$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Thin-film printhead device for an ink-jet printer

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B41J-002/05
출원번호 US-0568208 (1995-12-06)
발명자 / 주소
  • Figueredo Domingo A.
  • Thomas David R.
  • Buonanno Mark A.
출원인 / 주소
  • Hewlett-Packard Company
인용정보 피인용 횟수 : 56  인용 특허 : 27

초록

The present invention provides an ink-jet printhead substructure highly thermally efficient and greatly simplified in both the method of manufacture and resulting structure. The printhead substructure of the present invention comprises a resistor formed on an insulated substrate, a single conductive

대표청구항

[ The invention claimed is:] [1.] A printhead substructure for an ink-jet pen that has a circuit member with conductive leads, the substructure comprising:a substrate having a first end and a second end;a transducer member attached to a first end of the substrate;conductive bonding pads attached to

이 특허에 인용된 특허 (27)

  1. Pan Alfred I. (Sunnyvale CA) Hanson Eric G. (Burlingame CA), Amorphous diffusion barrier for thermal ink jet print heads.
  2. Boyden James H. (Los Altos Hills CA), Apparatus for reducing erosion due to cavitation in ink jet printers.
  3. Chan C. S. (Boise ID) Hay Robert R. (Boise ID), Barrier layer and orifice plate for thermal ink jet print head assembly and method of manufacture.
  4. Keefe Brian J. (La Jolla CA) Childers Winthrop D. (San Diego CA) Steinfield Steven W. (San Diego CA) Reid W. Bruce (Solana Beach CA), Compact inkjet substrate with a minimal number of circuit interconnects located at the end thereof.
  5. Pan Alfred I. (Mountain View CA) Taub Howard H. (San Jose CA) Levie Harold W. (Livermore CA), Ink jet head incorporating a thick unpassivated TaAl resistor.
  6. Hawkins William G. (Webster NY) Burke Cathie J. (Rochester NY) Roll Daniel O. (Fishers NY) Hartman Pamela J. (Hilton NY) Atkinson Diane (Marion NY), Ink jet printhead having ionic passivation of electrical circuitry.
  7. Pan Alfred I. T. (Mountain View CA), Ink jet printhead with self-aligned orifice plate and method of manufacture.
  8. Keefe Brian J. (LaJolla CA) Childers Winthrop D. (San Diego CA) Steinfield Steven W. (San Diego CA) Trueba Kenneth E. (Corvallis OR) McClelland Paul H. (Monmouth OR), Inkjet printhead.
  9. Bhaskar Eldurkar V. (Corvallis OR) Leban Marzio A. (Corvallis OR), Integrated thermal ink jet printhead and method of manufacture.
  10. Hess Ulrich E. (Corvallis OR), Integrated thermal ink jet printhead and method of manufacture.
  11. Lloyd William J. (Belmont CA), Inversely processed resistance heater.
  12. Matsumoto Shigeyuki (Kawasaki JPX), Liquid jet recording device.
  13. Shibata Makoto (Hiratsuka JPX) Matsuda Hiroto (Ebina JPX) Ikeda Masami (Machida JPX) Takahashi Hiroto (Hiratsuka JPX), Liquid jet recording head.
  14. Sharma Ravinder K. (Mesa AZ) Geyer Harry J. (Phoenix AZ) Mitchell Douglas G. (Tempe AZ), Metallization scheme providing adhesion and barrier properties.
  15. Leban Marzio (Corvallis OR), Method of manufacture of a thermal inkjet thin film printhead having a plastic orifice plate.
  16. Cloutier Frank L. (Corvallis OR) Low Robert N. (Corvallis OR) McClelland Paul H. (Monmouth OR), Monolithic ink jet print head.
  17. Pan Alfred I-Tsung (Sunnyvale CA) Hanson Eric G. (Burlingame CA) Schantz Christopher A. (Redwood City CA) Childers Winthrop D. (San Diego CA), Plastic substrate for thermal ink jet printer.
  18. Stoffel John L. (San Diego CA), Process for manufacturing thermal ink jet printhead and integrated circuit (IC) structures produced thereby.
  19. Vaught John L. (Palo Alto CA) Cloutier Frank L. (Corvallis OR) Donald David K. (Redwood City CA) Meyer John D. (Mt. View CA) Tacklind Christopher A. (Palo Alto CA) Taub Howard H. (San Jose CA), Thermal ink jet printer.
  20. Meyer John D. (Mountain View CA), Thermal ink jet printer utilizing a printhead resistor having a central cold spot.
  21. Scheu Friedrich (Vancouver WA), Thermal ink jet printhead.
  22. Wright Conrad L. (Boise ID) Bearrs James G. (Boise ID) Chan C. S. (Boise ID) Hay Robert R. (Boise ID) Ura Frank (Woodside CA), Thermal ink jet printhead with self-passivating elements.
  23. Hess Ulrich E. (Corvallis OR) Fasen Duane A. (Loveland CO), Thermal inkjet printhead having driver circuitry thereon and method for making the same.
  24. Fasen Duane A. (Loveland CO) Beckmann Jerome E. (Loveland CO) Stanback John H. (Fort Collins CO) Hess Ulrich E. (Corvallis OR) Hulings James R. (Fort Collins CO) Metz Larry S. (Fort Collins CO) Moore, Thermal inkjet printhead structure and method for making the same.
  25. Aden James S. (Corvallis OR) Kahn Jeffrey A. (Corvallis OR), Thin film device for an ink jet printhead and process for the manufacturing same.
  26. Ura Frank (Palo Alto CA), Thin film thermal print head.
  27. Hackleman David E. (Monmouth OR) Bearss James G. (Boise ID) Bhaskar Eldurkar V. (Corvallis OR), Thin film vertical resistor devices for a thermal ink jet printhead and methods of manufacture.

