초록 ▼

A position detection system is provided which, without physical contact, by the use of detected infrared energy emissions determines whether there is correct placement of one or more small objects, e.g., lead frames, on the lower half of a two-part die mold in a semiconductor component manufacturing

A position detection system is provided which, without physical contact, by the use of detected infrared energy emissions determines whether there is correct placement of one or more small objects, e.g., lead frames, on the lower half of a two-part die mold in a semiconductor component manufacturing process. This takes place prior to injection of an initially molten material that solidifies and encapsulates the small objects upon curing and cooling.

대표청구항 ▼

[ What is claimed is:] [15.] A sensor apparatus for detecting a predetermined disposition of at least one lead frame on a die mold surface, comprising:a respective fiber optic probe for each of the at least one lead frame and a surface of the die mold, each fiber optic probe being mounted on an inlo

[ What is claimed is:] [15.] A sensor apparatus for detecting a predetermined disposition of at least one lead frame on a die mold surface, comprising:a respective fiber optic probe for each of the at least one lead frame and a surface of the die mold, each fiber optic probe being mounted on an inloader head located above the at least one lead frame and operatively coupled to a computer, detecting respective infrared energy emissions from the at least one lead frame and the die mold;an interference filter quantifying all of the detected infrared energy emissions at a specific wavelength;a silicon diode cooperating with the interference filter, generating outputs in correspondence with each of the quantified infrared energy emissions;a conditioning circuit, amplifying the outputs from the silicon diode and providing corresponding low impedance outputs; andan analog input circuit receiving the low impedance outputs and operatively coupled to a computer to provide corresponding inputs thereto, wherein the computer is configured to terminate operation of the sensor apparatus when a time rate of change of a temperature difference between the at least one lead frame and the die mold is outside a previously determined range.