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Polishing pad with controlled release of desired micro-encapsulated polishing agents 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-001/00
출원번호 US-0892777 (1997-07-15)
발명자 / 주소
  • Miller Matthew Kilpatrick
  • Morgan Clifford Owen
  • Rutten Matthew Jeremy
  • Walton Erick G.
  • Wright Terrance Monte
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Walter, Jr.
인용정보 피인용 횟수 : 49  인용 특허 : 12

초록 ▼

A desired reagent is delivered to a workpiece undergoing a chemical mechanical polishing process with a chemical mechanical planarization apparatus. A slurry and polishing pad are provided for the polishing process. Reagent containing microcapsules are also provided, the microcapsules encapsulating

대표청구항 ▼

[ What is claimed is:] [1.] A method for delivering a component to a workpiece undergoing a chemical mechanical polishing process with a chemical mechanical planarization apparatus, said method comprising the steps of:providing a chemical mechanical planarization apparatus for performing a chemical

이 특허에 인용된 특허 (12)

  1. Copeland Claude T. (Appleton WI), Capsule coating.
    상세보기
  2. Shackle Dale Richard (Scottsboro AL), Cross-linked hydroxypropylcellulose microcapsules and process for making.
    상세보기
  3. Woo Yen-Kong (1545 Geary Blvd. San Francisco CA 94115), Fragrance impregnated fabric.
    상세보기
  4. Hasegawa Fumihiko (Urawa JPX) Ohtani Tatsuo (Fukushima JPX) Kawano Hiroshi (Fukushima JPX) Yamada Masayuki (Shirakawa JPX), Method and an apparatus for polishing wafer chamfers.
    상세보기
  5. Mattingly Wayne A. (Rio Rancho NM) Morimoto Seiichi (Beaverton OR) Preston Spencer E. (Portland OR), Method for conditioning the surface of a polishing pad.
    상세보기
  6. Kamen Melvin E. (Highlands NJ) Bernstein Philip (Glen Ridge NJ) Rivero Rene T. (West New York NJ), Method of encapsulating pigment particles useful in the manufacturing of cosmetic products and the products thereof.
    상세보기
  7. Sakao Masato (Tokyo JPX), Method of manufacturing semiconductor device using chemical-mechanical polishing.
    상세보기
  8. Mathiowitz Edith (Brookline MA) Langer Robert S. (Somerville MA) Warshawsky Abraham (Rehovot MA ILX) Edelman Elazar (Brookline MA), Polymer composite for controlled release or membrane formation.
    상세보기
  9. Ogata Yasuhiro (Shizuoka JPX) Maekawa Masakazu (Shizuoka JPX), Pressure-sensitive recording sheets.
    상세보기
  10. Shackle Dale Richard (Box 151 ; Rte. 5 Scottsboro AL 35768) Schwab Gerhart (Rte. 9 ; Box 750 Chillicothe OH 45601), Process for the production of self-contained carbonless copy record sheets.
    상세보기
  11. Shackle Dale R. (Chillicothe OH) Schwab Gerhart (Chillicothe OH), Process for the production of self-contained carbonless copy record sheets and coating composition for use therein.
    상세보기
  12. Doan Trung (Boise ID) Tuttle Mark E. (Boise ID) Lowrey Tyler A. (Boise ID), Process to mechanically and plastically deform solid ductile metal to fill contacts of conductive channels with ductile.
    상세보기

이 특허를 인용한 특허 (49)

