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Multi-mode, two-phase cooling module 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0960395 (1997-10-29)
발명자 / 주소
  • Edwards Michael Ray
  • Morris Garron Koch
  • Estes Kurt Arthur
  • Pais Martin
출원인 / 주소
  • Motorola, Inc.
대리인 / 주소
    Creps
인용정보 피인용 횟수 : 38  인용 특허 : 11

초록

A multi-mode, two-phase cooling module (10) comprises a first housing portion (20), a second housing portion (30), and a third housing portion (40). Cooling liquid (22) is held in first housing portion (20), and one or more electronic components (24) are mounted onto an external surface of first hou

대표청구항

[ What is claimed is:] [1.] A multi-mode, two-phase cooling module for electronic components, said multi-mode two-phase cooling module comprising:a first housing portion forming a cavity for holding cooling fluid, said first housing portion sized to have a first electronic component mounted onto an

이 특허에 인용된 특허 (11)

  1. Daikoku Takahiro (Ushiku JPX) Inouye Hiroshi (Ibaraki JPX), Apparatus for cooling heat generating members.
  2. Bell David L. (Winchester GB2), Circuit board installation.
  3. Osakabe Hiroyuki (Chita-gun JPX) Kawaguchi Kiyoshi (Toyota JPX) Suzuki Masahiko (Hoi-gun JPX), Cooling apparatus using boiling and condensing refrigerant.
  4. Albers Walter F. (2626 E. Arizona Biltmore Cir. ; #23 Phoenix AZ 85016) Beckman James R. (Tempe AZ) Myers Frank R. (Mesa AZ), Heat and mass transfer rates by liquid spray impingement.
  5. Decker ; deceased Bert J. (136 Copen Blvd. late of Buffalo NY) Decker ; executrix by Jean S. (136 Copen Blvd. Buffalo NY 14226), Heat pipe-turbine.
  6. Dirne Adrianus Petrus (Eindhoven NL) Asselman George Albert Apolonia (Eindhoven NL) Van Der Herman Henricus Maria (Eindhoven NL), Hot-gas machine comprising a heat transfer device.
  7. Quon William (Alhambra CA) Tanzer Herbert J. (Topanga CA), Liquid jet cold plate for impingement cooling.
  8. Eastman George Y. (Lancaster PA), Mechanically assisted evaporator surface.
  9. Altoz Frank E. (Baltimore MD), Module cooling system.
  10. Ohashi Shigeo (Chiyoda JPX) Kuwabara Heikichi (Minori JPX) Nakajima Tadakatsu (Chiyoda JPX) Nakayama Wataru (Kashiwa JPX) Sato Motohiro (Minori JPX) Kasai Kenichi (Ushiku JPX), Semiconductor cooling apparatus and cooling method thereof.
  11. Anderson William G. (Lancaster PA) Richardson Kevin H. (Lancaster PA) Garner Scott D. (Lititz PA), Vented vapor source.

이 특허를 인용한 특허 (38)

  1. Searls, Damion T.; Dishongh, Terrance J.; Pullen, David, Apparatus and method for passive phase change thermal management.
  2. Searls, Damion T.; Dishongh, Terrance J.; Pullen, David, Apparatus and method for passive phase change thermal management.
  3. Nakamura,Kazuhiro; Shimada,Tetsuya; Watabe,Katsuhiko, Burn-in apparatus.
  4. Nakamura, Kazuhiro; Shimada, Tetsuya; Watabe, Katsuhiko, Cooling apparatus.
  5. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly.
  6. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths.
  7. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Cooling apparatuses with discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled.
  8. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack.
  9. Tilton, Charles L.; Tilton, Donald E., Etched open microchannel spray cooling.
  10. Morrow, Ernest J.; Sellers, Sally M.; Knudsen, Gary D., Evaporative cooling of electrical components.
  11. Shedd, Timothy A.; Lindeman, Brett A., Flexible two-phase cooling system.
  12. Shedd, Timothy A.; Meives, Mark S., Fluid distribution unit for two-phase cooling system.
  13. Semenov, Sergey Y.; Thayer, John Gilbert; Gernert, Nelson J., Heat pipe having a wick with a hybrid profile.
  14. Shedd, Timothy A.; Lindeman, Brett A., Heat sink module.
  15. Kramer, Gary W.; Frankel, Richard S., High flux heat removal system using jet impingement of water at subatmospheric pressure.
  16. Tilton,Charles L; Weir,Thomas D; Knight,Paul A, Hotspot coldplate spray cooling system.
  17. Morris, Terrel L.; Belady, Christian L., Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump.
  18. Pautsch, Gregory W., Method and apparatus for cooling electronic components.
  19. Gregory S. Cole ; Robert P. Scaringe, Method and two-phase spray cooling apparatus.
  20. Searls,Damion T.; Dishongh,Terrance J.; Pullen,David, Method for passive phase change thermal management.
  21. Shedd, Timothy A., Method of absorbing sensible and latent heat with series-connected heat sinks.
  22. Shedd, Timothy A.; Lindeman, Brett A., Method of cooling series-connected heat sink modules.
  23. Shedd, Timothy A., Method of operating a cooling apparatus to provide stable two-phase flow.
  24. Shedd, Timothy A.; Lindeman, Brett A.; Buchanan, Robert A., Microprocessor assembly adapted for fluid cooling.
  25. Chesser, Jason B.; Faneuf, Barrett M.; Montgomery, Stephen W., Modular capillary pumped loop cooling system.
  26. Chesser,Jason B.; Faneuf,Barrett M.; Montgomery,Stephen W., Modular capillary pumped loop cooling system.
  27. Joshi, Shailesh N.; Dede, Ercan M., Power electronics cooling system with two-phase cooler.
  28. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Pump-enhanced, immersion-cooling of electronic compnent(s).
  29. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Pump-enhanced, sub-cooling of immersion-cooling fluid.
  30. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Pump-enhanced, sub-cooling of immersion-cooling fluid.
  31. Shedd, Timothy A.; Lindeman, Brett A., Redundant heat sink module.
  32. Tilton, Charles L.; Tilton, Donald E.; Baddeley, Ryan J.; Cader, Tahir; Wos, George J., Spray cooling system.
  33. Tilton, Charles L.; Miller, Douglas W.; Gustafson, William C.; Beasley, William J.; Turner, Chester L., Spray cooling system for extreme environments.
  34. Pautsch, Gregory W., Spray evaporative cooling system and method.
  35. Bhunia, Avijit; Cai, Qingjun; Chen, Chung-Lung, System for using active and passive cooling for high power thermal management.
  36. Yang, Tai-Her, Temperature equalization apparatus jetting fluid for thermal conduction used in electrical equipment.
  37. Guo, Kun; Chu, Daniel Y.; Patt, Paul; Sadri, Amir; Tong, Roger, Thermal cycler with vapor chamber for rapid temperature changes.
  38. Tilton, Charles L.; Tilton, Donald E., Thermal management system for evaporative spray cooling.
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