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Cold plate for dual refrigeration systems 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-003/12
출원번호 US-0060847 (1998-04-15)
발명자 / 주소
  • Chrysler Gregory M.
  • Chu Richard C.
  • Goth Gary F.
  • Simons Robert E.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Cutter
인용정보 피인용 횟수 : 41  인용 특허 : 17

초록

A cold plate includes two flow-wise isolated coolant (or refrigerant) passages (or sets of passages) for use in conjunction with separate refrigeration systems. The cold plate passages do not permit flow communication between distinct coolant (or refrigerant) paths. This permits two distinct cooling

대표청구항

[ The invention claimed is:] [1.] A cold plate flow-wise isolated dual passages, said cold plate comprising:a central plate having a first set of substantially parallel channels therein extending substantially through said plate from a first side of said central plate, said first set of channels bei

이 특허에 인용된 특허 (17)

  1. Neuenfeldt, Douglas L.; Thielman, David E., Air conditioner having improved structure for cooling electronics.
  2. Baer Daniel B. ; DiPaolo Frank E. ; Sillato Stephen C. ; Dukes David A., Air conditioning for communications stations.
  3. Lndqvist Gsta B. (Johanneshov SEX), Apparatus for cooling telecommunications equipment in a rack.
  4. Leeb Karl-Erik (Djurhamn SEX), Arrangement for cooling electronic equipment by radiation transfer.
  5. Porter Warren W. (Escandido CA), Computer component cooling system with local evaporation of refrigerant.
  6. Morrison Robert A. (Long Beach CA), Cooling system for electronic modules.
  7. Chao-Fan Chu Richard (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Goth Gary F. (Pleasant Valley NY) Simons Robert E. (Poughkeepsie NY) Zumbrunnen Michael L. (Poughkeepsie NY), Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels.
  8. Jean Amigo (No. 18 ; Alley S ; Lane 19 ; Nu-Chung Rd. I-Lan City TWX), Flexible heat transfer device.
  9. Wiard Maxwell R. (Vandalia OH), Heat exchanger with heat transfer control.
  10. Budelman Gerald A. (Aloha OR), High efficiency heat removal system for electric devices and the like.
  11. Rosman Irwin E. (Woodland Hills CA) Wagner William R. (Los Angeles CA), Internally manifolded unibody plate for a plate/fin-type heat exchanger.
  12. Green Peter J. (Huntington WV), Low headroom ventilating apparatus for cooling an electrical enclosure.
  13. Thielman David E. (Hennepin County MN) Welch Dennis E. (Anoka County MN) Bezat Theodore P. (Hennepin County MN), Method and apparatus for electromechanical air conditioning of industrial electronics.
  14. Oya, Junichi; Kashima, Shoichi, Plate-fin-type heat exchanger.
  15. Diggelmann Hans (Neuenegg CHX) Ulrich Bohdan (Kehrsatz CHX), Process and apparatus for dissipating the heat loss of at least one assembly of electrical elements.
  16. Cowans Kenneth W. (Fullerton CA), Refrigeration system and method for very large scale integrated circuits.
  17. Severson Mark H. (Rockford IL) Tinkler Ian (Rockford IL), Two-channel cooling for providing back-up cooling capability.

이 특허를 인용한 특허 (41)

  1. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, Analysis of effect of transient events on temperature in a data center.
  2. Iyengar, Madhusudan K.; Kamath, Vinod; Matteson, Jason A.; Schmidt, Roger R.; Steinke, Mark E., Apparatus and method for facilitating cooling of an electronics system.
  3. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E.; Singh, Prabjit, Apparatus and method for facilitating servicing of a liquid-cooled electronics rack.
  4. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madusudan K.; Simons, Robert E.; Singh, Prabjit, Apparatus and method for facilitating servicing of a liquid-cooled electronics rack.
  5. Manole, Dan M., Compact refrigeration system and power supply unit including dynamic insulation.
  6. Manole,Dan M.; Coffey,Donald L.; Moore,Michael J., Compact refrigeration system for providing multiple levels of cooling.
  7. Campbell, Levi A.; Chu, Richard C.; Colgan, Evan G.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Contaminant separator for a vapor-compression refrigeration apparatus.
  8. Campbell, Levi A.; Chu, Richard C.; Colgan, Evan G.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Contaminant separator for a vapor-compression refrigeration apparatus.
  9. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooled electronics system and method employing air-to-liquid heat exchange and bifurcated air flow.
  10. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooled electronics system employing air-to-liquid heat exchange and bifurcated air flow.
  11. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cooling computer systems.
  12. Rasmussen, Neil; Bean, John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  13. Rasmussen, Neil; Bean, Jr., John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  14. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Cooling system for portable electronic and computer devices.
  15. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Cooling system with auxiliary thermal buffer unit for cooling an electronics module.
  16. Jiang, Lei; Zheng, Dong-Bo; Fu, Meng; Chen, Chun-Chi, Heat dissipation device with U-shaped and S-shaped heat pipes.
  17. Jin, Zhao; Fu, Meng; Chen, Chun-Chi, Heat dissipation device with heat pipes.
  18. Yang, Ping-An; Fu, Meng; Chen, Chun-Chi, Heat dissipation device with multiple heat pipes.
  19. Chrysler Gregory M. ; Chu Richard C., Hybrid cooling system for electronics module.
  20. Loung, Vincent; Saito, Elna; Scott, Jeff W., IDCA for fast cooldown and extended operating time.
  21. Wexler, Peter, In-row air containment and cooling system and method.
  22. Bhargava, Krisna; Goodnough, Mark; Saito, Elna; Kreider, James, Integrated functional and fluidic circuits in Joule-Thompson microcoolers.
  23. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Integrated heat sink system for a closed electronics container.
  24. Campbell, Levi A.; Chu, Richard C.; Colgan, Evan G.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Intra-condenser contaminant extractor for a vapor-compression refrigeration apparatus.
  25. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Liquid-to-air cooling system for portable electronic and computer devices.
  26. Gary F. Goth ; Jody A. Hickey ; Daniel J. Kearney ; Robert Makowicki ; John Loparco, Logic module refrigeration system with condensation control.
  27. Goth, Gary F.; Hickey, Jody A.; Kearney, Daniel J.; Makowicki, Robert; Loparco, John, Logic module refrigeration system with condensation control.
  28. Tutunoglu, Ozan, Method and apparatus for cooling.
  29. Tutunoglu, Ozan; Bean, Jr., John H., Method and apparatus for cooling.
  30. Tutunoglu, Ozan; Lingrey, David James, Method and apparatus for cooling.
  31. Tutunoglu, Ozan; Bean, Jr., John H., Method of operating a cooling system having one or more cooling units.
  32. Manole,Dan M, Modular heating or cooling system.
  33. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  34. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  35. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  36. Lecke, Markus; Wagner, Steffen, Switch cabinet or cover with an air-conditioning unit.
  37. Shrivastava, Saurabh K.; VanGilder, James W., System and method for arranging equipment in a data center.
  38. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, System and method for fluid dynamics prediction with an enhanced potential flow model.
  39. VanGilder, James William, System and method for prediction of temperature values in an electronics system.
  40. Healey, Christopher M.; Zhang, Xuanhang, System and method for sequential placement of cooling resources within data center layouts.
  41. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced air and liquid cooling of an electronic system.
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