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Temperature-responsive adhesive article 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C09J-007/02
출원번호 US-0657235 (1996-06-03)
발명자 / 주소
  • Calhoun Clyde D.
  • Delgado Joaquin
출원인 / 주소
  • Minnesota Mining and Manufacturing Company
대리인 / 주소
    Weiss
인용정보 피인용 횟수 : 94  인용 특허 : 28

초록

A temperature-responsive adhesive article comprises (a) a temperature-responsive carrier capable of changing its shape at a first transition temperature; and (b) a thermomorphic pressure-sensitive adhesive on at least a portion of at least one surface of the carrier, the thermomorphic pressure-sensi

대표청구항

[ What is claimed is:] [1.] A temperature-responsive adhesive article comprising (a) a temperature-responsive carrier capable of changing its shape at a first transition temperature; and (b) a thermomorphic pressure-sensitive adhesive on at least a portion of at least one surface of said carrier, sa

이 특허에 인용된 특허 (28)

  1. Husman, James R.; Kellen, James N.; McCluney, Rebecca E.; Tumey, Michael L., Acrylate copolymer pressure-sensitive adhesive composition and sheet materials coated therewith.
  2. Blum Alfred (Skokie IL), Adhesive tape having printable release coating.
  3. Van Praet Dirk J. (Willebroek BEX), Article and method for applying a temperature indicating composition.
  4. Maruoka Shigenobu (Kawasaki JPX) Sugizaki Toshio (Urawa JPX) Irie Kouji (Urawa JPX) Tsuchida Ichiro (Koshigaya JPX) Saito Takanori (Misato JPX), Blister resistant pressure sensitive adhesive sheet.
  5. Kessel Carl R. (St. Paul MN) Aeling Ellen O. (St. Paul MN), Branched alkoxyphenyl iodonium salt photoinitiators.
  6. Potter William D. (Bishop\s Stortford Herts GBX) Kiamil Sinan B. (Harlow GBX), Cured pressure sensitive adhesives.
  7. Calhoun Clyde D. (Stillwater MN) Koskenmaki David C. (St. Paul MN), Heat-activatable adhesive article.
  8. Bonk Thomas J. (Stillwater MN) Chen Tsung-I (Woodbury MN) Olson Patricia M. (Minneapolis MN) Weiss Douglas E. (Minneapolis MN), Heat-recoverable closure with crosslinked pressure-sensitive adhesive.
  9. Smuckler, Jack H., Heat-shrinkable article.
  10. Delgado Joaquin (St. Paul MN), Hollow acrylate polymer microspheres.
  11. Delgado Joaquin (Stillwater MN) Goetz Richard J. (Woodbury MN) Silver Spencer F. (Woodbury MN) Lucast Donald H. (North St. Paul MN), Low trauma wound dressing with improved moisture vapor permeability.
  12. Caponigro Dennis A. (Pleasanton CA) Lopes Eugene F. (Sunnyvale CA), Method for joining heat-recoverable sheet material and resulting article.
  13. Calhoun Clyde D. (Stillwater MN) Koskenmaki David C. (St. Paul MN) Mazurek Mieczyslaw H. (Roseville MN), Patterned pressure sensitive adhesive transfer tape.
  14. Wilson Kenneth D. (Stillwater MN) Meixner Larry A. (St. Croix Falls WI) Bemis Sharon R. (Osceola WI) Calhoun Clyde D. (Stillwater MN) Ree Buren R. (Stillwater MN), Positionable and repositionable adhesive articles.
  15. Brown Paul L. (Saginaw MI) Stickles David L. (Midland MI), Pressure sensitive adhesive release liner and fluorosilicone compounds, compositions and method therefor.
  16. Lambert Richard J. (Lake Elmo MN), Printable pressure-sensitive adhesive tape.
  17. Bohnel Bernd (Stillwater MN), Process for the preparation of tacky polymeric microspheres.
  18. Pithouse Kenneth B. (Lesulis CA FRX) Kridl Thomas A. (Union City CA) Triplett James T. (Livermore CA), Recoverable article for encapsulation.
  19. Brown Francis W. (West St. Paul MN) Winslow Louis E. (Stillwater MN), Removable pressure-sensitive adhesive tape.
  20. Hayashi Shunichi (Mitsubishi JPX) Fujimura Hiroshi (Mitsubishi JPX) Shimizu Makoto (Mitsubishi JPX), Shape memory film.
  21. Kessel Carl R. (St. Paul MN) Bany Stephen W. (St. Paul MN), Silicone release compositions.
  22. Stewart Ray F. (Redwood City CA), Skin-activated temperature-sensitive adhesive assemblies.
  23. Calhoun Clyde D. (Stillwater MN) Kessel Carl R. (St. Paul MN), Structured flexible carrier web with recess areas bearing a layer of silicone on predetermined surfaces.
  24. Kealy Joanne P. (Maplewood MN) Zenk Robert E. (River Falls WI), Tackified crosslinked acrylic adhesives.
  25. Delgado Joaquin (Stillwater MN) Goetz Richard J. (Woodbury MN) Silver Spencer F. (White Bear Lake MN), Tacky microspheres having pendant hydrophilic polymeric or oligomeric moieties.
  26. Baker William A. (Stillwater MN) Ketola Warren D. (St. Paul MN), Tacky polymeric microspheres.
  27. Kessel Carl R. (St. Paul MN) McIntyre Daniel K. (St. Paul MN), UV-curable silicon release compositions.
  28. Chiotis Achilles (Menlo Park CA) Martens Paul (Fremont CA) Bacon Deran (Santa Clara CA), Wrap-around heat-recoverable sealing article.

