into substrate-based package. USP2014028648430.
  16. Schrank, Franz. Microphone arrangement and method for production thereof. USP2012068199963.
  17. Peter Madaffari ; Walter P. Sjursen ; Christopher Poux ; Richard Moroney ; Ponnusamy Palanisamy. Microphone assembly for hearing aid with JFET flip-chip buffer. USP2002046366678.
  18. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John. Multi-pane glass unit having seal with adhesive and hermetic coating layer. USP2015028950162.
  19. Mullenborn, Matthias; Scheel, Peter; Rombach, Pirmin. Pressure transducer. USP2004056732588.
  20. Sakai, Minekazu; Oota, Tameharu. Semiconductor device for providing capacitive semiconductor sensor and method for manufacturing capacitive semiconductor sensor. USP2010037678589.
  21. Suzuki, Toshihisa; Suzuki, Junya. Semiconductor microphone unit. USP2009087579678.
  22. Lee,Yeong Gyu; An,Seung Do. Semiconductor package and packaging method using flip-chip bonding technology. USP2006087098535.
  23. Mullenborn, Matthias; Kuhmann, Jochen F.; Scheel, Peter. Surface mountable transducer system. USP2012018103025.
  24. Mullenborn,Matthias; Kuhmann,Jochen F.; Scheel,Peter. Surface mountable transducer system. USP2008117447323.
  25. Mullenborn,Matthias; Kuhmann,Jochen F.; Scheel,Peter. Surface mountable transducer system. USP2007057221767.
  26. Hung, Li-Wen; Knickerbocker, John U.. System for continuous monitoring of body sounds. USP2018029900677.
  27. Stark, David H.. Wafer-level hermetic micro-device packages. USP2009047517712.

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