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Precision high pressure control assembly 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F04B-049/00
출원번호 US-0139230 (1998-08-25)
발명자 / 주소
  • Fitzgerald Wayne
  • James Kenneth J.
  • Waibel Brian J.
출원인 / 주소
  • Supercritical Fluid Technologies, Inc.
대리인 / 주소
    Connolly & Hutz
인용정보 피인용 횟수 : 53  인용 특허 : 10

초록

A precision high-pressure control assembly for supercritical fluids comprises a continuous flow system having a pressure control loop which includes a source of fluid communicating with a piston driven pump. A pressure sensor monitors the pressure of the supercritical fluid in the outlet line of the

대표청구항

[ What is claimed is:] [1.] A precision high-pressure control assembly for supercritical fluids comprising a continuous flow system having a pressure control loop which includes a source of fluid, said source of fluid communicating with a pump head of a piston driven pump for compressing the fluid a

이 특허에 인용된 특허 (10)

  1. Jameson Daniel G. (Lincoln NE), Apparatus and method for supercritical fluid extraction.
  2. Schumack Russell (Shenandoah PA), Automatic control system for diaphragm pumps.
  3. Frank Lenore R. (Landenberg PA) Wurm Christopher M. (Landenberg PA) Dryden Paul C. (West Chester PA) Engel Steven J. (Kennett Square PA) Nickerson Mark A. (Landenberg PA) Zerenner Ernest H. (Limeston, Decoupled flow and pressure setpoints in an extraction instrument using compressible fluids.
  4. Frank Lenore R. (Landenberg PA) Wurm Christopher M. (Landenberg PA) Dryden Paul C. (West Chester PA) Engel Steven J. (Kennett Square PA) Nickerson Mark A. (Landenberg PA) Zerenner Ernest H. (Wilmingt, Decoupled flow and pressure setpoints in an extraction instrument using compressible fluids.
  5. Clayton William (Pasadena CA) Mattox George W. (El Monte CA), Diaphragm pump boiler feed water system.
  6. Vincent Kent (Cupertino CA) Haertl Hans-Georg (Waldbronn DEX), Diaphragm pump with improved pressure regulation and damping.
  7. Shirasawa Honai (Ikeda JPX) Sugeno Hiroto (Toshima JPX) Eto Shigeo (Toshima JPX) Saito Hiroshi (Toshima JPX), Process for industrially separating biopolymers.
  8. Burba ; III John L. (El Dorado AR) Ayres James T. (El Dorado AR) Spires Preston E. (El Dorado AR) Hill John E. (West Lafayette IN), Processes producing methyl mercaptan.
  9. Leaseburge Emory J. (Lewisburg WV) Melda Kenneth J. (Lewisburg WV), Sample dilution system for supercritical fluid chromatography.
  10. Leaseburge Emory J. (Lewisburg WV) Thomas Thomas J. (Lewisburg WV), Supercritical fluid chromatograph with pneumatically controlled pump.

이 특허를 인용한 특허 (53)

  1. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
  2. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  3. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  4. Wikfors, Edwin E.; Fogelman, Kimber D.; Berger, Terry A., Automated conversion between SFC and HPLC.
  5. Berger, Terry A.; Fogelman, Kimber D.; Wikfors, Edwin E.; Staats, III, L. Thomson; Colgate, Samuel O.; Casale, Michael A., Compressible fluid pumping system for dynamically compensating compressible fluids over large pressure ranges.
  6. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  7. Arena Foster,Chantal J.; Awtrey,Allan Wendell; Ryza,Nicholas Alan; Schilling,Paul, Developing photoresist with supercritical fluid and developer.
  8. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Developing photoresist with supercritical fluid and developer.
  9. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Drying resist with a solvent bath and supercritical CO2.
  10. Paul, Phillip H.; Arnold, Don Wesley; Bailey, Christopher G., Electroosmotic flow controller.
  11. Neyer, David W.; Paul, Phillip H.; Arnold, Don Wesley; Bailey, Christopher G., Flow control systems.
  12. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  13. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.
  14. Jones, William D., High pressure fourier transform infrared cell.
  15. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  16. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  17. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  18. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  19. Berger, Terry A.; Colgate, Samuel; Casale, Michael, Low noise back pressure regulator for supercritical fluid chromatography.
  20. Berger, Terry A.; Colgate, Samuel; Casale, Michael, Low noise back pressure regulator for supercritical fluid chromatography.
  21. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  22. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.
  23. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  24. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  25. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  26. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  27. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  28. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  29. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  30. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  31. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  32. Hillman,Joseph, Method of inhibiting copper corrosion during supercritical COcleaning.
  33. Toma,Dorel Ioan; Schilling,Paul, Method of passivating of low dielectric materials in wafer processing.
  34. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  35. Schilling,Paul, Method of treating a composite spin-on glass/anti-reflective material prior to cleaning.
  36. Schilling,Paul, Method of treatment of porous dielectric films to reduce damage during cleaning.
  37. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  38. Paul, Phillip H.; Rehm, Jason E.; Arnold, Don W., Precision flow control system.
  39. Paul,Phillip H.; Rehm,Jason E.; Arnold,Don W., Precision flow control system.
  40. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  41. Wuester,Christopher D., Process flow thermocouple.
  42. Paul, Carlton H.; Praria, Guy B.; Stokes, Jeffrey H., Programmable tracking pressure regulator for control of higher pressures in microfluidic circuits.
  43. Berger, Terry A.; Fogelman, Kimber D.; Klein, Kenneth; Staats, III, L. Thompson; Nickerson, Mark; Bente, III, Paul F., Pump as a pressure source for supercritical fluid chromatography involving pressure regulators and a precision orifice.
  44. Mullee,William H.; de Leeuwe,Marc; Roberson, Jr.,Glenn A.; Palmer,Bentley J., Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process.
  45. Mullee, William H.; de Leeuwe, Marc; Roberson, Jr., Glenn A., Removal of CMP residue from semiconductor substrate using supercritical carbon dioxide process.
  46. Bertram, Ronald Thomas; Scott, Douglas Michael, Removal of contaminants from a fluid.
  47. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  48. William H. Mullee ; Maximilian A. Biberger ; Paul E. Schilling, Removal of photoresist and residue from substrate using supercritical carbon dioxide process.
  49. Koch Robert, Removal of polishing residue from substrate using supercritical fluid process.
  50. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  51. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  52. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  53. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
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