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특허 상세정보

Micro-electronic assembly including a flip-chip mounted micro-device and method

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-001/18   
미국특허분류(USC) 361/761 ; 361/764
출원번호 US-0688634 (1996-07-29)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Beyer & Weaver LLP
인용정보 피인용 횟수 : 27  인용 특허 : 7
초록

A micro-electronic assembly, a substrate for use in the assembly and an associated method are disclosed herein. The substrate includes an outer surface configuration defining an aperture within a first surface and electrically conductive leads on the first surface. In the overall micro-electronic assembly, a micro-device includes an active surface supporting at least one component which projects outwardly from the surface. The micro-device further includes electrically conductive bumps on the active surface. The micro-device is positioned on the first su...

대표
청구항

[ What is claimed is:] [1.] A micro-electronic assembly, comprising:a) a substrate including an outer surface configuration defining an aperture within a first surface thereof and electrically conductive means on said first surface; andb) a micro-device including a die and a transducer, the die including an active surface supporting a component which forms part of the overall transducer and projects outwardly from said active surface, said micro-device further including electrical connecting means positioned on said active surface, said micro-device bein...

이 특허를 인용한 특허 피인용횟수: 27

  1. Russell Abbott. Alignment mechanism for a high density electrical connector. USP2002046368146.
  2. Mott, Lawrence; Bettger, Kenneth; Brown, Elliot. Asymmetrical flexible edge seal for vacuum insulating glass. USP2012108283023.
  3. Hietanen Jarmo,FIX ; Rusanen Outi,FIX. Attachment of a micromechanical microphone. USP2001016178249.
  4. Hsu, Wei-Chan; Wu, Li-Te. Chip-scaled MEMS microphone package. USP2010107812418.
  5. Bettger, Kenneth J.; Stark, David H.. Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units. USP2013088512830.
  6. Bettger, Kenneth J.; Stark, David H.. Flexible edge seal for vacuum insulating glazing units. USP2012128329267.
  7. Sjursen,Walter P.; Leedom,Marvin A.; Mahoney,Derek D.; Margicin,John M.; Fritz,Frederick J.; Aceti,John G.; Preves,David A.; Palanisamy,Ponnusamy. Hearing aid with large diaphragm microphone element including a printed circuit board. USP2007057221768.
  8. Stark, David H.. Hermetically sealed micro-device package using cold-gas dynamic spray material deposition. USP2005086924974.
  9. Stark,David H.. Hermetically sealed micro-device package with window. USP2007077238546.
  10. Stark, David H. Insulated glazing units. USP2010117832177.
  11. Stark, David H.. Insulating glass unit having multi-height internal standoffs and visible decoration. USP2011087989040.
  12. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael. Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit. USP2016059328512.
  13. Zuniga-Ortiz, Edgar Rolando; Krenik, William R.. Micro-electro-mechanical system having movable element integrated into leadframe-based package. USP2014088796792.
  14. Zuniga-Ortiz, Edgar Rolando; Krenik, William R.. Micro-electro-mechanical system having movable element integrated into leadframe-based package. USP2012128338208.
  15. Zuniga-Ortiz, Edgar R.; Krenik, William R.. Microelectromechanical system having movable element integrated into substrate-based package. USP2014028648430.
  16. Schrank, Franz. Microphone arrangement and method for production thereof. USP2012068199963.
  17. Peter Madaffari ; Walter P. Sjursen ; Christopher Poux ; Richard Moroney ; Ponnusamy Palanisamy. Microphone assembly for hearing aid with JFET flip-chip buffer. USP2002046366678.
  18. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John. Multi-pane glass unit having seal with adhesive and hermetic coating layer. USP2015028950162.
  19. Mullenborn, Matthias; Scheel, Peter; Rombach, Pirmin. Pressure transducer. USP2004056732588.
  20. Sakai, Minekazu; Oota, Tameharu. Semiconductor device for providing capacitive semiconductor sensor and method for manufacturing capacitive semiconductor sensor. USP2010037678589.
  21. Suzuki, Toshihisa; Suzuki, Junya. Semiconductor microphone unit. USP2009087579678.
  22. Lee,Yeong Gyu; An,Seung Do. Semiconductor package and packaging method using flip-chip bonding technology. USP2006087098535.
  23. Mullenborn, Matthias; Kuhmann, Jochen F.; Scheel, Peter. Surface mountable transducer system. USP2012018103025.
  24. Mullenborn,Matthias; Kuhmann,Jochen F.; Scheel,Peter. Surface mountable transducer system. USP2008117447323.
  25. Mullenborn,Matthias; Kuhmann,Jochen F.; Scheel,Peter. Surface mountable transducer system. USP2007057221767.
  26. Hung, Li-Wen; Knickerbocker, John U.. System for continuous monitoring of body sounds. USP2018029900677.
  27. Stark, David H.. Wafer-level hermetic micro-device packages. USP2009047517712.