초록 ▼

A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer en

A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends that project laterally outwardly and downwardly away from the plane of the substrate for connection to contact pads on a circuit board. The free leads are isolated from pressure applied to the chip on tape assembly after it has been connected to a circuit board by means of a thin self-supporting thermally conductive heat spreader that contacts the side of the die opposite its pads and includes fixed standoff and/or alignment pins that extend through alignment holes in the thin substrate and are in physical contact with a surf ace of the printed circuit board. The arrangement enables transfer of force applied to the heat spreader directly to the circuit board, thereby isolating the die, thin substrate and its fragile free leads from forces applied to the die and/or the heat spreader.

대표청구항 ▼

[ We claim:] [25.] A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising:a base for supporting the package;a plurality of

[ We claim:] [25.] A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising:a base for supporting the package;a plurality of rigid standoff pins extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface, said pins each having a hollow recess at a rear end thereof; anda tray engaging in at least one of said hollow recesses.