초록 ▼

A power semiconductor module having a power circuit unit; a metal base for sealing the bottom of the module; an insulation substrate for electrically insulating the metal base from the power circuit unit; external input and output terminals connected to the power circuit unit; a resin case in which

A power semiconductor module having a power circuit unit; a metal base for sealing the bottom of the module; an insulation substrate for electrically insulating the metal base from the power circuit unit; external input and output terminals connected to the power circuit unit; a resin case in which the external input and output terminals are inserted by integral molding; and a resin encapsulant material has been improved substantially in its reliability through provision of a nut integrally molded with the resin case for fastening the external input and output terminals with a screw; a metal base inserted in the resin case by integral molding; and a recess to receive the end of the screw located immediately below the nut, the recess extending without penetrating the resin case, and the metal base extending to an area below the recess.

대표청구항 ▼

[ What is claimed is:] [1.] A power semiconductor module comprising at least a power circuit unit having power semiconductor elements; a resin case; a metal base which seals a bottom portion of the resin case; an insulation substrate which electrically insulates said metal base from said power circu

[ What is claimed is:] [1.] A power semiconductor module comprising at least a power circuit unit having power semiconductor elements; a resin case; a metal base which seals a bottom portion of the resin case; an insulation substrate which electrically insulates said metal base from said power circuit unit; external input and output terminals to be connected to said power circuit unit, said external input and output terminals being inserted by integral molding in the body of said resin case; and resin encapsulant material disposed in said resin case, said power semiconductor module further comprising:a nut for fastening said external input and output terminals with a screw, said nut being molded integral within said resin case; anda recess to receive the end of said screw located immediately below said nut in said resin case, said recess extending without penetrating said resin case,wherein said metal base is inserted within said resin case by integral molding and is arranged to extend to a bottom portion of said recess beneath a part of said resin case, andwherein said external input and output terminals have a portion of a conductor disposed substantially perpendicular relative to said metal base.