초록 ▼

The present invention is directed to improved methods and apparatuses for manufacturing microfabricated devices, and particularly, microfluidic devices. In general the methods and apparatuses of the invention provide improved methods of bonding substrates together by applying a vacuum to the space b

The present invention is directed to improved methods and apparatuses for manufacturing microfabricated devices, and particularly, microfluidic devices. In general the methods and apparatuses of the invention provide improved methods of bonding substrates together by applying a vacuum to the space between the substrates during the bonding process.

대표청구항 ▼

[ What is claimed is:] [1.] A method of forming microfluidic devices comprising:providing a first substrate having at least a first planar surface, a second surface opposite the planar surface, and having a plurality of apertures disposed through the first substrate from the first surface to the sec

[ What is claimed is:] [1.] A method of forming microfluidic devices comprising:providing a first substrate having at least a first planar surface, a second surface opposite the planar surface, and having a plurality of apertures disposed through the first substrate from the first surface to the second surface;applying a vacuum to the apertures;mating the first planar surface of the first substrate with a first planar surface of a second substrate, wherein at least one of the first planar surface of the first substrate and the first planar surface of the second substrate comprises at least two intersecting channels fabricated therein, each of the channels being in fluid communication with at least one of the apertures disposed through the first substrate when the first and second substrates are mated; andbonding the first surface of the first substrate to the first surface of the second substrate.