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  1. Schmidt,Mattias; Kline,Mark James; Ehrnsperger,Bruno Johannes; Sprengard Eichel,Cornelia; Tepper,Bruce Ernest, Absorbent article with phase change material.
  2. Tang, Tingji; Xu, Gu; Zhong, Xing-Fu; Hong, Wenbin; Flaim, Tony D.; Yess, Kimberly; Trichur, Ramachandran K., Acid-etch resistant, protective coatings.
  3. Sreenivasan, Sidlgata V; Watts, Michael P. C.; Choi, Byung J.; Voisin, Ronald D., Alignment methods for imprint lithography.
  4. Choi,Byung Jin; Sreenivasan,Sidlgata V.; Watts,Michael P. C., Capillary imprinting technique.
  5. Watanabe, Masanao; Hagiwara, Kenichi; Okano, Teruo; Yamato, Masayuki; Shimizu, Tatsuya; Akiyama, Yoshikatsu; Watanabe, Hiroya; Ashiba, Keisuke, Cell culture support and manufacture thereof.
  6. Cherala, Anshuman; Choi, Byung Jin; Lad, Pankaj B.; Shackleton, Steven C., Chucking system comprising an array of fluid chambers.
  7. Xu, Frank Y., Composition for adhering materials together.
  8. Xu,Frank Y.; Miller,Michael N.; Watts,Michael P. C., Composition for an etching mask comprising a silicon-containing material.
  9. Xu,Frank Y.; Miller,Michael N., Composition to reduce adhesion between a conformable region and a mold.
  10. Willson,C. Grant; Stacey,Nicholas A., Compositions for dark-field polymerization and method of using the same for imprint lithography processes.
  11. Sreenivasan, Sidlgata V.; Choi, Byung-Jin; Voisin, Ronald D., Conforming template for patterning liquids disposed on substrates.
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  13. Colasanto, Thomas C., Controlled porosity, transfer-coated fabrics.
  14. Shih, Wayne Ken; Carico, Kimberley Carmenia; Kinkade, Nancy Ellen, Copolyesters plasticized with polymeric plasticizer.
  15. Sabelstrom Jan,SEX, Cover intended for the fabrication of a booklet, a method of handling such covers, and a method of fabricating such booklets.
  16. Hong, Wenbin; Bai, Dongshun; Flaim, Tony D.; Puligadda, Rama, Cyclic olefin compositions for temporary wafer bonding.
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  19. Rule, Joseph D.; Lewandowski, Kevin M.; Determan, Michael D., Debondable adhesive article.
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  21. Sreenivasan,Sidlgata V., Eliminating printability of sub-resolution defects in imprint lithography.
  22. Wang,David C.; Xu,Frank Y., Etching technique to planarize a multi-layer structure.
  23. Tsuchiya,Katsunori; Ozawa,Kyouko, Film lamination method and lamination-apparatus.
  24. Choi, Byung J.; Sreenivasan, Sidlgata V., Flexure based macro motion translation stage.
  25. Lowe, Clifford A., Floor marking tape.
  26. Choi, Byung Jin; Meissl, Mario J.; Sreenivasan, Sidlagata V.; Watts, Michael P. C., Formation of discontinuous films during an imprint lithography process.
  27. Choi,Byung Jin; Meissl,Mario J.; Sreenivasan,Sidlagata V.; Watts,Michael P. C., Formation of discontinuous films during an imprint lithography process.
  28. Rule, Joseph D.; Tapio, Scott M.; Sherman, Audrey S.; Schaffer, Kevin R.; Liu, Lan H.; Branigan, Margot A.; Behling, Ross E., Heat de-bondable optical articles.
  29. Everaerts,Albert I.; Nguyen,Lang N., Heat-activatable adhesive.
  30. Choi, Byung Jin; Sreenivasan, Sidlgata V.; Johnson, Stephen C., High precision orientation alignment and gap control stages for imprint lithography processes.
  31. Sreenivasan, Sidlgata V.; Choi, Byung J.; Colburn, Matthew; Bailey, Todd, High-resolution overlay alignment methods for imprint lithography.
  32. Hong, Wenbin; Pillalamarri, Sunil K., High-temperature spin-on temporary bonding compositions.
