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Pressure actuated sealing diaphragm for chucks 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H02N-013/00
출원번호 US-0808976 (1997-02-19)
발명자 / 주소
  • Herchen Harald
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Janah
인용정보 피인용 횟수 : 30  인용 특허 : 12

초록

A sealing structure 20 for forming a seal around a chuck 30 used to hold a substrate 45 having a peripheral edge 50. An actuated, position-adjustable, sealing diaphragm 165 is disposed along the peripheral edge of the substrate. The diaphragm has a conformal sealing surface 170 capable of forming a

대표청구항

[ What is claimed is:] [1.] A sealing structure for forming a seal around a chuck, the sealing structure comprising:(a) a chuck for holding a substrate having a peripheral edge;(b) an actuated, position-adjustable, sealing diaphragm disposed along the peripheral edge of the substrate, the diaphragm

이 특허에 인용된 특허 (12)

  1. Antoshenkov Gennady (Amherst NH), Byte aligned data compression.
  2. Shamouilian Shamouil (San Jose CA) Tanase Yoshi (Campbell CA), Corrosion resistant electrostatic chuck.
  3. Hayes Lawrence P. (Berlin VT), Distortion free 3 point vacuum fixture.
  4. Kitabayashi Tetsuo (Fukuoka JPX) Obara Atsushi (Fukuoka JPX) Miyagi Jun (Fukuoka JPX) Sago Yasumi (Tokyo JPX) Sasaki Masami (Tokyo JPX), Electrostastic chuck.
  5. Horwitz Christopher M. (Summer Hill AUX) Boronkay Stephen (Bondi AUX), Electrostatic chuck using A.C. field excitation.
  6. Frutiger William A. (Beverly MA), Electrostatic wafer clamp.
  7. Abe, Naomichi, Method and apparatus for dry etching and electrostatic chucking device used therein.
  8. Arami Junichi (Tokyo JPX) Fukasawa Kazuo (Kofu JPX) Ito Takashi (Tokyo JPX), Mount for supporting substrates and plasma processing apparatus using the same.
  9. Tsukada Tsutomu (Tokyo JPX) Takei Hideo (Tokyo JPX), Plasma device comprising an intermediate electrode out of contact with a high frequency electrode to induce electrostati.
  10. Chapman Robert A. (972-6 Asilomar Ter. Sunnyvale CA 94086), Plasma reactor with magnet for protecting an electrostatic chuck from the plasma.
  11. Briglia Donald D. (Los Altos CA), Substrate clamping technique in IC fabrication processes.
  12. Tezuka Masashi (Zama JPX), Vacuum processing apparatus wherein temperature can be controlled.

이 특허를 인용한 특허 (30)

  1. Miyashita, Kinya, Bipolar electrostatic chuck.
  2. Luo Jih-Shiuan (Sam), Capacitor coupled chuck for carbon dioxide snow cleaning system.
  3. Iizuka, Kentaro; Terajima, Masato, Chuck table.
  4. Carducci, James D; Noorbakhsh, Hamid; Lee, Evans Y; Pu, Bryan Y; Shan, Hongching; Bjorkman, Claes; Salimian, Siamak; Luscher, Paul E; Welch, Michael D, Dielectric etch chamber with expanded process window.
  5. Carducci, James D; Noorbakhsh, Hamid; Lee, Evans Y; Pu, Bryan Y; Shan, Hongching; Bjorkman, Claes; Salimian, Siamak; Luscher, Paul E; Welch, Michael D, Dielectric etch chamber with expanded process window.
  6. Gaff, Keith William; Busche, Matthew; Ricci, Anthony; Povolny, Henry S.; Stevenot, Scott, Edge seal for lower electrode assembly.
  7. Schaefer, David; Chhatre, Ambarish; Gaff, Keith William; Lee, Sung, Edge seal for lower electrode assembly.
  8. Schaefer, David; Chhatre, Ambarish; Gaff, Keith William; Lee, Sung; Lai, Brooke Mesler, Edge seal for lower electrode assembly.
  9. Moslehi, Mehrdad M.; Davis, Cecil J., Edge sealing structure for substrate in low-pressure processing environment.
  10. Cooke, Richard A., Electrostatic chuck.
  11. Satou, Tadayuki; Oka, Tadashi; Nakamura, Kyuzo, Electrostatic chuck and vacuum processing apparatus.
  12. Fujii,Tomoyuki; Ohashi,Tsuneaki, Electrostatic chuck having bonded structure and method of manufacturing the same.
  13. Lin, I-Kuan; Cooke, Richard A.; Rybczynski, Jakub, Electrostatic chuck with photo-patternable soft protrusion contact surface.
  14. Lin, I-Kuan; Cooke, Richard A.; Rybczynski, Jakub, Electrostatic chuck with photo-patternable soft protrusion contact surface.
  15. Cooke, Richard A.; Richard, Nate; Donnell, Steven; Vose, Mark; Liu, Yan, Electrostatic chuck with polymer protrusions.
  16. Jingbao Liu ; Judy Wang ; Takehiko Komatsu ; Bryan Y Pu ; Kenny L Doan ; Claes Bjorkman ; Melody Chang ; Yunsang Kim ; Hongching Shan ; Ruiping Wang, Etch method using a dielectric etch chamber with expanded process window.
  17. Cooke, Richard A.; Stone, Dale K.; Stone, Lyudmila; Blake, Julian; Suuronen, David, High surface resistivity electrostatic chuck.
  18. Tsai Cheng-Yuan,TWX ; Liu Chih-Chien,TWX ; Wu Juan-Yuan,TWX, Method for preventing an electrostatic chuck from being corroded during a cleaning process.
  19. Ikeda, Masayoshi, Method of substrate temperature control and method of assessing substrate temperature controllability.
  20. Kenney, Mark D., Perimeter seal for backside cooling of substrates.
  21. Schneider Gerhard ; Weldon Edwin C., Process chamber having improved gas distributor and method of manufacture.
  22. Nagai, Tsutomu, Substrate mounting table and substrate processing apparatus.
  23. Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate support assembly.
  24. Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate support assembly having rapid temperature control.
  25. Arai, Kenichiro; Nada, Kazunari, Substrate treatment method.
  26. Fujikawa, Takashi; Ishibashi, Masayuki; Iriguchi, Kazuhiro; Kawano, Kouhei, Susceptor for vapor phase epitaxial growth device.
  27. Steele,Mark Greg; Cochran,Dustin Alan, System and method for holding and releasing a workpiece for electrochemical machining.
  28. Ulf-Carsten Kirschstein DE; Stefan Risse DE; Christoph Damm DE; Thomas Peschel DE, System for receiving and retaining a substrate.
  29. Yamada, Hiroshi, Wafer inspection apparatus.
  30. Cleeves, James Montague, Wafer temperature control apparatus and method.
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