  1. Molnar, Charles J., Abrasive finishing with lubricant and tracking.
    상세보기
  2. Molnar Charles J, Abrasive finishing with partial organic boundary layer.
    상세보기
  3. Johnson, Andrew; Gilbert, John R.; Deshpande, Manish; Lewis, Hugh; Bunner, Bernard, Actuation of parallel microfluidic arrays.
    상세보기
  4. Johnson, Andrew; Gilbert, John R.; Deshpande, Manish; Lewis, Hugh; Bunner, Bernard, Actuation of parallel microfluidic arrays.
    상세보기
  5. Easter William Graham ; Maze John Albert ; Miceli Frank, Apparatus and method for conditioning a polishing pad.
    상세보기
  6. Cooney, Daniel E., Approach for indicating the occurrence of a mechanical impact on a material, such as a low-ductility composite material.
    상세보기
  7. Steckenrider, J. Scott; Mueller, Brian L., Chemical mechanical polishing slurry and method for using same.
    상세보기
  8. Ihnfeldt, Robin, Contact release capsule useful for chemical mechanical planarization slurry.
    상세보기
  9. Ihnfeldt, Robin, Contact release capsule useful for chemical mechanical planarization slurry.
    상세보기
  10. Molnar, Charles J., Controlled lubricated finishing.
    상세보기
  11. Molnar, Charles J., Finishing components and elements.
    상세보기
  12. Molnar, Charles J, Finishing element using finishing aids.
    상세보기
  13. Charles J Molnar, Finishing element with finishing aids.
    상세보기
  14. Molnar, Charles J, Finishing method for semiconductor wafers using a lubricating boundary layer.
    상세보기
  15. Charles J Molnar, Finishing semiconductor wafers with a fixed abrasive finishing element.
    상세보기
  16. Charles J. Molnar, Finishing with partial organic boundary layer.
    상세보기
  17. Molnar Charles J, Fixed abrasive finishing element having aids finishing method.
    상세보기
  18. Molnar Charles J, Fixed abrasive finishing method using lubricants.
    상세보기
  19. Molnar, Charles J., In situ control with lubricant and tracking.
    상세보기
  20. Molnar,Charles J, In situ finishing control.
    상세보기
  21. Molnar, Charles J, In situ friction detector method and apparatus.
    상세보기
  22. Chopra, Dinesh; Meikle, Scott G., Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates.
    상세보기
  23. Chopra, Dinesh; Meikle, Scott G., Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates.
    상세보기
  24. Moon, Yongsik; Mai, David; Wijekoon, Kapila; Bajaj, Rajeev; Surana, Rahul; Hu, Yongqi; Kaushal, Tony S.; Li, Shijian; Li, Jui-Lung; Wang, Shi-Ping; Lam, Gary; Redeker, Fred C., Method and apparatus for polishing metal and dielectric substrates.
    상세보기
  25. Basol, Bulent M.; Uzoh, Cyprian E.; Talieh, Homayoun, Method and system to provide material removal and planarization employing a reactive pad.
    상세보기
  26. Basol, Bulent M.; Bogart, Jeffrey A.; Velazquez, Efrain, Method for monitoring and controlling force applied on workpiece surface during electrochemical mechanical processing.
    상세보기
  27. Li, Shijian; Li, Jui-Lung; Wang, Shi-Ping; Lam, Gary; Mai, David; Redeker, Fred C., Method of chemical mechanical polishing with high throughput and low dishing.
    상세보기
  28. Li,Shijian; Li,Jui Lung; Wang,Shi Ping; Lam,Gary; Mai,David; Redeker,Fred C., Method of chemical mechanical polishing with high throughput and low dishing.
    상세보기
  29. Ide Satoru,JPX ; Yamada Tsutomu,JPX ; Hayashi Norio,JPX, Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing.
    상세보기
  30. Westmoreland,Donald L., Method of planarizing a surface.
    상세보기
  31. Mingming Fang, Method of polishing a memory or rigid disk with an ammonia-and/or halide-containing composition.
    상세보기
  32. Moon, Yongsik; Mai, David; Wijekoon, Kapila; Bajaj, Rajeev; Surana, Rahul; Hu, Yongqi; Kaushal, Tony S.; Li, Shijian; Li, Jui-Lung; Wang, Shi-Ping; Lam, Gary; Redeker, Fred C., Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects.
    상세보기
  33. Maldonado,Raul; Perez,Efren, Perfumed abrasive pad and manufacturing procedure.
    상세보기
  34. Bunyan,Michael H.; Clement,Thomas A.; Hannafin,John J.; LaRosee,Marc E.; Young,Kent M., Polishing article for electro-chemical mechanical polishing.
    상세보기
  35. Hiroyuki Yano JP, Polishing cloth and method of manufacturing semiconductor device using the same.
    상세보기
  36. Yano, Hiroyuki, Polishing cloth and method of manufacturing semiconductor device using the same.
    상세보기
  37. De Rege Thesauro,Francesco; Brusic,Vlasta; Thompson,Christopher C.; Bayer,Benjamin P., Polishing composition for noble metals.
    상세보기
  38. Saikin, Alan H., Polishing pad and method of manufacture.
    상세보기
  39. Doi, Toshiro; Seshimo, Kiyoshi; Takagi, Masataka; Kashiwada, Hiroshi, Polishing pad and polishing method.
    상세보기
  40. Cherian, Isaac K.; Anjur, Sriram P.; Grumbine, Steven K., Polishing pad comprising particles with a solid core and polymeric shell.
    상세보기
  41. Huh, Hyun; Lee, Sang Mok; Song, Kee Cheon; Kim, Seung geun; Son, Do Kwon, Polishing pad containing embedded liquid microelements and method of manufacturing the same.
    상세보기
  42. Huh, Hyun; Lee, Sang-Mok; Song, Kee-Cheon; Kim, Seung-geun; Son, Do-Kwon, Polishing pad containing embedded liquid microelements and method of manufacturing the same.
    상세보기
  43. Molnar, Charles J, Semiconductor wafer finishing control.
    상세보기
  44. Gilbert, John R.; Lewis, Hugh; Beaupre, Derek; Trikha, Jaishree; Deshpande, Manish, Unitary cartridge for particle processing.
    상세보기
  45. Gilbert, John R.; Lewis, Hugh; Beaupre, Derek; Trikha, Jaishree; Deshpande, Manish, Unitary cartridge for particle processing.
    상세보기
  46. Oey Hewett, Joyce S.; Pasadyn, Alexander J., Use of slurry waste composition to determine the amount of metal removed during chemical mechanical polishing, and system for accomplishing same.
    상세보기
  47. Uzoh, Cyprian E.; Basol, Bulent M., Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same.
    상세보기
  48. Uzoh,Cyprian E.; Basol,Bulent M., Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same.
    상세보기
  49. Molnar,Charles J., situ finishing aid control.
    상세보기

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