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Jet soldering system and method

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-003/06
출원번호 US-0935525 (1997-09-22)
발명자 / 주소
  • Watts
  • Jr. Hal G.
  • Balog Robert J.
  • Freeman Gary T.
출원인 / 주소
  • MPM Corporation
대리인 / 주소
    Mintz, Levin, Cohn, Ferris, Glovsky and Popeo, P.C.
인용정보 피인용 횟수 : 20  인용 특허 : 17

초록

An apparatus for depositing a selected pattern of solder onto a substrate comprising a substrate support, a solder ejector, and a gas-delivery system associated with the solder ejector. The substrate support has structure for bearing a substrate on which one or more electronic components are to be m

대표청구항

[ What is claimed is:] [1.] An apparatus for depositing a selected pattern of solder onto a substrate on which one or more electronic components are to be mounted, the apparatus comprisinga substrate support having structure for bearing a substrate on which one or more electronic components are to b

이 특허에 인용된 특허 (17)

  1. Murakami Hajime (Kawasaki JPX) Fukuda Takashi (Kawasaki JPX), Apparatus for forming solder-film on printed-wiring board.
  2. Galetto ; Louis Valentine ; Meier ; Johann Hans ; Pimbley ; Walter Tho rnton ; Wolfe ; Bruce Allen, Bi-directional dot matrix printer with slant control.
  3. Marlow ; Richard Z., Charge pattern development method and apparatus.
  4. Smith Ted M. (Austin TX) Winstead Russell E. (Raleigh NC), Electrodynamic pump for dispensing molten solder.
  5. Ziegler Alex R. (Los Gatos CA), Funnel and automatic supply system for liquid nitrogen.
  6. Akers Larry D. (Vermilion OH) Scholl Charles H. (Vermilion OH) Smith Joseph S. (Euclid OH) Williams Edward A. (Elyria OH), Hot melt adhesive dispensing system of the hand held gun type.
  7. Lewis, John D.; Keeling, Michael R.; Bowen, David R.; Paton, Anthony D., Ink jet printing apparatus correctional in drop placement errors.
  8. Logan David J. (Glastonbury CT) Rich Leonard G. (West Hartford CT), Ink jet printing randomizing droplet placement apparatus.
  9. Hayes Donald J. (Plano TX) Boldman Michael T. (Garland TX) Wallace David B. (Dallas TX), Method and apparatus for dispensing spherical-shaped quantities of liquid solder.
  10. La, Duong; Ciardella, Robert L.; Babiarz, Alec J.; Bouras, Carlos E., Method for rapid dispensing of minute quantities of viscous material.
  11. Hieber Hartmann (Hamburg DEX), Method of applying small drop-shaped quantities of melted solder from a nozzle to surfaces to be wetted and device for c.
  12. Watanabe Toshio (Atsugi JPX) Sato Masahiko (Atsugi JPX) Osabe Akio (Atsugi JPX) Sakayori Hiroyuki (Souka JPX) Mase Akira (Atsugi JPX), Method of filling a liquid crystal device with ferroelectric liquid crystal material.
  13. Hayes Donald J. (Plano TX), Method of making solder interconnection arrays.
  14. Hayes Donald J. (Plano TX), Methods and apparatus for soldering without using flux.
  15. Schoenthaler David (Lower Makefield Township ; Bucks County PA) Wojcik Thaddeus (Hopewell Township ; Mercer County NJ), Techniques for multipoint dispensing of viscous material.
  16. Teumer Roger G. (Fairport NY), Tilted deflection electrode method and apparatus for liquid drop printing systems.
  17. Yamamoto Kazushi (Nara JPX) Nagai Takeshi (Nara JPX) Hirai Nobuyuki (Neyagawa JPX) Mori Shunichiro (Yamatokoriyama JPX), Ultrasonic liquid ejecting unit and method for making same.

이 특허를 인용한 특허 (20)

  1. Koyanagi, Mitsumasa; Tanaka, Tetsu; Fukushima, Takafumi, Chip support substrate, chip support method, three-dimensional integrated circuit, assembly device, and fabrication method of three-dimensional integrated circuit.
  2. Farnworth Warren M., Continuous mode solder jet apparatus.
  3. Farnworth Warren M., Continuous mode solder jet apparatus.
  4. Farnworth Warren M., Continuous mode solder jet apparatus.
  5. Farnworth, Warren M., Continuous mode solder jet apparatus.
  6. Farnworth,Warren M., Continuous mode solder jet apparatus.
  7. Warren M. Farnworth, Continuous mode solder jet apparatus.
  8. Farnworth, Warren M., Continuous mode solder jet method.
  9. Hansson, Jens; Kronstedt, Johan; Holm, William, Device for applying drops of a fluid on a surface.
  10. Muntz Eric Phillip ; Orme-Marmarelis Melissa E. ; Pham-Van-Diep Gerald C. ; Balog Robert J., High speed jet soldering system.
  11. Orme-Marmerelis, Melissa; Smith, Robert F., High-speed direct writing with metallic microspheres.
  12. Prentice, Thomas C.; Crouch, Kenneth C., Method and apparatus for dispensing a viscous material on a substrate.
  13. Brouillette Guy Paul,CAX ; Gruber Peter Alfred ; Maurer Frederic, Method and apparatus for forming solder bumps.
  14. Brouillette, Guy Paul; Gruber, Peter Alfred; Maurer, Frederic, Method and apparatus for forming solder bumps.
  15. Guy Paul Brouillette CA; Peter Alfred Gruber ; Frederic Maurer, Method and apparatus for forming solder bumps.
  16. Farnworth, Warren M., Method for continuous mode solder jet apparatus.
  17. Warren M. Farnworth, Method for generating continuous stream of liquid metal droplets.
  18. Azdasht, Ghassem, Method for the production of a soldered joint.
  19. Cho Yeuk-Chow, Semiconductor die bumping method utilizing vacuum stencil.
  20. Alfred I-Tsung Pan, Three-dimensional interconnect system.
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