초록 ▼

An optoelectronic element module is provided, which has improved reliability in cooling performance. This module is comprised of an optoelectronic element, a Peltier unit for cooling the optoelectronic element, and a package encapsulating the optoelectronic element and the Peltier unit. The optoelec

An optoelectronic element module is provided, which has improved reliability in cooling performance. This module is comprised of an optoelectronic element, a Peltier unit for cooling the optoelectronic element, and a package encapsulating the optoelectronic element and the Peltier unit. The optoelectronic element is mounted directly on or indirectly through a supporting member on a first surface of the Peltier unit. A second surface of the Peltier unit is engaged with a mounting surface of the package by an engaging structure while allowing the Peltier unit to shift along the mounting surface of the package. A thermal stress caused by a difference between thermal expansion coefficients of the second surface of the Peltier unit and the mounting surface of the package is relaxed by a positional shift of the Peltier unit along the mounting surface of the package with respect to the package. Preferably, the engaging structure produces a magnetic-field force or elastic force for engagement.

대표청구항 ▼

[ What is claimed is:] [1.] An optoelectronic element module comprising:an optoelectronic element;a Peltier unit for cooling said optoelectronic element; anda package encapsulating said optoelectronic element and said Peltier unit;wherein said optoelectronic element is mounted to a first surface of

[ What is claimed is:] [1.] An optoelectronic element module comprising:an optoelectronic element;a Peltier unit for cooling said optoelectronic element; anda package encapsulating said optoelectronic element and said Peltier unit;wherein said optoelectronic element is mounted to a first surface of said Peltier unit;and wherein a second surface of said Peltier unit is engaged with a mounting surface of said package by a magnetic engaging structure so as to allow said Peltier unit to shift along said mounting surface of said package;and wherein a thermal stress caused by a difference between thermal expansion coefficients of said second surface of said Peltier unit and said mounting surface of said package is relaxed by a positional shift of said Peltier unit along said mounting surface of said package with respect to said package.