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Method and apparatus for cooling integrated circuits using a thermoelectric module 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25B-021/02
  • H01L-035/28
  • F28F-007/00
출원번호 US-0844769 (1997-04-22)
발명자 / 주소
  • Bhatia Rakesh
  • Padilla Robert D.
  • Hermerding
  • II James G.
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Blakely, Sokoloff, Taylor & Zafman
인용정보 피인용 횟수 : 68  인용 특허 : 10

초록

An integrated circuit cooling device in which a thermoelectric module (TEM) is built into a printed circuit board (PCB) so that the TEM converts heat generated by an integrated circuit on the PCB into DC power that is then supplied to a DC--DC regulator to drive a cooling fan. In one embodiment, the

대표청구항

[ What is claimed is:] [1.] An apparatus comprising:a printed circuit board (PCB);a thermoelectric module (TEM) incorporated into the PCB, said TEM to receive heat generated by an integrated circuit (IC) coupled to the TEM and to convert the heat into output DC power; anda cooling fan, at least part

이 특허에 인용된 특허 (10)

  1. Swiatosz Edmund (Maitland FL), Charge coupled device temperature gradient and moisture regulator.
  2. Wu Hong-ping (7 Wei Ying Yu Tong Xuan Wu Men Beijing CNX) Wang Ying-Ru (7 Wei Ying Yu Tong Xuan Wu Men Beijing CNX), Composite semiconductive thermoelectric refrigerating device.
  3. Swiatosz Edmund (Maitland FL), Integrated circuit temperature gradient and moisture regulator.
  4. Mansuria Mohanlal S. (Coral Springs FL) Mosley Joseph M. (Boca Raton FL) Musa Richard D. (Boca Raton FL) Shutler William F. (Wappingers Falls NY) Tuozzolo Vito J. (Boca Raton FL), Integrated thermoelectric cooling.
  5. Miller Joel (14340 Trinidad Rd. San Leandro CA 94577), Laminated thermo element.
  6. Suski Edward D. (Lake Forest CA), Method and apparatus for recovering power from semiconductor circuit using thermoelectric device.
  7. Burward-Hoy Trevor (Cupertino CA), Sub-ambient temperature electronic package.
  8. Horn Stuart B. (Fairfax VA) Nelson Elizabeth H. (Springfield VA), Thermoelectric device utilizing nanoporous material.
  9. Gelb Allan S. (2606 Hollow Bend Mesquite TX 75150) Townsend Peter B. (4204 High Mesa Ct. Arlington TX 76015) Purdy Erika (301 Rita Garland TX 75042), Thermoelectric heat pump.
  10. Cauchy Charles J. (Traverse City MI), Thermoelectric module.

이 특허를 인용한 특허 (68)

