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Flexible interpenetrating networks formed by epoxy-cyanate ester compositions via a polyamide 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08G-059/56
출원번호 US-0859792 (1997-05-19)
발명자 / 주소
  • Nguyen Guy P.
  • Edwards Carl
출원인 / 주소
  • Johnson Matthey, Inc.
대리인 / 주소
    Christie, Parker & Hale, LLP
인용정보 피인용 횟수 : 11  인용 특허 : 28

초록 ▼

A resin composition, for use as a die attach adhesive, heat sink attach adhesive, encapsulant or underfill, comprises a resin system, including a mixture of an epoxy resin and a cyanate ester resin, and a polyamide catalyst. The composition is curable in one minute at 200.degree. C. and has a pot li

대표청구항

[ We claim:] [1.] A resin composition comprising:a resin catalyst system including at least one epoxy resin and at least one cyanate ester resin and a catalyst having the formula: [ STR 2 ] wherein m and n are at least 1.

이 특허에 인용된 특허 (28)

  1. Emori Kenji (Sagamihara JPX) Tasaka Yoshihiko (Sagamihara JPX), Anisotropic conductive adhesive film.
    상세보기
  2. Davies John T. (El Sobrante CA) Egbert Stephen J. (Palo Alto CA) Wagar John R. (Bethel Island CA), Apparatus and method for generating steam.
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  3. Marrs Robert C. (Scottsdale AZ) Molnar Ronald J. (Phoenix AZ), Ball grid array integrated circuit package with thermal conductor.
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  4. McGinniss Vincent D. (Sunbury OH) White James L. (Columbus OH) Mikuni Hiroyuki (Sagamihara JPX), Bimodal cured intermixed polymeric networks which are stable at high temperature.
    상세보기
  5. Gaku Morio (Showamachi JPX) Ikeguchi Nobuyuki (Tokyo JPX) Ayano Satoshi (Ninomiya JPX), Curable cyanate ester/acrylic epoxy ester composition.
    상세보기
  6. Ryang Hong-Son (Camarillo CA), Curable resin systems containing cyanate ester functional oxazolinylpolysiloxanes.
    상세보기
  7. Ho Kam W. (Sarnia CAX) Cassola Adrian (Sarnia CAX), Cyanate ester resin composition containing an epoxy/aromatic adduct.
    상세보기
  8. Ikeguchi, Nobuyuki; Osaki, Yasunari; Furuya, Yoshiyuki, Electrically conductive resin composition.
    상세보기
  9. Kitano Shuichi (Sagamihara JPX) Ogata Kiyoshi (Hashimoto JPX) Sato Shinobu (Tokyo JPX), Epoxy-acrylate blend pressure-sensitive thermosetting adhesives.
    상세보기
  10. Gorodisher Ilya (Stillwater MN) Palazzotto Michael C. (Woodbury MN), Epoxy-cyanate ester compositions that form interpenetrating networks via a Bronsted acid.
    상세보기
  11. Shieh Chan-Long (Paradise Valley AZ) Lee Hsing-Chung (Calabasas CA) Holm Paige M. (Phoenix AZ), Light emitting diode display package.
    상세보기
  12. Shimp David A. (Prospect KY) Vanderlip Jeffrey T. (Louisville KY), Low temperature curable dicyanate ester of dihydric phenol composition.
    상세보기
  13. Shimp David A. (Prospect KY) Vanderlip Jeffrey T. (Louisville KY), Low temperature curable dicyanate esters of dihydric phenols.
    상세보기
  14. Shimp David A. (Prospect KY), Metal acetylacetonate/alkylphenol curing catalyst for polycyanate esters of polyhydric phenols.
    상세보기
  15. Shimp David A. (Prospect KY), Metal carboxylate/alkylphenol curing catalyst for polycyanate esters of polyhydric phenols.
    상세보기
  16. Marcott Tony L. (Peoria IL) Branch Matthew G. (Peoria IL) Nippert Andrew H. (Peoria IL) Shively Kirk S. (Peoria IL), Method and apparatus for determining the position of an armature in an electromagnetic actuator.
    상세보기
  17. Nippert Andrew H. (Washington IL), Method and apparatus for determining the position of an armature in an electromagnetic actuator by measuring the driving.
    상세보기
  18. Marcott Tony L. (Plainfield IL) Nippert Andrew H. (Washington IL) Branch Matthew G. (Milwaukee WI), Method and apparatus for determining the position of an armature of an electromagnetic actuator in response to the magni.
    상세보기
  19. Zollo James A. (Plantation FL) Doutre Barbara R. (Plantation FL) Yorio Rudy (Boca Raton FL), Method and assembly for mounting an electronic device having an optically erasable surface.
    상세보기
  20. Higgins ; III Leo M. (Austin TX), Method for forming conductive bumps on a semiconductor device.
    상세보기
  21. Webb Brian (Chandler AZ), Optical fiber assembly for connecting photonic devices to a fiber optic cable.
    상세보기
  22. Shimp David A. (Prospect KY), Polycyanate esters of polyhydric phenols blended with thermoplastic polymers.
    상세보기
  23. Shimp David A. (Prospect KY), Polycyanate esters of polyhydric phenols blended with thermoplastic polymers.
    상세보기
  24. Thompson Kenneth R. (Sunrise FL) Banerj Kingshuk (Plantation FL) da Costa Alves Francisco (Boca Raton FL), Semiconductor device with controlled spread polymeric underfill.
    상세보기
  25. Boyd Jack D. (Westminster CA) Sitt Hermann (Brea CA) Ryang Hong-Son (Camarillo CA) Biermann Theodore F. (Mission Viejo CA), Structures exhibiting improved transmission of ultrahigh frequency electromagnetic radiation and structural materials wh.
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  26. Lin Paul T. (Austin TX) McShane Michael B. (Austin TX), Thermally enhanced semiconductor device having exposed backside and method for making the same.
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  27. Banerji Kingshuk (Plantation) Alves Francisco D. (Boca Raton) Darveaux Robert F. (Coral Springs FL), Vacuum infiltration of underfill material for flip-chip devices.
    상세보기
  28. Wilfong Debra L. (Lake Elmo MN) Drath David J. (St. Paul MN) Palazzotto Michael C. (St. Paul MN) Willett Peggy S. (Stillwater MN) Clark ; III Henry B. (Roseville MN), Vibration damping constructions using acrylate-containing damping materials.
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이 특허를 인용한 특허 (11)

