초록 ▼

A method and apparatus for attaching a pre-formed header module, e.g. a connector header module or an electrode bearing header module, etc., to a hermetically sealed enclosure of the implantable medical device, typically including electronic integrated circuits, batteries, electromechanical pumps, o

A method and apparatus for attaching a pre-formed header module, e.g. a connector header module or an electrode bearing header module, etc., to a hermetically sealed enclosure of the implantable medical device, typically including electronic integrated circuits, batteries, electromechanical pumps, or the like, are disclosed. A plurality of upstanding tabs that are fixed to the hermetically sealed enclosure, e.g. to the enclosure attachment surface, extend into a like plurality of tab channels formed in the header module housing. The upstanding tab(s) are inserted into the respective tab channel(s) during seating of the module and enclosure attachment surfaces and effects an initial alignment of the header module with the hermetically sealed enclosure. Each attachment tab has a retention feature formed on or in the tab that is designed to accommodate the flow of the thermoplastic material during the application of ultrasonic energy in the region of the tab channel and to cooperate with the solidified mass of thermoplastic material. During application of the ultrasonic energy, the thermoplastic material melts and flows into the remaining space of the tab channel and encapsulate the attachment tab including the retention feature. Upon termination of the ultrasonic energy, the thermoplastic housing material cools and solidifies and forms a continuous mass that encapsulates the surface of the attachment tab and the retention feature.

대표청구항 ▼

[ What is claimed is:] [1.] A method of attaching a hermetically sealed enclosure of an implantable medical device to a pre-formed thermoplastic material header module, comprising the steps of:forming a retention structure extending away from an enclosure attachment surface of the hermetically seale

[ What is claimed is:] [1.] A method of attaching a hermetically sealed enclosure of an implantable medical device to a pre-formed thermoplastic material header module, comprising the steps of:forming a retention structure extending away from an enclosure attachment surface of the hermetically sealed enclosure into proximity with a portion of the pre-formed header module when the enclosure attachment surface and a module attachment surface of the pre-formed header module are aligned in respect of one another, the retention structure comprising an upstanding attachment tab extending from a tab base to a tab free end and having an attachment feature disposed therein or thereon;attaching the tab base to the hermetically sealed enclosure at a predetermined location, the upstanding attachment tab extending in a predetermined direction away from the enclosure surface, the retention feature being disposed at a location away from the enclosure attachment surface;providing a tab channel in the header module, the tab channel being sized and oriented to receive the upstanding attachment tab therein when the enclosure attachment surface and the module attachment surface are aligned in respect of and brought into contact with one another;aligning and firmly seating the module attachment surface against the enclosure attachment surface, the upstanding attachment tab being received in the tab channel of the header module, the attachment feature being disposed within the channel;applying ultrasonic energy to a region of the pre-formed header module propinquant to the upstanding attachment tab and the tab channel, at least portions of the thermoplastic material of the header module in the region melting and flowing into intimate engagement with the upstanding tab and the attachment feature in response to the application of the ultrasonic energy thereto; andcooling the melted thermoplastic material until it solidifies around the upstanding attachment tab and the attachment feature.