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Thermosyphon-powered jet-impingement cooling device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0758025 (1996-11-27)
발명자 / 주소
  • Remsburg Ralph
대리인 / 주소
    Klima & Pezzlo, P.C.
인용정보 피인용 횟수 : 35  인용 특허 : 15

초록

A thermosyphon-powered jet-impingement cooling device delivering superior thermal energy dissipation for compact heat sources such as electronic devices. Thermal energy from a heat source travels through the heat source/heat spreader plate interface to the heat spreader plate and heat spreader plate

대표청구항

[ I claim:] [1.] A natural convection heat transferring apparatus for transferring heat energy from a higher temperature heat source to a lower temperature heat sink, said apparatus comprising:a heat spreader plate;a heat sink;a toric body connected to and positioned above and in thermal contact wit

이 특허에 인용된 특허 (15)

  1. Hamadah Talal T. (Littleton MA) Ryder Douglas N. (Amherst NH) Friedman Harvey S. (Sudbury MA), Apparatus for controlled air-impingement module cooling.
  2. Mittal Faquir C. (Audubon PA), Apparatus for cooling integrated circuit chips with forced coolant jet.
  3. Fujii Masao (Hyogo JPX) Nakao Kazushige (Hyogo JPX) Tetsuno Haruo (Hyogo JPX), Boiling cooling apparatus.
  4. Tobey Richard (648 Sheraton Dr. Sunnyvale CA 94087), Computer element performance enhancer.
  5. Hwang Un-Pah (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Dual-pull air cooling for a computer frame.
  6. Dunn Robert M. (Endicott NY) Schulman Martin D. (Wappingers NY) Timko ; Jr. Nicholas (Johnson City NY), Electronic circuit module cooling.
  7. Mitsuoka Hiroshi (Amagasaki JA), Heat transferring apparatus.
  8. Bland Timothy J. (Rockford IL) Niggemann Richard E. (Rockford IL), Impingement cooling apparatus for heat liberating device.
  9. Paterson Robert W. (Seneca SC), Integrated circuit cooling device having internal baffle.
  10. Lee James C. K. (Los Altos Hills CA), Integrated circuit packaging systems with double surface heat dissipation.
  11. Hunsperger Robert G. (Newark DE), Monolithic Peltier temperature controlled junction.
  12. Richman Jay L. (Montville NJ), Peltier junction used for thermal control of solid state devices.
  13. Crowe Lawrence E. (Lindenwood IL), Plate fin/chic heat exchanger.
  14. Gabuzda Paul G. (Laguna Beach CA), Segmented heat sink device.
  15. Ohashi Shigeo (Chiyoda JPX) Kuwabara Heikichi (Minori JPX) Nakajima Tadakatsu (Chiyoda JPX) Nakayama Wataru (Kashiwa JPX) Sato Motohiro (Minori JPX) Kasai Kenichi (Ushiku JPX), Semiconductor cooling apparatus and cooling method thereof.

이 특허를 인용한 특허 (35)

  1. Sanjay K. Roy, Active cold plate/heat sink.
  2. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.
  3. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.
  4. Breier,Anton; Kamagata,Hidetoshi, Cooling apparatus.
  5. Mikubo,Kazuyuki; Kitajo,Sakae; Sasaki,Yasuhiro; Ochi,Atsushi; Yamamoto,Mitsuru, Cooling device for electronic apparatus.
  6. Chu, Richard C.; Ellsworth, Jr., Micheal J.; Simons, Robert E., Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader.
  7. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  8. Hartke, David J; Dibene, II, Joseph T.; Derian, Edward J.; Broder, James M., Integrated power delivery and cooling system for high power microprocessors.
  9. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  10. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.
  11. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
  12. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
  13. Sauciuc, Ioan; Chrysler, Gregory M., Localized microelectronic cooling apparatuses and associated methods and systems.
  14. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  15. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
  16. Chen, Richard T.; Tan, Will J., Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems.
  17. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.
  18. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.
  19. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  20. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  21. Beckman Jerry L., Power adapter having a thermal cooling assembly for a digital information appliance.
  22. Dede, Ercan Mehmet, Power modules, cooling devices and methods thereof.
  23. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
  24. Yoshida, Tadafumi; Osada, Hiroshi; Yokoi, Yutaka, Semiconductor element cooling structure.
  25. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
  26. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  27. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  28. Chen, Richard T.; Tan, Will J., Thermal management systems, methods for making, and methods for using.
  29. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  30. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  31. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  32. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
  33. Yagoobi, Jamal Seyed; Pearson, Matthew R., Two-phase heat transport device using electrohydrodynamic conduction pumping.
  34. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
  35. Joseph T. Dibene, II ; Farhad Raiszadeh, Vapor chamber with integrated pin array.
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