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GT clip design for an electronic packaging assembly 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0893937 (1997-07-15)
발명자 / 주소
  • Turturro Gregory
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman LLP
인용정보 피인용 횟수 : 31  인용 특허 : 4

초록

An electrical assembly which includes a clip that couples a thermal element to an integrated circuit package. The integrated circuit package is mounted to a printed circuit board. An elastomer is located between the printed circuit board and the clip. The assembly is designed so that the elastomer a

대표청구항

[ What is claimed is:] [1.] An electrical assembly, comprising:a printed circuit board which has a first side and a second side;an integrated circuit package that is mounted to said first side of said printed circuit board;a thermal element that is located adjacent to said integrated circuit package

이 특허에 인용된 특허 (4)

  1. Isaacs Phillip (Rochester MN) Swain Miles (Hayfield MN), Circuit card having a large module strain relief and heat sink support.
  2. Samarov Victor M. (36 Russell St. Carlisle MA 01741) DeCarolis Joseph A. (117 West St. Lunenburg MA 01462) Patel Raoji (90 Flanagan Dr. Framingham MA 01701) Piche Gerald J. (54 Clark Rd. Milford NH 0, Coplanar heatsink and electronics assembly.
  3. Berg William E. (Portland OR), Mounting an integrated circuit chip to an etched circuit board.
  4. Mira Ali (San Jose CA), Readily removable heat sink assembly.

이 특허를 인용한 특허 (31)

  1. Schmidberger,Stefan, Apparatus for cooling semiconductor devices attached to a printed circuit board.
  2. Tsung-Lung Lee TW; Cheng-Tien Lai TW; Zili Zhang CN, Back plate assembly for motherboard.
  3. Reents,Jeffrey M., Bottom side heat sink attachment for console.
  4. Lin Shih-jen,TWX, CPU heat sink mounting arrangement.
  5. Liu Yen-Wen,TWX, Cartridge type CPU module cooling structure.
  6. Degner, Brett W.; Tice, Gregory, Consolidated thermal module.
  7. Kimmich,Peter, Cooling body.
  8. Ishimine, Junichi, Cooling device capable of contacting target with smaller urging force.
  9. Daryl J. Nelson ; Michael Stark ; Michael Rutigliano ; Lee Topic ; Yoke Chung ; Mark Thurston JP, Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges.
  10. Nelson Daryl J. ; Stark Michael ; Rutigliano Michael ; Topic Lee ; Chung Yoke ; Thurston Mark,JPX, Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges.
  11. Tseng Richard, Electrical assembly that includes a heat sink which is attached to a substrate by a clip.
  12. Hua,Fay, Electromigration barrier layers for solder joints.
  13. Hua,Fay, Electromigration barrier layers for solder joints.
  14. Ma, Hao-Yuan, Electronic device assembly having thermal module for heat dissipation.
  15. Saito Yoshiyuki,JPX ; Suzuki Takaya,JPX, Heat radiating member for heat generating device.
  16. MacGregor Mike ; Crocker Michael T. ; Wong Thomas ; Davison Peter ; Konstad Rolf A. ; Jones David A., Heat sink clip for an electronic assembly.
  17. Hashimoto, Suzushi; Kinaga, Kazuo; Akutsu, Shoji, Heat sinks for CPUs for use in personal computers.
  18. Unrein, Edgar J., Heatsink assembly.
  19. Michael R. Stark ; Michael L. Rutigliano, Inboard retention system for processor enclosure assemblies with substrate alignment.
  20. Koeneman,Paul B.; Trautman,Mark A., Method and apparatus for cooling an integrated circuit package using a cooling fluid.
  21. Shang, Alain; Dair, Edwin, Methods, apparatus, and systems of fiber optic modules, elastomeric connections, and retention mechanisms therefor.
  22. Jeffrey W. Day ; Steven L. Pollock, PLGA-BGA socket using elastomer connectors.
  23. Choi, Jae-Min; Chun, Jae-Hwan; Won, Jong-Ho, Printed circuit board assembly and liquid crystal display having the same.
  24. Stark, Michael; Rutigliano, Michael; Lieska, Bill; Davison, Peter A., Protection shield for an electronic cartridge.
  25. Liu Yen-Wen,TWX, Protective device for central processing unit.
  26. Llapitan, David J.; Crocker, Michael; Davison, Peter, Retention mechanism for an electrical assembly.
  27. Llapitan, David J.; Crocker, Michael; Davison, Peter, Retention mechanism for an electrical assembly.
  28. Eckberg, Eric A.; Good, Michael S.; Pfeifer, Mark D., System and method for cooling a module.
  29. Eckberg,Eric A.; Good,Michael S.; Pfeifer,Mark D., System and method for cooling a module.
  30. Degner, Brett W.; Reid, Gavin J.; Smith, Brandon S.; Shan, Raymond S., Thermal module accounting for increased board/die size in a portable computer.
  31. Bollesen Vernon, Wire heat sink assembly and method of assembling.
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