  33. Pillalamarri, Sunil K.; Li, Chenghong, High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach.
  34. Voisin, Ronald D., Imprint alignment method, system and template.
  35. Voisin, Ronald D., Imprint alignment method, system, and template.
  36. Sreenivasan,Sidlgata V.; Schumaker,Philip D., Imprint lithography template having opaque alignment marks.
  37. Sreenivasan, Sidlgata V.; Choi, Byung-Jin, Imprinting of partial fields at the edge of the wafer.
  38. Kim, Yang-Pioung, Laminate sheet having a thin film of pressure sensitive adhesive.
  39. Flanigan, Peggy-Jean P.; Mazurek, Mieczyslaw; Stark, Peter A.; Fleming, Patrick R.; Manore, Janice R.; Borchers, Eric J., Laminates with structured layers.
  40. Rink, Tomas Federico, Linerless self-adhesive material.
  41. Xu, Frank Y.; Watts, Michael P. C.; Stacey, Nicholas A., Materials for imprint lithography.
  42. Choi, Byung-Jin; Sreenivasan, Sidlgata V., Method and system for double-sided patterning of substrates.
  43. Xu, Frank Y., Method for adhering materials together.
  44. Xu, Frank; McMackin, Ian; Lad, PanKaj B.; Watts, Michael P. C., Method for controlling distribution of fluid components on a body.
  45. Schumaker, Philip D., Method for detecting a particle in a nanoimprint lithography system.
  46. Watts,Michael P. C.; Sreenivasan,Sidlgata V., Method for fabricating bulbous-shaped vias.
  47. Willson, Carlton Grant; Sreenivasan, Sidlgata V.; Bonnecaze, Roger T., Method for fabricating nanoscale patterns in light curable compositions using an electric field.
  48. McMackin, Ian M.; Lad, Pankaj B.; Truskett, Van N., Method for fast filling of templates for imprint lithography using on template dispense.
  49. Xu, Frank Y.; Sreenivasan, Sidlgata V.; Fletcher, Edward Brian, Method for imprint lithography utilizing an adhesion primer layer.
  50. Choi, Byung-Jin; Sreenivasan, Sidlgata V.; Willson, Carlton Grant; Colburn, Mattherw E.; Bailey, Todd C.; Ekerdt, John G., Method of automatic fluid dispensing for imprint lithography processes.
  51. Sreenivasan,Sidlgata V.; Xu,Frank Y., Method of compensating for a volumetric shrinkage of a material disposed upon a substrate to form a substantially planar structure therefrom.
  52. Sreenivasan, Sidlgata V.; McMackin, Ian M.; Melliar-Smith, Christopher Mark; Choi, Byung-Jin, Method of concurrently patterning a substrate having a plurality of fields and a plurality of alignment marks.
  53. LaBrake,Dwayne L., Method of controlling the critical dimension of structures formed on a substrate.
  54. Sreenivasan,Sidlgata V., Method of forming a recessed structure employing a reverse tone process.
  55. Vidusek,David A.; Sreenivasan,Sidlgata V.; Wang,David C., Method of forming an in-situ recessed structure.
  56. Sreenivasan,Sidlgata V., Method of forming stepped structures employing imprint lithography.
  57. Miller,Michael N.; Stacey,Nicholas A., Method of patterning surfaces while providing greater control of recess anisotropy.
  58. Sreenivasan,Sidlgata V., Method of planarizing a semiconductor substrate with an etching chemistry.
  59. Rubin, Daniel I., Method of reducing pattern distortions during imprint lithography processes.
  60. Choi, Byung Jin; Cherala, Anshuman; Babbs, Daniel A., Method of retaining a substrate to a wafer chuck.
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  64. Truskett,Van N.; Mackay,Christopher J.; Choi,B. Jin, Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-containing layer.
  65. Choi, Byung J.; Colburn, Matthew; Sreenivasan, S. V.; Willson, C. Grant; Bailey, Todd; Ekerdt, John, Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography.
  66. Xie, Wenbo; Fu, Fen, Methods for producing coated film.
