초록

Described is a hot pressed and sintered sputtering target assembly formed of hot pressed and sintered metal powder diffusion bonded together and to a backing plate by use of an intermediate adhesion layer of titanium or titanium alloy.

대표청구항 ▼

[ Accordingly, the invention should be limited only by the appended claims wherein what is claimed is:] [1.] A hot pressed and sintered sputtering target assembly comprising a hot pressed and sintered target surface diffusion bonded to a backing plate with a hot pressed and sintered intermediate adh

[ Accordingly, the invention should be limited only by the appended claims wherein what is claimed is:] [1.] A hot pressed and sintered sputtering target assembly comprising a hot pressed and sintered target surface diffusion bonded to a backing plate with a hot pressed and sintered intermediate adhesion layer between the target surface and backing plate, the backing plate comprising aluminum, aluminum alloy, titanium or titanium alloy, said intermediate layer comprising titanium or titanium alloy, and said target surface comprising: (1) a mixture of titanium hydride and tungsten, or (2) tungsten or tungsten alloy, or (3) titanium and tungsten powder, or (4) titanium or titanium alloy, or (5) cobalt or cobalt alloy; said target assembly being capable of sputtering use at higher power levels than at which solder-bonded target assemblies of the same materials can be used.