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Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/10
  • H01L-023/34
  • H01L-023/06
출원번호 US-0778016 (1996-12-31)
발명자 / 주소
  • Paniccia Mario J.
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman LLP
인용정보 피인용 횟수 : 72  인용 특허 : 21

초록 ▼

In one embodiment, the present invention includes a semiconductor device having an infrared transparent heat slug attached to the back side surface of the device. Heat is removed from the semiconductor device through an infrared transparent heat slug that is then thermally cooled by a conventional c

대표청구항 ▼

[ What is claimed is:] [1.] An apparatus comprising:a C4 mounted semiconductor device having a backside surface;an infrared transparent heat slug having a bottom surface and a top surface, said bottom surface being in contact with said backside surface of said semiconductor device; anda heat sink th

이 특허에 인용된 특허 (21)

  1. Hatano Takuji (Sakai JPX) Fukumoto Mariko (Osaka JPX), Antireflection coating for infrared light.
    상세보기
  2. Cordes ; III William F. (East Greenwich RI) Jeffries ; III Alfred T. (Providence RI), Antireflective coatings for use in the manufacture of semi-conductor devices, methods and solutions for making such coat.
    상세보기
  3. Pankove Jacques I. (Boulder CO), Apparatus for semiconductor circuit chip cooling using a diamond layer.
    상세보기
  4. Oktay Sevgin (Poughkeepsie NY) Torgersen Gerard J. (Pawling NY) Wong Alexander C. (Wappingers Falls NY), Bubble generating tunnels for cooling semiconductor devices.
    상세보기
  5. Eaton Ralph M. (Northampton GB2) Geen Michael W. (Northampton GB2), Diamond heatsink assemblies.
    상세보기
  6. Geen Michael W. (Northampton GB2) Eaton Ralph M. (Northampton GB2), Diamond heatsink assemblies.
    상세보기
  7. Chang Leei (Woodstock CT) Masso Jon D. (Whitinsville MA), Glass lens with ion-exchanged antireflection coating and process for manufacture thereof.
    상세보기
  8. Pankove Jacques I. (Boulder CO), Method and apparatus for semiconductor circuit chip cooling.
    상세보기
  9. Chen Zhizhang (Duluth GA) Rohatgi Ajeet (Marietta GA), Method for low temperature plasma enhanced chemical vapor deposition (PECVD) of an oxide and nitride antireflection coat.
    상세보기
  10. Anderson George F. (Cave Creek AZ) Pollock Randy L. (Austin TX), Method for making a semiconductor device with diamond heat dissipation layer.
    상세보기
  11. Pollock Randy L. (Austin TX) Anderson ; Jr. George F. (Cave Creek AZ), Method for making a substrate structure with improved heat dissipation.
    상세보기
  12. Buchmann Peter (Langnau am Albis CHX) Unger Peter (Thalwil CHX) Vettiger Peter (Langnau am Albis CA CHX) Voegeli Otto (Morgan Hill CA), Method for making cooling structures for directly cooling an active layer of a semiconductor chip.
    상세보기
  13. Borodovsky Yan A. (Fremont CA), Method for making integrated circuit devices using a layer of indium arsenide as an antireflective coating.
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  14. Kino Gordon S. (Santa Clara County CA) Mansfield Scott M. (San Mateo County CA), Near field and solid immersion optical microscope.
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  15. Kurokawa Yasuhiro (Tokyo JPX), Package structure for semiconductor device having a flexible wiring circuit member spaced from the package casing.
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  16. Tsuji Ken-ichiro (Kawasaki JPX), Semiconductor device.
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  17. Mamine Takayoshi (Tokyo JA) Matsushita Takeshi (Sagamihara JA), Semiconductor device having an antireflective coating.
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  18. Schneider Mark R. (San Jose CA) Trabucco Robert T. (Los Altos CA), Semiconductor device package fabrication method and apparatus.
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  19. Kessel Stephen L. (Loveland OH) Mont George E. (MA), Solar screening assembly.
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  20. Brady Michael F. (Morrisville PA) Helms ; Jr. Aubrey L. (Pennington NJ), Thin coatings for use in semiconductor integrated circuits and processes as antireflection coatings consisting of tungst.
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  21. Jewell Jack L. (Boulder CO) Quinn William E. (Boulder CO) Swirhun Stan E. (Boulder CO) Bryan Robert P. (Boulder CO), Wafer scale optoelectronic package.
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  4. Canfield, Daniel C.; Harsany, John Joseph; Sauk, Frank; Yost, III, William Joseph, Apparatus for thermal control in the analysis of electronic devices.
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  5. Burtzlaff,Robert; Haba,Belgacem; Humpston,Giles; Tuckerman,David B.; Warner,Michael; Mitchell,Craig S., Back-face and edge interconnects for lidded package.
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  6. Sung,Chien Min, Carbonaceous composite heat spreader and associated methods.
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  9. Sung,Chien Min, Diamond composite heat spreader having thermal conductivity gradients and associated methods.
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  10. Sung,Chien Min, Diamond composite heat spreader having thermal conductivity gradients and associated methods.
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  11. Sung, Chien-Min, Diamond particle mololayer heat spreaders and associated methods.
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  24. Pfaff, Paul L., Holographic condition assessment system for a structure including a semiconductor material.
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  27. Li, Jiping, Melt depth determination using infrared interferometric technique in pulsed laser annealing.
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