초록 ▼

An arrangement and method for enhancing the cooling capacity of portable personal computers. The power dissipation of portable personal computers (PCs) is increased by conducting heat through a heat pipe arranged in a hinge structure interconnecting a display panel with a bottom keyboard housing, an

An arrangement and method for enhancing the cooling capacity of portable personal computers. The power dissipation of portable personal computers (PCs) is increased by conducting heat through a heat pipe arranged in a hinge structure interconnecting a display panel with a bottom keyboard housing, and conducting the heat into an area at the rear of the display panel.

대표청구항 ▼

[ Having thus described our invention, what we claim as new, and desire to secure by Letters Patent is:] [1.] An arrangement for dissipating heat generated by at least one electronic component of a portable personal computer having a bottom housing for a keyboard and a display panel hingedly connect

[ Having thus described our invention, what we claim as new, and desire to secure by Letters Patent is:] [1.] An arrangement for dissipating heat generated by at least one electronic component of a portable personal computer having a bottom housing for a keyboard and a display panel hingedly connected to a rear edge of said housing, said at least one electronic component being located in said housing, said heat dissipating arrangement comprising a linear hinge structure extending between said housing and said display panel to facilitate pivotable movement between said housing and said display panel, said linear hinge structure consisting of a helically coiled length of tubing forming a heat pipe having windings wound along an axial length constituting the hinge connection between said housing and said display panel, one end of said helically coiled heat pipe being connected to said at least one heat-generating electronic component and an opposite end of said coiled heat pipe being connected to a heat spreader at a rear surface of said display panel for conducting heat from said electronic components to said heat spreader.