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Method for fabricating copper-aluminum metallization 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/44
출원번호 US-0786004 (1997-01-21)
발명자 / 주소
  • Dubin Valery
  • Ting Chiu
출원인 / 주소
  • Advanced Micro Devices, Inc.
대리인 / 주소
    Skjerven, Morrill, MacPherson, Franklin & Friel, LLPKwok
인용정보 피인용 횟수 : 287  인용 특허 : 4

초록

A method for fabricating copper-aluminum metallization utilizing the technique of electroless copper deposition is described. The method provides a self-encapsulated copper-aluminum metallization structure.

대표청구항 ▼

[ We claim:] [1.] A method for fabricating copper alloy metallization in a recess defined in a dielectric layer of a substrate, the method comprising the steps of:depositing a diffusion barrier layer on the surfaces of the recess;depositing a copper alloy layer on the diffusion barrier layer; andann

이 특허에 인용된 특허 (4)

  1. Kondo Koji (Chiryu JPX) Amakusa Seiji (Kariya JPX) Murakawa Katuhiko (Toyota JPX) Kojima Katsuaki (Nagoya JPX) Ishida Nobumasa (Chiryu JPX) Ishikawa Junji (Nagoya JPX) Ishikawa Futoshi (Nagoya JPX), Electroless copper plating solution and process for formation of copper film.
    상세보기
  2. Sato Hiroaki,JPX ; Ebe Masayoshi,JPX, Method for producing circuit board, for semiconductor package, having cavity for accommodating semiconductor element.
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  3. Andricacos Panayotis Constantinou ; Comfort James Hartfiel ; Grill Alfred ; Kotecki David Edward ; Patel Vishnubhai Vitthalbhai ; Saenger Katherine Lynn ; Schrott Alejandro Gabriel, Plating of noble metal electrodes for DRAM and FRAM.
    상세보기
  4. Zhao Bin (Austin TX) Vasudev Prahalad K. (Austin TX) Dubin Valery M. (Cupertino CA) Shacham-Diamand Yosef (Ithaca NY) Ting Chiu H. (Saratoga CA), Selective electroless copper deposited interconnect plugs for ULSI applications.
    상세보기

이 특허를 인용한 특허 (287)

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