이 특허를 인용한 특허 (56)

  1. Silverbrook, Kia, Actuating mechanism which includes a thermal bend actuator.
  2. Silverbrook, Kia, Ejection nozzle arrangement having dynamic and static structures.
  3. Colin C. Davis ; Eric L. Nikkel ; Martha A. Truninger ; Ronald L. Enck, Fluid ejection device and method of fabricating.
  4. Hess, Ulrich E.; Berhane, Samson; Fartash, Arjang, Fluid-ejection devices and a deposition method for layers thereof.
  5. Hess,Ulrich E.; Berhane,Samson; Fartash,Arjang, Fluid-ejection devices and a deposition method for layers thereof.
  6. Genbao Xu ; Zhizang Chen ; Mark Alan Johnstone ; John P. Whitlock, Fluid-jet printhead and method of fabricating a fluid-jet printhead.
  7. Miller, Richard Todd; Kumpf, Susanne L., Fluid-jet printhead and method of fabricating a fluid-jet printhead.
  8. Richard Todd Miller ; Susanne L. Kumpf, Fluid-jet printhead and method of fabricating a fluid-jet printhead.
  9. Chung, Bradley D.; Shah, Bhavin; Fuller, Anthony M.; Yildirim, Ozgur; Clark, Garrett E., Heating element.
  10. Chung, Bradley D.; Shah, Bhavin; Fuller, Anthony M.; Yildirim, Ozgur; Clark, Garrett E., Heating element.
  11. Chung, Bradley D.; Shah, Bhavin; Fuller, Anthony M.; Yildirim, Ozgur; Clark, Garrett E., Heating element.
  12. Schulte, Donald W; Miller, Richard Todd; Kumpf, Susanne L, Heating element of a printhead having conductive layer between resistive layers.
  13. Prasad Rama ; Cleland Todd A. ; Maze Robert C. ; Oughton Dale R., High drop generator density printhead.
  14. Todd A. Cleland ; Robert C. Maze ; Michael D. Miller ; Rama Prasad ; Robert N. K. Browning ; Dale R. Oughton ; Joseph M. Torgerson ; Kenneth D. Saul ; Michael B. Hager ; Douglas M. Collins , High print quality printhead.
  15. Cleland, Todd A.; Maze, Robert C.; Miller, Michael D.; Prasad, Rama; Browning, Robert N. K.; Oughton, Dale R.; Torgerson, Joseph M.; Saul, Kenneth D.; Hager, Michael B.; Collins, Douglas M.; Field, L, High quality fluid ejection device.
  16. Silverbrook, Kia, Ink ejection mechanism with thermal actuator coil.
  17. Anderson, Frank Edward; Parish, George Keith, Ink jet heater chip and method therefor.
  18. Kia Silverbrook AU, Ink jet mechanism with thermoelastic bend actuator having conductive and resistive beams.
  19. Silverbrook, Kia, Ink jet nozzle assembly having layered ejection actuator.
  20. Silverbrook,Kia, Ink jet nozzle assembly with a thermal bend actuator.
  21. Silverbrook,Kia, Ink jet nozzle assembly with linearly constrained actuator.
  22. Shin, Kyu-ho; Shin, Su-ho; Lim, Seong-taek, Ink jet printer head.
  23. Kia Silverbrook AU, Ink jet printing apparatus with balanced thermal actuator.
  24. Jung, Myung-song; Park, Sung-joon; Kim, Tae-kyun; Min, Jae-sik, Ink-jet printhead and manufacturing method thereof.
  25. Jung,Myung song; Park,Sung joon; Kim,Tae kyun; Min,Jae sik, Ink-jet printhead and manufacturing method thereof.
  26. Kim, Yun-gi, Ink-jet printhead and method of manufacturing the same.
  27. Silverbrook, Kia, Inkjet printhead integrated circuit incorporating fulcrum assisted ink ejection actuator.
