초록 ▼

A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the groups from adjacent columns, and a portion of eac

A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the groups from adjacent columns, and a portion of each group overlaps into an adjacent row or an adjacent column of the groups of the array; a semiconductor die; and structure for providing electrical connection between the semiconductor die and the conductive contacts. A semiconductor die carrier may also include an insulative substrate; a plurality of leads each having an external portion extending out of the semiconductor die carrier from a lower surface of the insulative substrate and an internal portion located within the semiconductor die carrier at an upper surface of the insulative substrate; a semiconductor die; and a layer of conductive material in contact with conductive portions of the semiconductor die and also in contact with the internal portions of the leads.

대표청구항 ▼

[ What is claimed is:] [1.] A semiconductor die carrier comprising:a support element adapted for supporting a semiconductor die, said support element having a first surface and a second surface opposite the first surface;a plurality of discrete, insulative buttresses projecting from the second surfa

[ What is claimed is:] [1.] A semiconductor die carrier comprising:a support element adapted for supporting a semiconductor die, said support element having a first surface and a second surface opposite the first surface;a plurality of discrete, insulative buttresses projecting from the second surface;a plurality of groups of electrically conductive leads secured to the support element, each of the leads having a contact section extending from the second surface of the support element, and each of said groups of leads being arranged around the circumference of a different one of said buttresses; andan array of solder balls, each solder ball coupled to an upper portion of one of said electrically conductive leads, for forming at least part of an electrical path between the semiconductor die and the conductive leads.