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Computer having a heat sink structure incorporated therein 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0947655 (1997-10-09)
발명자 / 주소
  • Webb Matthew L.
출원인 / 주소
  • Compaq Computer Corporation
대리인 / 주소
    Konneker & Smith, P.C.
인용정보 피인용 횟수 : 21  인용 특허 : 22

초록

A computer having a heat sink structure incorporated therein provides efficient heat dissipation for heat generating components within the computer. In a preferred embodiment, a computer has a chassis, a circuit board with a heat generating device mounted thereon, and a structural member with a heat

대표청구항

[ What is claimed is:] [1.] A computing apparatus, comprising:a housing;a heat generating component disposed within the housing;a heat pipe; anda heat pipe retainer in said housing including a heat absorbing portion contacting the heat generating component, a conduit portion, and a heat dissipating

이 특허에 인용된 특허 (22)

  1. Chao Shun-Lung (Plano TX) McEwin ; Jr. Louis W. (Plano TX), Apparatus and method for cooling electronic devices.
  2. Haley Kevin (San Jose CA) Aghazadeh Mostafa (Chandler AZ) Xie Hong (Chandler AZ), Apparatus for dissipating heat in a hinged computing device.
  3. Leverault Craig M. (Mountain View CA) McCormick ; Jr. Michael F. (San Jose CA) Lajara Robert J. (San Jose CA) Lam Alan W. (Fremont CA) Ta Peter C. D. (Hayward CA) Stolz Howard W. (Soquel CA) Osborn J, Compact housing for a computer workstation.
  4. Hsieh Chih-Ho (Taipei TWX) Lee Ing-Jen (Hsin Tien TWX), Computer CPU heat dissipating and protecting device.
  5. Webb Matthew L., Computer having a heat sink structure incorporated therein.
  6. Penniman Mark B. ; Schlesener Carmen M. ; Kizer Jim J., Computer having a heat transfer system operably connected during assembly of a computer keyboard upon the computer.
  7. Xie Hong (Chandler AZ) Aghazadeh Mostafa (Chandler AZ) Turturro Gregory (Chandler AZ) Chiu Chia-Pin (Chandler AZ), Dissipation of heat through keyboard using a heat pipe.
  8. Ouchi Katsunori (Hitachi JPX) Morihara Atsushi (Katsuta JPX) Naganuma Yoshio (Hitachi JPX) Sato Koji (Hitachi JPX) Kaji Ryuichi (Kitaibaraki JPX), Electronic equipment and computer with heat pipe.
  9. Basiulis Algerd (Redondo Beach CA), Heat pipe cooling module for high power circuit boards.
  10. Penniman Mark B. (Austin TX) Schlesener Carmen M. (Pflugerville TX) Kizer Jim J. (Austin TX), Heat pipe device and method for attaching same to a computer keyboard.
  11. Bhatia Rakesh (Sunnyvale CA) Haley Kevin (San Jose CA), Heat pipe exchanger system for cooling a hinged computing device.
  12. Ishida Yoshio (Osaka JPX), Heat radiating apparatus.
  13. Swindler Dan (Austin TX), Heat sink/component access door for portable computers.
  14. Meyer ; IV George A. (Conestoga PA) Toth Jerome E. (Hatboro PA) Longsderff Richard W. (Lancaster PA), Integrated circuit cooling apparatus.
  15. Penniman Mark B. (Austin TX) Skillman Peter N. (San Carlos CA) Lillios Tony J. (Palo Alto CA) Boyle Dennis J. (Palo Alto CA), Integrated circuit dual cooling paths and method for constructing same.
  16. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL), Method of making a two-phase thermal bag component cooler.
  17. Kikinis Dan (20264 Ljepava Dr. Satatoga CA 95070), Microprocessor cooling in a portable computer.
  18. Nelson Daryl (Beaverton OR), Multiple-fan microprocessor cooling through a finned heat pipe.
  19. Cowans Kenneth W. (Fullerton CA), Refrigeration system and method for very large scale integrated circuits.
  20. Toedtman Thomas (Lake Forest CA) Welch Randall S. (Lake Forest CA), Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices.
  21. Nakamura Hiroshi (Tokyo JPX) Tomioka Kentaro (Sagamihara JPX) Ninomiya Kiyoumi (Tokyo JPX) Ogawa Hideki (Tokyo JPX) Nakajima Yuji (Tokyo JPX), Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and po.
  22. Larson Ralph I. (Bolton MA) Phillips Richard L. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for laptop computers.

이 특허를 인용한 특허 (21)

  1. Babcock, Raymond Floyd; Butterbaugh, Matthew Allen; Kang, Sukhvinder Singh, Apparatus and method for cooling a wearable computer.
  2. Daniel D. Gonsalves ; Robert S. Antonuccio, Chip cooling management.
  3. Homer, Steven S.; Lev, Jeffery A., Computer system having removable processor and modular thermal unit.
  4. Takeshi Hamano JP, Cooling mechanism, heat sink, electronic equipment and fabrication method therefor.
  5. Tadayon, Pooya; Monzon, Franklin G.; Dujari, Prateek, Electrical energy-generating heat sink system and method of using same to recharge an energy storage device.
  6. Tadayon,Pooya; Zaerpoor,Koorosh, Electrical energy-generating system and devices and methods related thereto.
  7. Chandrakant D. Patel ; Marvin S. Keshner, Heat dissipating chassis member.
  8. Zhou, Zhi-Yong; Qin, Ji-Yun; Liu, Hao-Xia, Heat dissipation device.
  9. Vinson,Wade D.; Franz,John P., Heat sink having compliant interface to span multiple components.
  10. Feng Ku Wang TW, Heat sink modular structure inside an electronic product.
  11. Sun Ming-Shen,TWX ; Lu Shao-Pai,TWX, Heat-dissipating module for an electronic device.
  12. Chung, Ming-Hung; Chiu, Chun-Teng; Lee, Yu-Chen, Heat-dissipation module and electronic apparatus having the same.
  13. Shun-lung Chao, Heatsink with embedded heat pipe for thermal management of CPU.
  14. Samaras Bill ; Brownell Michael ; McCutchan Dan R. ; Xie Hong, Integrated circuit cartridge.
  15. Yusuf Imran ; Xie Hong ; Cook ; Jr. Johnny M. ; Brandenburger Peter ; Chandran Biju ; Ekhlassi Hamid, Integrated circuit cartridge and method of fabricating the same.
  16. Brian A. Scott, Integrated circuit refrigeration device.
  17. Artman, Paul T.; Tunks, Eric, Multiple heat pipe heat sink.
  18. Atsuko Tanaka JP; Masuo Ohnishi JP, Radiator mechanism for information processor.
  19. Gilchrist Phillip C. ; O'Neal Sean P., Rotatable portable computer remote heat exchanger with heat pipe.
  20. Lu Chun-Hsin,TWX, Thermal module.
  21. Hasnain Shabbir ; Rakesh Bhatia, Thermally conductive interface member.
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