  28. Silverbrook, Kia, Inkjet printhead with nozzle layer defining etchant holes.
  29. Anderson, Frank E.; Bell, Byron V.; Cornell, Robert W.; Guan, Yimin, Low ejection energy micro-fluid ejection heads.
  30. Anderson,Frank E.; Bell,Byron V.; Cornell,Robert W.; Guan,Yimin, Low ejection energy micro-fluid ejection heads.
  31. Xu, Genbao; Chen, Zhizang; Johnstone, Mark Alan; Whitlock, John P., Method of fabricating a fluid jet printhead.
  32. Miller,Richard Todd; Kumpf,Susanne L, Method of fabricating a printhead.
  33. Silverbrook Kia,AUX, Method of manufacture of an electrostatic ink jet printer.
  34. Miller, Richard Todd; Kumpf, Susanne L, Method of manufacturing a fluid ejection device.
  35. Miyamoto,Takaaki; Tomita,Manabu; Ono,Shogo; Kohno,Minoru; Tateishi,Osamu, Method of manufacturing a liquid dispenser.
  36. Kawamura, Naoto, Methods of fabricating fit firing chambers of different drop weights on a single printhead.
  37. Kawamura,Naoto, Methods of fabricating fit firing chambers of different drop wights on a single printhead.
  38. Rausch, John B.; Shade, David A., Methods of forming thermal ink jet resistor structures for use in nucleating ink.
  39. Silverbrook,Kia, Micro-electromechanical device having a laminated thermal bend actuator.
  40. Silverbrook,Kia, Micro-electromechanical fluid ejection device with actuator guide formations.
  41. Silverbrook Kia,AUX, Planar thermoelastic bend actuator ink jet printing mechanism.
  42. King,David G.; Rowe,Kristi M., Power and ground buss layout for reduced substrate size.
  43. King,David G.; Rowe,Kristi M., Power and ground buss layout for reduced substrate size.
  44. Pidwerbecki David, Printhead apparatus.
  45. Silverbrook, Kia, Printhead having relatively dimensioned ejection ports and arms.
  46. Leban Marzio, Printhead having varied thickness passivation layer and method of making same.
  47. Bryant, Frank R.; Torgerson, Joseph M.; Bakkom, Angela White, Printhead integrated circuit.
  48. Silverbrook, Kia, Printhead micro-electromechanical nozzle arrangement with motion-transmitting structure.
  49. Silverbrook, Kia, Printhead nozzle arrangements with magnetic paddle actuators.
  50. Silverbrook, Kia, Printhead nozzle having heater of higher resistance than contacts.
  51. Park,Sung joon; Beak,O hyun; Ha,Young ung; Min,Jae sik, Protective layer of ink-jet print head and method of making ink-jet print head having the same.
  52. Yu Chia-Chieh,TWX ; Chou Ta-Cheng,TWX, Surface treatment for bonding pad.
  53. Rausch, John B.; Shade, David A., Thermal ink jet defect tolerant resistor design.
  54. Lee, Moon-chul; Yoon, Yong-seop; Jeong, Yong-won; Shim, Dong-sik; Park, Sung-joon; Kim, Jong-seok, Thermal inkjet print head.
  55. Silverbrook Kia,AUX, Thermally actuated ink jet printing mechanism including a tapered heater element.
  56. Ronald A. Hellekson ; Alfred I-Tsung Pan ; Marshall Field, Thin film microheaters for assembly of inkjet printhead assemblies.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트