초록 ▼

An electronic apparatus comprising a housing, and an electronic part accommodated in the housing, wherein the housing includes a metallic member and a resin member molded integrally with the metallic member, the metallic member forming an outside part of the housing and being treated on its outer su

An electronic apparatus comprising a housing, and an electronic part accommodated in the housing, wherein the housing includes a metallic member and a resin member molded integrally with the metallic member, the metallic member forming an outside part of the housing and being treated on its outer surface for enhancing a coefficient of heat radiation.

대표청구항 ▼

[ What is claimed is:] [1.] An electronic apparatus comprising:a housing; andan electronic part accommodated in said housing, wherein said housing includes a metallic member and a resin member molded integrally with said metallic member, said metallic member forming an outside part of said housing,

[ What is claimed is:] [1.] An electronic apparatus comprising:a housing; andan electronic part accommodated in said housing, wherein said housing includes a metallic member and a resin member molded integrally with said metallic member, said metallic member forming an outside part of said housing, said metallic member having an outer surface treated with a material for enhancing a thermal emissivity thereof so that said material forms any one of an organic film and an inorganic film on said outer surface of said metallic member, said outer surface of any one of said organic film and said inorganic film having a surface roughness being at least a wavelength of infrared rays;a heat conductive member, wherein said heat conductive member is housed within said housing so as to be in contact with an inner surface of said metallic member and wherein said heat conductive member is for connecting said inner surface of said metallic member and said electronic part;a central processing unit, wherein said central processing unit is in contact with said heat conductive member; andwherein said heat conductive member comprises aluminum blocks bonded to an upper face of said central processing unit and an upper face of said metallic member.