초록 ▼

A stackable heat sink assembly is formed by press-fit assembly of two or more identical fin layers. Each fin layer is formed using powdered metallurgy and has a button-like projection extending from its bottom surface and a recess opening in its top surface. The button-like projection and recess ope

A stackable heat sink assembly is formed by press-fit assembly of two or more identical fin layers. Each fin layer is formed using powdered metallurgy and has a button-like projection extending from its bottom surface and a recess opening in its top surface. The button-like projection and recess opening are sized and shaped such that an interference fit is formed when the button-like projection of one fin layer is pressed into the recess of another fin layer. The use of an adaptor to increase or decrease the effective size of the button-like projection of the bottommost fin layer is described. Relieving gases that may be entrapped in the recess during assembly is described. Circular, elliptical and polygonal shapes (outlines) for the fin layers are described.

대표청구항 ▼

[ What is claimed is:] [1.] A self-stackable heatsink structure for semiconductor devices, comprising:a heatsink first fin layer having a button-like projection;a gas relief groove formed in a side wall of said button-like projection; anda heatsink second fin layer having a recess, said button-like

[ What is claimed is:] [1.] A self-stackable heatsink structure for semiconductor devices, comprising:a heatsink first fin layer having a button-like projection;a gas relief groove formed in a side wall of said button-like projection; anda heatsink second fin layer having a recess, said button-like projection and said recess opening are sized and shaped such that a secure mechanical-lock interference fit is formed when said button-like projection is pressed into said recess.