초록 ▼

The preferred embodiment of the present invention provides a structure and method for personalizing a semiconductor device in the context of a bump array connection to packaging, substrates and such. The preferred embodiment method uses a plurality of conduction lines on said semiconductor device, i

The preferred embodiment of the present invention provides a structure and method for personalizing a semiconductor device in the context of a bump array connection to packaging, substrates and such. The preferred embodiment method uses a plurality of conduction lines on said semiconductor device, including a plurality of landing lines and personalization lines. Vias are opened to the plurality of landing lines and selectively opened to a portion of the personalization lines. Connections are made between the opened personalization lines with bumps deposited as part of the bump array.

대표청구항 ▼

[ We claim:] [1.] A personalization structure for personalizing a semiconductor device comprising:a) a plurality of conduction lines connecting to said semiconductor device, said plurality of conduction lines including a plurality of landing lines and including a plurality of personalization line se

[ We claim:] [1.] A personalization structure for personalizing a semiconductor device comprising:a) a plurality of conduction lines connecting to said semiconductor device, said plurality of conduction lines including a plurality of landing lines and including a plurality of personalization line sets, wherein each personalization line set comprises at least two personalization lines in relatively close proximity to each other, wherein said at least two personalization lines are each connected to said semiconductor device such that a connection between at least two personalization lines personalizes said device;b) an insulator layer formed over said plurality of conduction lines;c) a plurality of vias opened through said insulator layer to said plurality of landing lines;d) at least one via opened through said insulator layer to at least one of said plurality of said personalization line sets; ande) an array of connection bumps over said plurality of conduction lines; said array of connection bumps including at least one connection bump forming an connection to said at least one of said plurality of landing lines and at least one connection bump forming a connection between one of said sets of personalization lines.