  1. Chung, Woo Cheol, Apparatus and method for harvesting energy in an electronic device.
  2. Chung, Woo Cheol, Apparatus and method for harvesting energy in an electronic device.
  3. Brewer,Richard Grant; Upadhya,Girish; Zhou,Peng; McMaster,Mark; Tsao,Paul, Apparatus and method of efficient fluid delivery for cooling a heat producing device.
  4. Kenny,Thomas; McMaster,Mark; Lovette,James, Apparatus and method of forming channels in a heat-exchanging device.
  5. Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Everett, Jr., George Carl, Apparatus for conditioning power and managing thermal energy in an electronic device.
  6. Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Apparatus for conditioning power and managing thermal energy in an electronic device.
  7. Hermerding, II,James G., Automated method and apparatus for processor thermal validation.
  8. Upadhya,Girish; Herms,Richard; Zhou,Peng; Goodson,Kenneth, Channeled flat plate fin heat exchange system, device and method.
  9. Hershberger, Jeffrey Gerard; Hill, Richard F.; Smythe, Robert Michael; Sutsko, Michael G., Circuit assemblies including thermoelectric modules.
  10. Hershberger, Jeffrey Gerard; Hill, Richard F.; Smythe, Robert Michael; Sutsko, Michael G., Circuit assemblies including thermoelectric modules.
  11. Chen, Yin-Ju; Wu, Ming-Hao; Yu, Cheng-Po, Circuit board and method for manufacturing the same.
  12. Chen, Yin-Ju; Wu, Ming-Hao; Yu, Cheng-Po, Circuit board and method for manufacturing the same.
  13. Sauciuc,Ioan; Chrysler,Gregory M.; Mahajan,Ravi V., Computer system having controlled cooling.
  14. Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.
  15. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  16. Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  17. Hermerding,James G., Dynamic cooling of computing systems.
  18. Goenka Lakhi Nandlal, Electrical circuit board and method for making the same.
  19. Lin Hao-Cheng,TWX, Electronic appliance with a thermoelectric heat-dissipating apparatus.
  20. Sun, Yu-Min; Cheng, Chih-Feng; Liao, Chih-Chieh, Electronic device having active heat dissipation.
  21. Ghoshal Uttam Shyamalindu, Enhanced duty cycle design for micro thermoelectromechanical coolers.
  22. Richard Pandolfi, Environmental system for rugged disk drive.
  23. Okamura, Yoshimasa; Kohler, Timothy L., Fabrication of nanoscale thermoelectric devices.
  24. Cheon Kioan, Fanless cooling system for computer.
  25. Dowling, Kevin J., Indication systems and methods.
  26. Dowling,Kevin J., Indication systems and methods.
  27. Tolliver, Eric W., Infrared energy powered cooling apparatus and computer chassis comprising same.
  28. Ouyang, Chien; Gross, Kenny C.; Heydari, Ali, Integrated circuit chip cooling using magnetohydrodynamics and recycled power.
  29. Bhatia,Rakesh, Integrated circuit cooling apparatus and method.
  30. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
  31. Ouyang, Chien; Gross, Kenneth C., Intelligent microchannel cooling.
  32. Hom, James; Choi, Hae-won; Lin, Tien Chih (Eric); Werner, Douglas E.; Chow, Norman; Correa, Adrian; Leong, Brandon; Gopalakrishnan, Sudhakar; Brewer, Richard Grant; McMaster, Mark; Upadhya, Girish, Internal access mechanism for a server rack.
  33. Upadhya,Girish; Kenny,Thomas W.; Zhou,Peng; Munch,Mark; Shook,James Gill; Goodson,Kenneth; Corbin,David, Interwoven manifolds for pressure drop reduction in microchannel heat exchangers.
  34. Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Upadhya, Girish; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  35. Upadhya, Girish; Munch, Mark; Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  36. Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
  37. Upadhya,Girish; Brewer,Richard Grant; McMaster,Mark, Method and apparatus for controlling freezing nucleation and propagation.
  38. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
  39. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,David, Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device.
  40. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
  41. Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.
  42. Kenny,Thomas W.; Shook,James Gill; Zeng,Shulin; Lenehan,Daniel J.; Santiago,Juan; Lovette,James, Micro-fabricated electrokinetic pump with on-frit electrode.
  43. Lovette,James; Zhou,Peng; Shook,James Gill, Multi-level microchannel heat exchangers.
  44. Ouyang, Chien; Gross, Kenneth C., Multichannel cooling system with magnetohydrodynamic pump.
  45. Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
  46. Zhou,Peng; van Der Heide,Dolf; Goodson,Kenneth; Upadhya,Girish, Optimized multiple heat pipe blocks for electronics cooling.
  47. Ryan, John T., Peltier-cooled LED lighting assembly.
  48. Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Power conditioning module.
  49. Suzuki, Takashi, Power generating apparatus and power generating system equipped with such power generating apparatus.
  50. Maeda, Kazuhiko; Horikoshi, Hideto, Power generating mechanism that has a duct, heat pipe, or heat sink to efficiently diffuse heat generated by a heat.
  51. Skotnicki, Thomas; Monfray, Stephane, Process for generating electrical energy in a semiconductor device and the corresponding device.
  52. Pham,Hung M.; Warner,Wayne R., Refrigeration system including thermoelectric module.
  53. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  54. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  55. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  56. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
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  59. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  60. Hannah, Eric C.; Kling, Ralph M., Thermal interface.
  61. Noshadi, Valod, Thermoelectric cooler/heater integrated in printed circuit board.
  62. Ouyang,Chien, Thermoelectric cooling device arrays.
  63. Rossi, Andrea, Thermoelectric generators.
  64. Ghamaty,Saeid; Elsner,Norbert B.; Bass,John C., Thermoelectric module with Si/SiGe and B4C/B9C super-lattice legs.
  65. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Thermoelectric-enhanced heat spreader for heat generating component of an electronic device.
  66. Akei, Masao; Ignatiev, Kirill M; Jayanth, Nagaraj; Pham, Hung M; Caillat, Jean-Luc M, Vapor compression circuit and method including a thermoelectric device.
  67. Akei, Masao; Ignatiev, Kirill; Jayanth, Nagaraj; Pham, Hung M.; Caillat, Jean-Luc M., Vapor compression circuit and method including a thermoelectric device.
  68. Zhou,Peng; Goodson,Kenneth; Suntiago,Juan, Vapor escape microchannel heat exchanger.
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