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A method of adhering an electronic component to substrate in which a layer of a preceramic polymer is applied between the electronic component and the substrate to which it is to be adhered followed by heating to convert the preceramic polymer into a ceramic. The method forms a strong bond which is

A method of adhering an electronic component to substrate in which a layer of a preceramic polymer is applied between the electronic component and the substrate to which it is to be adhered followed by heating to convert the preceramic polymer into a ceramic. The method forms a strong bond which is not affected by the environment. The method is valuable for adhering integrated circuit chips to carriers or circuit boards.

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[ That which is claimed is:] [1.] A method of adhering an electronic component to a substrate comprising:providing an integrated circuit chip and a substrate selected from the group consisting of a chip carrier and a circuit board, wherein the integrated circuit chip and substrate each have a surfac

[ That which is claimed is:] [1.] A method of adhering an electronic component to a substrate comprising:providing an integrated circuit chip and a substrate selected from the group consisting of a chip carrier and a circuit board, wherein the integrated circuit chip and substrate each have a surface to be adhered to the other;applying a layer of a composition comprising a hydrogen silsesquioxane resin between the surfaces to be adhered;joining the surfaces to be adhered to form an assembly comprising the integrated circuit chip and the substrate with the hydrogen silsesquioxane resin therebetween; andheating the assembly to a temperature sufficient to convert the hydrogen silsesquioxane resin to a ceramic.