초록 ▼

A carrier is comprised of a thermoplastic polymer such as polyetheretherketone which is formed or fabricated as a uniform thickness, double sided flat sheet of material with wafer passages therethrough and gear teeth formed or fabricated around the peripheral edge thereof so as to be cooperative wit

A carrier is comprised of a thermoplastic polymer such as polyetheretherketone which is formed or fabricated as a uniform thickness, double sided flat sheet of material with wafer passages therethrough and gear teeth formed or fabricated around the peripheral edge thereof so as to be cooperative with a wafer polishing machine. An extrusion or rolling or calendering process provides a flat carrier which is, optionally, coated with thermoset polymer or thermoplastic film.

대표청구항 ▼

[ It is claimed:] [9.] A method for polishing the opposite surfaces of a thin wafer of material comprising, in combination, the steps of:placing the wafer in a congruent shaped holding passage defined through a carrier gear of the type comprising a sheet of single layer, uniform thickness thermoplas

[ It is claimed:] [9.] A method for polishing the opposite surfaces of a thin wafer of material comprising, in combination, the steps of:placing the wafer in a congruent shaped holding passage defined through a carrier gear of the type comprising a sheet of single layer, uniform thickness thermoplastic polymer with means for coaction with a wafer polishing apparatus said polymer having a tensile strength at break of at least about 8,000 psi;positioning the wafer and carrier gear in a polishing apparatus of the type having platens on opposite sides of the carrier gear in opposed relation to the wafer;injecting a polishing slurry to cover the wafer; anddriving the carrier gear between the platens to polish the wafer.