초록 ▼

A cluster tool layer thickness measurement apparatus is part of a reactor cluster that includes a plurality of substrate processing reactors arranged around a sealed chamber in which a robot is located. The cluster tool layer thickness measurement apparatus is also mounted on the sealed chamber. Aft

A cluster tool layer thickness measurement apparatus is part of a reactor cluster that includes a plurality of substrate processing reactors arranged around a sealed chamber in which a robot is located. The cluster tool layer thickness measurement apparatus is also mounted on the sealed chamber. After a layer is deposited on a substrate in one of the reactors, the robot removes the substrate from the reaction chamber of the reactor and places the substrate directly in the cluster tool layer thickness measurement apparatus on a substrate support. A carriage assembly moves the substrate support and consequently the substrate under an optical thickness measurement assembly. Optical thickness measurement assembly generates a signal representative of the thickness of the layer at one point that is transmitted to a monitor computer. After the measurement is completed, the carriage assembly moves the substrate so that the thickness of a layer on the substrate is measured at each of a plurality of locations.

대표청구항 ▼

[ I claim:] [1.] A structure comprising:at least one substrate processing reactor;a sealed chamber having a plurality of ports wherein said at least one substrate processing reactor is connected to one port in said plurality of ports; anda cluster tool layer thickness measurement apparatus connected

[ I claim:] [1.] A structure comprising:at least one substrate processing reactor;a sealed chamber having a plurality of ports wherein said at least one substrate processing reactor is connected to one port in said plurality of ports; anda cluster tool layer thickness measurement apparatus connected to another port in said plurality of ports wherein said cluster tool layer thickness measurement apparatus is used only for measurements of layer thickness properties of a substrate processed in said at least one substrate processing reactor.