초록 ▼

A packaging for high-power devices such as Insulated Gate Bipolar Transistors includes a direct bonded copper substrate (DBC), such as beryllium oxide (BeO), soldered directly to a heat generating surface of the high-power device. The direct bonded copper substrate (DBC) is, in turn, soldered direct

A packaging for high-power devices such as Insulated Gate Bipolar Transistors includes a direct bonded copper substrate (DBC), such as beryllium oxide (BeO), soldered directly to a heat generating surface of the high-power device. The direct bonded copper substrate (DBC) is, in turn, soldered directly to a liquid cooled heatsink (HS). The packaging improves the thermal management of the heat generated by the high-power device, and is applicable for use in a switching circuit for a 3-phase electric traction motor (M). The assembly also provides for improved wirebonding design in order to use each high-power device to its fullest.

대표청구항 ▼

[ I claim:] [1.] A packaging for an electronic device comprising:at least one electronic device having a heat generating surface;a direct bonded copper substrate having a first surface lying on a substrate portion of said direct bonded copper substrate;a heat sink in thermal contact with a second su

[ I claim:] [1.] A packaging for an electronic device comprising:at least one electronic device having a heat generating surface;a direct bonded copper substrate having a first surface lying on a substrate portion of said direct bonded copper substrate;a heat sink in thermal contact with a second surface of said direct bonded copper substrate;a first solder connection directly connecting the first surface of said direct bonded copper substrate and the heat generating surface of said electronic device; anda second solder connection directly connecting the second surface of said direct bonded copper substrate and a first side of said heat sink,wherein the first surface extends beyond an edge of the substrate portion of said direct bonded copper substrate thereby forming a wing which is generally coplanar with the first surface.