  67. Schneider, Andreas Simon; Kroner, Elmar; Kaiser, Jessica; Frensemeier, Mareike; Arzt, Eduard, Object with selectable adhesion.
  68. David H. Blount, Organic phosphorus-phosphorus oxyacid compounds.
  69. Sreenivasan, Sidlgata V., Pattern reversal employing thick residual layers.
  70. Sreenivasan, Sidlgata V.; Schumaker, Philip D., Patterning a plurality of fields on a substrate to compensate for differing evaporation times.
  71. Stacey,Nicholas A.; Sreenivasan,Sidlgata V.; Miller,Michael N., Patterning substrates employing multi-film layers defining etch-differential interfaces.
  72. Choi, Byung-Jin; Sreenivasan, Sidlgata V., Patterning substrates employing multiple chucks.
  73. Sreenivasan,Sidlgata V., Positive tone bi-layer imprint lithography method.
  74. Sreenivasan, Sidlgata V., Positive tone bi-layer method.
  75. Haase, Roger L.; Walliser, Carl J., Post-cure treatment of silicone coating for liners in pressure-sensitive labels.
  76. Choi,Byung Jin; Sreenivasan,Sidlgata V.; Johnson,Stephen C., Remote center compliant flexure device.
  77. Sreenivasan,Sidlgata V.; Stacey,Nicholas A., Reverse tone patterning on surfaces having planarity perturbations.
  78. Schmid, Gerard M.; Stacey, Nicholas A; Resnick, Douglas J.; Voisin, Ronald D.; Myron, Lawrence J., Self-aligned process for fabricating imprint templates containing variously etched features.
  79. Carlton Grant Willson ; Matthew Earl Colburn, Step and flash imprint lithography.
  80. Willson, Carlton Grant; Colburn, Matthew Earl, Step and flash imprint lithography.
  81. Sreenivasan, Sidlgata V.; Choi, Byung J.; Schumaker, Norman E.; Voisin, Ronald D.; Watts, Michael P. C.; Meissl, Mario J., Step and repeat imprint lithography processes.
  82. Sreenivasan,Sidlgata V.; Choi,Byung J.; Schumaker,Norman E.; Voisin,Ronald D.; Watts,Michael P. C.; Meissl,Mario J., Step and repeat imprint lithography processes.
  83. Albers, William; Bacon, David; Gauthier, Henry; Kalich, Richard L.; Sucharzewski, Pete, Striated carrier.
  84. Choi,Byung J.; Sreenivasan,Sidlgata V., System for determining characteristics of substrates employing fluid geometries.
  85. Schumaker, Philip D.; Fancello, Angelo; Kim, Jae H.; Choi, Byung-Jin; Babbs, Daniel A., System to transfer a template transfer body between a motion stage and a docking plate.
  86. GanapathiSubramanian, Mahadevan; Choi, Byung-Jin; Miller, Michael N.; Stacey, Nicholas A., Technique for separating a mold from solidified imprinting material.
  87. Bailey, Todd; Choi, Byung J.; Colburn, Matthew; Sreenivasan, S. V.; Willson, C. Grant; Ekerdt, John, Template for room temperature, low pressure micro-and nano-imprint lithography.
  88. Selinidis, Kosta S.; Choi, Byung-Jin; Schmid, Gerard M.; Thompson, Ecron D.; McMackin, Ian Matthew, Template having alignment marks formed of contrast material.
  89. Sreenivasan, Sidlgata V.; Schumaker, Philip D.; McMackin, Ian M., Tessellated patterns in imprint lithography.
  90. Moore, John C.; Fowler, Michelle R., Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive.
  91. Moore, John C.; Fowler, Michelle R., Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive.
  92. Delgado Joaquin ; Silver Spencer F., Thermomorphic "smart" pressure sensitive adhesives.
  93. Burmeister, Axel; Hansen, Sven; Leydecker, Heiko; Kreft, Christian; Stähr, Jochen, Use of isocyanates in the preparation of highly viscous self-adhesive compositions.
  94. Shelby, Marcus David; Tanner, Candace Michele; Tincher, Mark Elliott; Little, Jr., Rondell Paul, Void-containing polyester shrink film with improved density retention.
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