초록 ▼

A wafer transfer mechanism and method involves inserting a wafer carrying arm into position within a wafer cassette so that a wafer may be detachably coupled to the arm. The arm is moved linearly to position the arm for coupling to the wafer, with the motion being reversed to remove the wafer from t

A wafer transfer mechanism and method involves inserting a wafer carrying arm into position within a wafer cassette so that a wafer may be detachably coupled to the arm. The arm is moved linearly to position the arm for coupling to the wafer, with the motion being reversed to remove the wafer from the cassette. After the arm clears the cassette, the arm may be pivoted about an axis which is transverse to the longitudinal axis of the arm to invert the wafer and deposit it at a destination location, such as onto a conveyor. A vacuum may be used to detachably couple the wafer to the arm with the vacuum being relieved to release the wafer at the destination location. A puff or pulse of air may be used to assist in decoupling the wafer from the arm.

대표청구항 ▼

[ We claim:] [12.] A wafer handling apparatus operable in a three dimensional reference system having orthogonal X, Y and Z axes and wherein the X-Z, X-Y and Y-Z axes lie in orthogonal planes, the wafer handling apparatus comprising:a base;a platform translatable relative to the base along the X axi

[ We claim:] [12.] A wafer handling apparatus operable in a three dimensional reference system having orthogonal X, Y and Z axes and wherein the X-Z, X-Y and Y-Z axes lie in orthogonal planes, the wafer handling apparatus comprising:a base;a platform translatable relative to the base along the X axis between first and second positions;an elongated arm having a distal end portion with a wafer engaging surface and a proximal end portion, the arm having a longitudinal axis and being pivoted to the platform at its proximal end portion such that the arm pivots in the X-Z plane between first and second arm positions, wherein when the arm is in the first arm position the wafer engaging surface is oriented upwardly and when the arm is in the second arm position the wafer engaging surface is oriented downwardly;a wafer coupler operable to selectively couple a wafer to the wafer engaging surface;a platform mover operable to shift the platform between the first and second positions;an arm pivoter operable to pivot the arm between the first and second arm positions; andwherein the platform mover is operable to shift the platform when the arm is in the first arm position, in a first direction along the X axis to the first platform position to thereby position the arm in the first arm position with the wafer engaging surface oriented upwardly beneath a wafer to be transferred, the wafer coupler is operable to selectively couple the wafer to the wafer engaging surface, the platform mover is operable to shift the platform to the second position, the arm pivoter is operable to pivot the arm between the first and second arm positions to thereby position the coupled wafer above the destination, and wherein the wafer coupler releases the wafer to transfer the wafer to the destination.