$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Device for gripping and holding substrates 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-014/50
  • B23Q-003/08
출원번호 US-0801644 (1997-02-18)
우선권정보 DE-0005598 (1996-02-15)
발명자 / 주소
  • Kempf Stefan,DEX
  • Reising Michael,DEX
출원인 / 주소
  • Singulus Technologies GmbH, DEX
대리인 / 주소
    Pillsbury Madison & Sutro
인용정보 피인용 횟수 : 67  인용 특허 : 2

초록

A device 1 for gripping and holding substrates 2 with one or several substrate holders 5 arranged in a vacuum chamber 4, 4', 4" and one or several displaceably arranged grippers 3, which can be displaced into a first position through the action of an operating pressure or against the action of a spr

대표청구항

[ We claim:] [1.] A device (1) for gripping and holding a substrate (2), said device comprising:a substrate holder (5) and substrate gripping means including at least one substrate gripper (3) displaceably mounted in said substrate holder, said substrate gripper being displaceable between a substrat

이 특허에 인용된 특허 (2)

  1. Tsymberov Leonid (Stoughton MA), Compact disk locking apparatus.
  2. Blaseck Klaus (Ehlershausen DEX), Crane operated lifting apparatus.

이 특허를 인용한 특허 (67)

  1. Strid, Eric; Gleason, K. Reed, Active wafer probe.
  2. Strid,Eric; Gleason,K. Reed, Active wafer probe.
  3. Rinaldi, Kenneth James, Apparatus and method for forming reflective layer of optical disc.
  4. Kok,Ronaldus Joannes Cornelis Maria; Hompus,Michael Adrianus Theodorus; Evers,Marinus Franciscus Johannes; Habraken,Anton; Dings,Franciscus Cornelius, Apparatus for performing at least one process on a substrate.
  5. Strid, Eric; Campbell, Richard, Calibration structures for differential signal probing.
  6. Campbell, Richard; Strid, Eric W.; Andrews, Mike, Differential signal probe with integral balun.
  7. Strid, Eric; Campbell, Richard, Differential signal probing system.
  8. Campbell, Richard L.; Andrews, Michael, Differential waveguide probe.
  9. Burcham, Terry; McCann, Peter; Jones, Rod, Double sided probing structures.
  10. Burcham,Terry; McCann,Peter; Jones,Rod, Double sided probing structures.
  11. Ken Lee ; Ke Ling Lee ; Mingwei Jiang ; Robert M. Martinson, Horizontal sputtering system.
  12. Andrews, Peter; Hess, David; New, Robert, Interface for testing semiconductors.
  13. Gleason, K. Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  14. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  15. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing structure with laterally scrubbing contacts.
  16. Gleason Reed ; Bayne Michael A. ; Smith Kenneth ; Lesher Timothy ; Koxxy Martin, Membrane probing system.
  17. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing system.
  18. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing system.
  19. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
  20. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
  21. Smith,Kenneth; Gleason,Reed, Membrane probing system.
  22. Smith,Kenneth; Gleason,Reed, Membrane probing system.
  23. Tervo, Paul A.; Smith, Kenneth R.; Cowan, Clarence E.; Dauphinais, Mike P.; Koxxy, Martin J., Membrane probing system.
  24. Tervo, Paul A.; Smith, Kenneth R.; Cowan, Clarence E.; Dauphinais, Mike P.; Koxxy, Martin J., Membrane probing system.
  25. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
  26. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
  27. Gleason K. Reed ; Smith Kenneth R. ; Bayne Mike, Membrane probing system with local contact scrub.
  28. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing system with local contact scrub.
  29. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing system with local contact scrub.
  30. Gleason,K. Reed; Smith,Kenneth R.; Bayne,Mike, Membrane probing system with local contact scrub.
  31. K. Reed Gleason ; Kenneth R. Smith ; Mike Bayne, Membrane probing system with local contact scrub.
  32. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth, Method for constructing a membrane probe using a depression.
  33. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth, Method for constructing a membrane probe using a depression.
  34. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Method for probing an electrical device having a layer of oxide thereon.
  35. Hayden, Leonard; Martin, John; Andrews, Mike, Method of assembling a wafer probe.
  36. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth, Method of constructing a membrane probe.
  37. Smith, Kenneth R., Method of replacing an existing contact of a wafer probing assembly.
  38. Strid,Eric; Campbell,Richard, On-wafer test structures for differential signals.
  39. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Probe construction using a recess.
  40. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  41. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  42. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  43. Campbell,Richard L.; Andrews,Michael; Bui,Lynh, Probe for high frequency signals.
  44. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Probe for testing a device under test.
  45. Smith, Kenneth; Jolley, Michael; Van Syckel, Victoria, Probe head having a membrane suspended probe.
  46. Smith,Kenneth; Jolley,Michael; Van Syckel,Victoria, Probe head having a membrane suspended probe.
  47. Schwindt,Randy, Probe holder for testing of a test device.
  48. Smith, Kenneth R.; Hayward, Roger, Probing apparatus with impedance optimized interface.
  49. Smith, Kenneth R., Replaceable coupon for a probing apparatus.
  50. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for high-frequency testing of a device under test.
  51. Gleason, K. Reed; Lesher, Tim; Strid, Eric W.; Andrews, Mike; Martin, John; Dunklee, John; Hayden, Leonard; Safwat, Amr M. E., Shielded probe for testing a device under test.
  52. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  53. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  54. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  55. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
  56. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
  57. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe with low contact resistance for testing a device under test.
  58. Lee Ke Ling ; Mazur Mikhail ; Lee Ken ; Martinson Robert M., System and method for handling and masking a substrate in a sputter deposition system.
  59. Ke Ling Lee ; Mikhail Mazur ; Ken Lee ; Robert M. Martinson, System and method for transporting and sputter coating a substrate in a sputter deposition system.
  60. Andrews, Peter; Hess, David, System for testing semiconductors.
  61. Campbell, Richard, Test structure and probe for differential signals.
  62. Campbell,Richard, Test structure and probe for differential signals.
  63. Hayden, Leonard; Martin, John; Andrews, Mike, Wafer probe.
  64. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  65. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  66. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  67. Campbell, Richard, Wideband active-passive differential signal probe.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로