초록 ▼

A system and method for applying fluids, including fiberized hot melt adhesive, onto a substrate from one or more meltblowing die assemblies mounted on a manifold that supplies fluid thereto. At least one of the die assemblies is selected from a group of die assemblies having different configuration

A system and method for applying fluids, including fiberized hot melt adhesive, onto a substrate from one or more meltblowing die assemblies mounted on a manifold that supplies fluid thereto. At least one of the die assemblies is selected from a group of die assemblies having different configurations of fluid dispensing orifices, wherein various combinations of the different die assembly configurations are mountable onto the manifold to provide a wide range of partial fluid dispensing patterns onto the substrate. Each of the plurality of fluid dispensing orifices are flanked by an air dispensing orifice disposed on opposing sides thereof, wherein air dispensing orifices may extend across a portion of the remaining portion of the meltblowing die assembly void of fluid dispensing orifices. At least one of the die assemblies having air dispensing orifices arranged relative to the fluid dispensing orifices to increasingly decrease an oscillation amplitude of fluid dispensed from the fluid dispensing orifices approaching an endmost fluid dispensing orifice thereof.

대표청구항 ▼

[ What is claimed is:] [1.] A system useable for applying fluids including fiberized adhesives onto a substrate from at least one die assembly mountable on a mounting surface of a manifold that supplies fluid to the at least one die assembly, the at least one die assembly selected from a group consi

[ What is claimed is:] [1.] A system useable for applying fluids including fiberized adhesives onto a substrate from at least one die assembly mountable on a mounting surface of a manifold that supplies fluid to the at least one die assembly, the at least one die assembly selected from a group consisting essentially of:a first die assembly having a first plurality of fluid dispensing orifices disposed across a first portion of a first dispensing surface extending from one of the right and left sides of the first die assembly toward a first intermediate portion of the first die assembly, and a remaining first portion of the first die assembly extending from the first intermediate portion toward the other of the left and right sides of the first die assembly void of fluid dispensing orifices;a second die assembly having a second plurality of fluid dispensing orifices disposed across right and left lateral portions of a second dispensing surface of the second die assembly extending from right and left sides of the second die assembly, and a remaining second portion of the second dispensing surface intermediate the right and left lateral portions of the second die assembly void of fluid dispensing orifices,a third die assembly having a third plurality of fluid dispensing orifices disposed across a third intermediate portion of a third dispensing surface, the third intermediate portion spaced from right and left sides of the third die assembly, and remaining right and left lateral portions of the third dispensing surface of the third die assembly void of fluid dispensing orifices. [33.] A method for applying fluids including fiberized adhesives onto a substrate, the method comprising:supplying fluid to at least a first die assembly mounted on a mounting surface of a manifold;applying fluid to portions of the substrate substantially opposite a first plurality of fluid dispensing orifices disposed across a first portion of a first dispensing surface extending from one of right and left sides of the first die assembly toward a first intermediate portion of the first die assembly; andnot applying fluid to other portions of the substrate substantially opposite a remaining first portion of the first dispensing surface extending from the first intermediate portion toward the other of the left and right sides of the first die assembly void of fluid dispensing orifices.