초록 ▼

A method of enhancing the passive thermal management of electronic packages, and an electronic package consisting of a vertically-oriented substrate, such as a printed circuit board or the like, a heat-generating electronic module, for example, containing at least one chip which is positioned on a s

A method of enhancing the passive thermal management of electronic packages, and an electronic package consisting of a vertically-oriented substrate, such as a printed circuit board or the like, a heat-generating electronic module, for example, containing at least one chip which is positioned on a substrate, and a cover plate located adjacent to the module at a predetermined spaced relationship therefrom. The cover plate includes at least one opening located adjacent the module at a predetermined location relative thereto so as to ensure a maximum cooling air flow impinging on the module, and which air flow thereafter passes upwardly between the substrate and the cover plate. The cover plate may be equipped with a heat-sink structure, such as fins, for cooling the module, which structure is adapted to project through the opening formed in the cover plate or to lie flush therewith.

대표청구항 ▼

[ Having thus described our invention, what we claim as new, and desire to secure by Letters Patent is:] [1.] An arrangement for the passive thermal management of an electronic package in a personal computer through a natural convective air flow, said electronic package being supported on a generall

[ Having thus described our invention, what we claim as new, and desire to secure by Letters Patent is:] [1.] An arrangement for the passive thermal management of an electronic package in a personal computer through a natural convective air flow, said electronic package being supported on a generally vertical oriented substrate formed by an upstanding surface structure of said computer, said arrangement comprising a cover plate extending parallel spaced with said substrate so as to form a vertical channel having said electronic package positioned therein, an opening being formed in said cover plate in predetermined horizontally and vertically spaced facing relationship with said electronic package, and a heat sink extending through said opening in said cover plate into proximity with said electronic package so as to facilitate a cool air flow to be drawn into said channel and extend about exposed surfaces of said electronic package replacing heated air buoyantly drawn upwardly through said channel from said electronic package.