  1. Hans-Georg Mensch DE; Stefan Emmert DE; Detlef Houdeau DE, Chip card module.
    상세보기
  2. Konarski, Mark M.; Szczepaniak, Zbigniew A., Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners.
    상세보기
  3. McCutcheon,Jeffrey W.; Narum,Timothy N.; Soo,Philip P.; Liu,Yaoqi J., Flexible heat sink.
    상세보기
  4. Reeder, W. Jeff; Jiang, Tongbi, METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER.
    상세보기
  5. Reeder, W. Jeff; Jiang, Tongbi, METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER.
    상세보기
  6. W. Jeff Reeder ; Tongbi Jiang, METHODS EMPLOYING HYBRID ADHESIVE MATERIALS TO SECURE COMPONENTS OF SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES TO ONE ANOTHER AND ASSEMBLIES AND PACKAGES INCLUDING COMPONENTS SECURED TO ONE ANOTHER.
    상세보기
  7. Konrad John Joseph ; Papathomas Konstantinos I. ; Welsh John A., Method of controlling the spread of an adhesive on a circuitized organic substrate.
    상세보기
  8. Reeder, W. Jeff; Jiang, Tongbi, Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another.
    상세보기
  9. Reeder,W. Jeff; Jiang,Tongbi, Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components.
    상세보기
  10. Reeder,W. Jeff; Jiang,Tongbi, Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials.
    상세보기
  11. Touichi Sakata JP; Hiroshi Nishizawa JP; Keizo Hirai JP; Kenji Suzuki JP, Thermoresistance adhesive and semiconductor device using the same.
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