초록 ▼

A spray cooled enclosure and method for obtaining a substantially improved operating environment for at least one electronic component/card located within the enclosure. The spray cooled enclosure includes a closed compartment that isolates the electronic components/cards from the environment. A die

A spray cooled enclosure and method for obtaining a substantially improved operating environment for at least one electronic component/card located within the enclosure. The spray cooled enclosure includes a closed compartment that isolates the electronic components/cards from the environment. A dielectric heat transfer fluid stored within the closed compartment is distributed by a spraying system such that a thin-film layer of the heat transfer fluid is continually formed over a substantial portion of the surfaces of the electronic components/cards resulting in a substantially reduced thermal gradient across the electronic components/cards. Also included is a closed-loop condensing system for condensing the heat transfer fluid vaporized in response to heat transferred from the electronic components/cards to the layer of heat transfer fluid.

대표청구항 ▼

[ What is claimed is:] [1.] A sealed and self-contained system providing a controlled and isolated environment for one or more electronic components, comprising:a closed sealed single compartment housing;a self-contained quantity of heat transfer fluid restricted to the closed single compartment of

[ What is claimed is:] [1.] A sealed and self-contained system providing a controlled and isolated environment for one or more electronic components, comprising:a closed sealed single compartment housing;a self-contained quantity of heat transfer fluid restricted to the closed single compartment of said housing;a spraying system having all components thereof mounted within the closed compartment, said spraying system including one or more spray nozzles for spraying the heat transfer fluid to contact a substantial portion of the surfaces of the one or more electronic components; andmeans for condensing within the closed compartment a portion of the heat transfer fluid vaporized as a result of heat transferred from the one or more electronic components to the heat transfer fluid.